輸出貿易管理令別表第一及び外国為替令別表の規定に基づき貨物又は技術を定める省令 - 英語

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Ministerial Order Specifying Goods and Technologies Pursuant to the Provisions of the Appended Table 1 of the Export Trade Control Order and the Appended Table of the Foreign Exchange Order

Order of the Ministry of International Trade and Industry No. 49 of October 14, 1991

This Ministerial Order specifying goods and technologies pursuant to the provisions of the Appended Table 1 of the Export Trade Control Order and the Appended Table of the Foreign Exchange Control Order is enacted as set forth hereinafter, pursuant to the provisions of the Export Trade Control Order (Cabinet Order No. 378, 1949) and the Appended Table of the Foreign Exchange Control Order (Cabinet Order No. 260, 1980).

(Re: Appended Table 1 of the Export Trade Control Order)

Article 1Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 2 of the appended table 1 of the Export Trade Control Order (referred to hereinafter as the "Export Order") fall under any of the following:

(i)nuclear fuel materials or nuclear source materials falling under any of the following:

(a)uranium or uranium compounds;

(b)thorium or thorium compounds;

(c)plutonium or plutonium compounds;

(d)nuclear fuel materials or nuclear source materials including 1 or 2 or more of the goods in (a) through (c);

(ii)nuclear reactors, components or auxiliaries thereof, or power-generating or propulsion equipment specially designed for use in vehicles, vessels, aircraft or space use, or for nuclear reactors for launching space craft;

(iii)deuterium or deuterium compounds with a hydrogen to deuterium atom number ratio exceeding 1/5,000;

(iv)among artificial graphite weighing 1 kilogram or more with a boron content level less than 5/1,000,000 of the total weight and apparent specific gravity exceeding 1.50 at 20 degrees centigrade, those falling under any of the following:

(a)artificial graphite for use in nuclear reactors;

(b)artificial graphite usable in nuclear reactors (excluding those falling under (a));

(v)equipment specially designed for the separation or reprocessing of irradiated nuclear fuel materials or nuclear source materials, or components or controllers thereof;

(vi)equipment for the separation of lithium isotopes, or equipment for the fabrication of nuclear fuel materials;

(vii)equipment for the separation of uranium or plutonium isotopes falling under any of the following, or auxiliaries thereof or components thereof:

(a)equipment utilizing gas diffusion methods;

(b)equipment utilizing centrifuge separation methods;

(c)equipment utilizing nozzle separation methods;

(d)equipment utilizing vortex methods;

(e)equipment utilizing chemical exchange methods;

(f)equipment utilizing laser separation methods;

(g)equipment utilizing plasma methods;

(h)equipment utilizing magnetic separation methods;

(viii)frequency changers or components thereof falling under any of the following:

(a)frequency changers for gas centrifuges that fall under the following 1. and 2. or components thereof:

1.frequency changers with output of 3 or more phases and a frequency of 600 hertz or more;

2.frequency changers capable of controlling output frequency with accuracy less than plus/minus 0.2%;

(b)among frequency changers that can be used for variable or fixed frequency motor driving, those falling under all of the following 1. through 3. (excluding those falling under (a) and those used for industrial machinery or consumer goods that become unable to satisfy, when removed from the relevant machinery or goods, any of the properties specified in the following 1 through 3. due to hardware or software restrictions):

1.frequency changers with output of 3 or more phases capable of yielding output of 40 volt-amperes or more;

2.frequency changers operating with an output frequency of 600 hertz or more;

3.frequency changers capable of controlling output frequency with accuracy less than plus/minus 0.2%;

(ix)nickel powders with an average diameter less than 10 micrometers and a weight-based purity level of 99% or more, or porous metals produced thereof;

(x)equipment used for the production of deuterium or deuterium compounds, or components or auxiliaries thereof that fall under any of the following:

(a)equipment for the production of deuterium or deuterium compounds, (including concentration equipment), or components or auxiliaries thereof;

(b)equipment used for the production of heavy water or components or auxiliaries thereof falling under any of the following (excluding those falling under (a)):

1.shelf plate towers falling under all of the following i. through iii.:

i.towers utilizing fine-grain carbon steel;

ii.towers usable at pressure of 2 megapascals or more;

iii.towers having internal structural elements listed in 2.;

2.internal structural elements of shelf plate towers and that fall under all of the following i. through iii.:

i.internal structural elements with a cross section area of 2.54 square meters or more and divided into 2 or more parts;

ii.internal structural elements designed to propel gases and fluids in contact counter to the current;

iii.internal structural elements utilizing materials corrosion-resistant against hydrogen sulfide;

3.distillation columns used at low temperatures that fall under all of the following i. through iv.:

i.fine-grain stainless steel using steels without hydrogen embrittlement;

ii.distillation columns with an internal diameter 30 centimeters or more and an effective length of 4 meters or more;

iii.distillation columns designed to be usable at -238 degrees centigrade or less;

iv.distillation columns designed to be usable within a pressure range from 0.5 megapascals or more to 5 megapascals or less;

4.among filling materials designed to be usable in a vacuum distillation column, and phosphorus bronze subjected to a process that chemically improves wettability, those that are mesh-shaped;

5.turboexpanders designed to be usable at -238 degrees centigrade or less with a hydrogen emission level of 1,000 kilograms per hour or more;

6.deleted;

7.pumps capable of circulating liquid ammonia containing potassium amide, which fall under all of the following i. through iii.:

i.pumps with a sealed structure;

ii.pumps usable within a pressure range from 1.5 megapascals or more to 60 megapascals or less;

iii.pumps with discharge exceeding 8.5 cubic meters per hour;

(x)-2equipment for the production of uranium trioxide, uranium hexafluoride, uranium dioxide, uranium tetrafluoride, metallic uranium or uranium tetrachloride, falling under any of the following, or auxiliaries or components thereof:

(a)equipment used for the production of uranium trioxide using uranium concentrate as raw materials;

(b)equipment used for the production of uranium hexafluoride using uranium trioxide or uranium tetrafluoride as raw materials;

(c)equipment used for the production of uranium dioxide using uranium trioxide or uranium hexafluoride as raw materials;

(d)equipment used for the production of uranium tetrafluoride using uranium dioxide or uranium hexafluoride as raw materials;

(e)equipment used for the production of metallic uranium using uranium tetrafluoride as raw materials;

(f)equipment used for the production of uranium tetrachloride using uranium dioxide as raw materials;

(x)-3equipment used for the production of plutonium dioxide, plutonium oxalate, plutonium peroxide, plutonium trifluoride, plutonium tetrafluoride or metallic plutonium, or auxiliaries or components thereof;

(xi)flow-forming machines or components thereof that fall under any of the following:

(a)among flow-forming machines capable of being controlled by numerically-controlled coordinate measurement equipment or computer, those with 3 or more rollers;

(b)mandrels designed to be capable of forming cylindrical rotors with an internal diameter exceeding 75 millimeters and less than 400 millimeters;

(xii)deleted;

(xiii)deleted;

(xiv)among machine tools (limited to those capable of processing metals, ceramics and composite materials) to which an electronic controller with 2 or more axes capable of performing contour control can be attached, those falling under any of the following (a) through (d):

(a)machine tools capable of lathe turning that fall under the following 1. and 2. (excluding those falling under 3.):

1.machine tools in which the precision of positioning of the rectilinear axes is 0.006 millimeters or less when measured by the measurement method specified by the International Standards Organization (ISO) (hereinafter referred to as "International Standard") ISO 230-2:1988;

2.machine tools capable of processing items with a diameter exceeding 35 millimeters;

3.bar work lathes materials are inserted from a spindle hole of which for process, and that fall under the following i. and ii.:

i.bar work lathes with the maximum diameter of material to be processed of 42 millimeters or less;

ii.bar work lathes incapable of having a chuck attached;

(b)machine tools capable of milling that fall under any of the following 1. through 3. (excluding those falling under 4.):

1.machine tools in which the precision of positioning of the rectilinear axes is 0.006 millimeters or less when measured by the measurement; method specified by International Standard ISO 230-2:1998

2.machine tools with 2 or more rotational axes capable of controlling contour;

3.machine tools with 5 or more axes capable of controlling contour;

4.milling machines falling under the following i. and ii.:

i.milling machines exhibiting a range of motion in the X-axis direction exceeding 2 meters specified by ISO 841 (numerically-controlled machine tools - axis and motion nomenclature);

ii.milling machines in which the precision of positioning of the X-axis specified by ISO 841 exceeds 0.03 millimeters when measured by the measurement method specified by International Standard ISO 230-2:1998;

(c)machine tools capable of grinding that fall under any of the following 1. through 3. (excluding those falling under 4. or 5.):

1.machine tools in which the precision of positioning of the rectilinear axes is 0.004 millimeters or less when measured by the measurement method specified by International Standard ISO 230-2:1998;

2.machine tools with 2 or more rotational axes capable of controlling contour;

3.machine tools with 5 or more axes capable of controlling contour;

4.a cylindrical exterior grinding machine, a cylindrical interior grinding machine, or a cylindrical interior-exterior grinding machine that falls under the following i. and ii.:

i.a machine designed to grind objects with an external diameter or length of 150 millimeters or less;

ii.a machine possessing only X-axis, Z-axis and C-axis as specified by ISO 841;

5.jig grinding machines that do not fall under the following i. nor ii.:

i.among jig grinding machines possessing Z-axis specified by ISO 841, those the precision of positioning of the Z-axis of which is less than 0.004 millimeters when measured by the measurement method specified by International Standard ISO 230-2:1998;

ii.among jig grinding machines possessing W-axis specified by ISO 841, those the precision of positioning of the W-axis of which is less than 0.004 millimeters when measured by the measurement method specified by International Standard ISO 230-2:1998;

(d)machine tools capable of performing electrical discharge machining (excluding wire electrical discharge machining), with 2 or more rotational axes capable of contour control;

(e)machine tools designed only for the production of any of the following:

1.gears;

2.crank shafts or cam shafts;

3.tools or blades;

4.extruder worms;

(xv)deleted;

(xvi)deleted;

(xvii)measurement equipment (including machine tools with a measurement function) that falls under any of the following:

(a)measurement equipment controlled by computers or numerically-controlled coordinate measurement equipment, which falls under any of the following:

1.measurement equipment with 2 or more measurement axes that possesses measurement axes for which, when the precision of measurement of intervals is measured using a method specified by an international standard for any of the points of measurement within the limits of operation, the numerical value of the maximum permissible error for measuring length, expressed in micrometers, is less than the numerical value of the length of the measurement axis, expressed in millimeters, multiplied by 0.001 and a value of 1.25 added;

2.measurement equipment with 3 or more measurement axes that possesses measurement axes for which, when the precision of measurement of intervals is measured using a method specified by an international standard for any of the points of measurement within the limits of operation, the numerical value of the maximum permissible error for measuring length, expressed in micrometers, is less than the numerical value of the length of the measurement axis, expressed in millimeters, multiplied by 0.00125 and a value of 1.7 added;

(b)measurement equipment measuring displacement along a straight line that falls under any of the following:

1.non-contact type measurement systems with a resolution of 0.2 micrometers or less within a measurement range up to 0.2 millimeters;

2.measurement systems using linear variable differential transformers (LVDT) that fall under the following i. and ii.:

i.systems with a linear variable differential transformer (LVDT) that falls under any of the following:

a.an LVDT with the maximum operating range of plus/minus 5 millimeters or less and a linearity of 0.1% or less from zero to the maximum operating range;

b.an LVDT with the maximum operating range of more than plus/minus 5 millimeters and a linearity of 0.1% or less from zero to plus/minus 5 millimeters;

ii.systems exhibiting a drift of 0.1% per 24 hours or less when measured within a temperature range of 19 degrees centigrade or more and 21 degrees centigrade or less;

3.measurement equipment falling under the following i. and ii (excluding interferometers which have no feedback function and with which slide movement errors of machine tools, measurement equipment or those similar thereto are measured by using lasers):

i.measurement equipment capable of measuring using a laser beam;

ii.measurement equipment capable of maintaining the properties in the following a. and b. for 12 hours within a temperature range of 19 degrees centigrade or more and 21 degrees centigrade or less:

a.measurement equipment with a resolution of 0.1 micrometers or less within the largest measurement range over which measurement is capable of being performed;

b.measurement equipment possessing a numerical value of measurement uncertainty for the measurement axis, expressed in micrometers, less than the value obtained by multiplying the length of that measurement axis, expressed in millimeters, by 0.0005, and then adding 0.2 thereto, when compensated for by the refractive index of air at any single point within the measurement range;

(c)measurement equipment that measures angular displacement, and with a maximum angular location deviation of 0.00025 degrees or less (excluding optical instruments that measure angular displacement using parallel light beams);

(d)measurement equipment capable of simultaneously measuring the length and angle of objects having curved shapes and that fall under the following 1. and 2.:

1.measurement equipment with a numerical value for the measurement uncertainty for measurement axes of 3.5 micrometers or less per 5 millimeters of measurement distance;

2.measurement equipment with a maximum angular position deviation of 0.02 degrees or less;

(xviii)induction furnaces, arc furnaces or plasma melting furnaces or electron-beam melting furnaces or auxiliaries thereof that fall under any of the following:

(a)vacuum induction furnaces or induction furnaces utilizing non-volatile gases (excluding those used for process of semiconductor wafers) and that fall under all of the following 1. through 3., or power units thereof with output of 5 kilowatts or more:

1.furnaces capable of heating the interior thereof exceeding 850 degrees centigrade;

2.furnaces having an induction coil with a diameter of 600 millimeters or less;

3.furnaces with input from the power units of 5 kilowatts or more;

(b)among arc furnaces that melt and cast metals in a vacuum or under non-volatile gases, those possessing consumable electrodes with a capacity exceeding 1,000 cubic centimeters and less than 20,000 cubic centimeters, and capable of melting metals at in excess of 1,700 degrees centigrade or controllers or monitor equipment for the arc furnaces and that utilize computers;

(c)among plasma melting furnaces or electron-beam melting furnaces with an output of 50 kilowatts or more that melt and cast metal in a vacuum or within non-volatile gases, those capable of melting metals at in excess of 1,200 degrees centigrade, and controllers or monitor equipment for the melting furnaces that utilize computers;

(xix)isostatic presses falling under the following (a) and (b) or controllers thereof or molds designed to be capable of use with isostatic presses:

(a)isostatic presses with a maximum pressure of 69 megapascals or more;

(b)isostatic presses with hollow cavities possessing an internal diameter which exceeds 152 millimeters;

(xx)robots (excluding operating robots and sequence robots) or end effectors that fall under any of the following, or controllers thereof:

(a)explosion-proof robots or end effectors as specified by Japan Industrial Standard C6007910 (Electric machine and appliances used in explosive atmospheres Part 0: General requirements) based on the Industrial Standardization Act (Act No. 185, 1949) (hereinafter referred to as "Japan Industrial Standard") (excluding those used for painting);

(b)robots or end effectors designed to be able to withstand irradiation with total absorption line volume exceeding 50,000 grays on a silicon conversion basis;

(xxi)vibration test equipment or components thereof that fall under any of the following:

(a)vibration test equipment digitally controlled and electrically powered that fall under the following 1. and 2.:

1.equipment with an excitation force of 50 kilonewtons or more in a state with no test object present, and capable of generating vibrations with an acceleration effective value of 98 meters per second squared or more, in a frequency range from exceeding 20 hertz and less than 2,000 hertz;

2.equipment utilizing feedback control technology or closed-loop control technology;

(b)components of vibration test equipment and that fall under any of the following:

1.components designed for use in control of vibration test equipment falling under (a), using programs for a vibration test, and performing digital control of vibration tests in real time in bandwidth exceeding 5 kilohertz;

2.vibration generators usable for vibration test equipment falling under (a), with an excitation force of 50 kilonewtons or more in a state with no test object present;

3.parts of vibration tables or vibration generators capable of use for vibration test equipment falling under (a) and designed for use by connecting 2 or more vibration generators in order to generate vibrations with exciting force of 50 kilonewtons or more in a state with no test object present;

(xxii)structural materials capable of use for gas centrifuge rotors that fall under any of the following:

(a)among aluminum alloys (including forged alloy) with a tensile strength of 460 megapascals or more at 20 degrees centigrade, those with a shaft-like or cylindrical shape and an external diameter exceeding 75 millimeters;

(b)carbon fibers, aramid fibers or glass fibers, or prepreg made from carbon fibers or glass fibers, or molded products made with carbon fibers or aramid fibers, falling under any of the following:

1.carbon fibers or aramid fibers that fall under any of the following:

i.fibers with a specific elastic modulus of 12,700,000 meters or more;

ii.fibers with a specific strength of 235,000 meters or more;

2.glass fibers falling under the following i. and ii.:

i.glass fibers with a specific elastic modulus of 3,180,000 meters or more;

ii.glass fibers with a specific strength of 76,200 meters or more;

3.prepreg consisting of carbon fibers or glass fibers falling under 1. or 2. and impregnated with thermosetting resin that falls under any of the following:

i.fibrous prepreg;

ii.tape-shaped prepreg with a width of 15 millimeters or less;

4.cylindrical formed goods utilizing fibers falling under 1. or prepreg falling under 3. (limited to goods utilizing carbon fiber) with an internal diameter exceeding 75 millimeters and less than 400 millimeters;

(c)among maraging steels with a tensile strength of 1,950 megapascals or more at 20 degrees centigrade, those with the greatest value of dimensions exceeding 75 millimeters;

(d)among titanium alloys (including forged alloys) with a tensile strength of 900 megapascals or more at 20 degrees centigrade, those with a shaft-like or cylindrical shape and an external diameter exceeding 75 millimeters;

(xxiii)metals, waste, or scrap of beryllium and beryllium alloys (limited to those with a beryllium content exceeding 50% of the total weight) or beryllium compounds, or primary or semi-finished products thereof;

(xxiv)substances used as alpha sources for the detonation of nuclear weapons, or raw materials thereof that fall under any of the following:

(a)bismuth with a weight-based purity level of 99.99% or more and a silver content less than 0.001% of the total weight;

(b)radium 226, radium 226 alloys, radium 226 compounds or radium 226 mixtures, or primary or semi-finished products thereof (excluding those incorporated into and installed in medical devices, where the total radioactivity per device is less than 0.37 gigabecquerels);

(c)radionuclide suitable for alpha-neutron reaction to generate neutron sources, or compounds or mixtures thereof (excluding those installed in equipment, for which the total radiation per device is less than 3.7 gigabecquerels), and with total radiation per kilogram of 37 gigabecquerels or more;

(xxv)boron, boron compounds or boron mixtures, or primary or semi-finished products thereof, comprised of concentrated boron with a boron 10 to boron 10 and boron 11 ratio greater than the ratio in nature, or anything containing such boron;

(xxvi)substances used as reducing or oxidizing agents for the production of nuclear fuel materials and that fall under any of the following:

(a)calcium falling under the following 1. and 2.:

1.calcium with a content ratio of metals other than calcium or magnesium less than 0.1% of the total weight;

2.calcium with a boron content ratio less than 0.001% of the total weight;

(b)chlorotrifluorine;

(c)magnesium falling under the following 1. and 2.:

1.magnesium with a content ratio of metals other than magnesium or calcium less than 0.02% of the total weight;

2.magnesium with a boron content ratio less than 0.001% of the total weight;

(xxvii)crucibles made with materials corrosion-resistant against actinide that fall under any of the following:

(a)crucibles with a capacity exceeding 0.15 liters and less than 8 liters, made from or coated with any of the following, or a combination thereof (limited to those with a ratio of the total weight of impurities to the total weight of the relevant crucible of 2% or less):

1.calcium fluoride;

2.calcium metazirconate;

3.cerium sulfide;

4.erbium oxide;

5.hafnium oxide;

6.magnesium oxide;

7.nitride of alloys containing niobium, titanium and tungsten;

8.yttrium oxide;

9.zirconium oxide;

(b)crucibles with a capacity exceeding 0.05 liters and less than 2 liters, made from or lined with tantalum with a weight-based purity level of 99.9% or more;

(c)among crucibles with a capacity exceeding 0.05 liters and less than 2 liters, made from or lined with tantalum with a weight-based purity level of 98% or more, those that are coated with tantalum carbide, tantalum nitride, tantalum boride, or a combination thereof;

(xxviii)metals, waste, or scrap of hafnium and hafnium alloys (limited to those with a hafnium content exceeding 60% of the total weight) or hafnium compounds (limited to those with hafnium content level exceeding 60% of the total weight), or primary or semi-finished products thereof;

(xxix)metals, waste or scraps of lithium or lithium alloys or lithium compounds or mixtures, or primary or semi-finished products thereof, comprising concentrated lithium with a lithium 6 to lithium 6 and lithium 7 ratio greater than the ratio in nature, or containing the lithium (excluding lithium compounds and lithium mixtures incorporated into thermo-luminescence dosimeters);

(xxx)tungsten, tungsten carbide, or alloys with a tungsten content exceeding 90% of the total weight, weighing in excess of 20 kilograms, with a cylindrical shape and internal diameter exceeding 100 millimeters and less than 300 millimeters, or with a hollow hemispherical shape, and combinations of both shapes (excluding those designed for use in dead weight or gamma ray collimators);

(xxxi)metals, waste, or scraps of zirconium or zirconium alloys (limited to alloys with a zirconium content exceeding 50% of the total weight), or zirconium compounds (limited to those with a hafnium content level less than 1/500 the zirconium content level), and primary or semi-finished products thereof (excluding leaf with a thickness 0.1 millimeters or less);

(xxxii)electrolytic cells for fluorine production with a production capability exceeding 250 grams per hour;

(xxxiii)equipment for the production or assembly of gas centrifuge rotors, or components thereof, which fall under any of the following:

(a)equipment used for assembly gas centrifuge rotor tubes, baffle and end caps;

(b)equipment used to adjust the center axis of gas centrifuge separator rotor tubes;

(c)mandrels or molds used for manufacture of bellows (limited to those made from aluminum alloys, maraging steel, or fiber-reinforced composite materials) falling under the following all of 1. through 3.:

1.mandrels or molds with an internal diameter exceeding 75 millimeters and less than 400 millimeters;

2.mandrels or molds with a groove pitch of 12.7 millimeters or more;

3.mandrels or molds with a groove depth exceeding 2 millimeters;

(xxxiv)centrifugal balancing machines (excluding balancing machines that can measure unbalance on one plane) that fall under any of the following (excluding those falling under Article 3, item (xvii)-3, (b)):

(a)centrifugal balancing machines designed to be capable of testing elastic rotors with a length of 600 millimeters or more that fall under all of the following 1. through 3.:

1.centrifugal balancing machines capable of testing elastic rotors with an external diameter exceeding 75 millimeters, or with a journal diameter of 75 millimeters or more;

2.centrifugal balancing machines capable of testing elastic rotors with a weight of 0.9 kilograms or more and 23 kilograms or less;

3.centrifugal balancing machines capable of testing at 5,000 rounds per minute or more;

(b)centrifugal balancing machines designed to be capable of testing cylindrical rotors, and that fall under all of the following 1. through 4.:

1.machines with a journal diameter exceeding 75 millimeters;

2.machines capable of testing rotors of 0.9 kilograms or more and 23 kilograms or less;

3.machines with a residual imbalance on the balancing plane of 0.01 kilograms millimeters or less per 1 kilogram;

4.machines with a belt drive mechanism;

(xxxv)filament winding machines falling under the following (a) and (b), or controllers thereof or mandrels:

(a)among machines that perform positioning on filaments and carry out wrapping and winding operations, those with 2 or more axes capable of controlling both these operations in coordination;

(b)machines capable of manufacturing cylindrical tubes with an internal diameter exceeding 75 millimeters and less than 650 millimeters and a length of 300 millimeters or more;

(xxxvi)gas laser oscillators, solid-state laser oscillators or dye laser oscillators that fall under any of the following:

(a)metal vapor laser oscillators (limited to copper laser oscillators) designed for use within a wavelength range exceeding 500 nanometers and less than 600 nanometers, with an average output of 30 watts or more;

(b)argon ion laser oscillators designed for use within a wavelength range exceeding 400 nanometers and less than 515 nanometers, with an average output exceeding 40 watts;

(c)among carbon dioxide laser oscillators designed for use within a wavelength range exceeding 9,000 nanometers and less than 11,000 nanometers, designed to generate a pulse, those falling under all of the following 1. through 3.:

1.oscillators with a pulse repetition frequency exceeding 250 hertz;

2.oscillators with an average output exceeding 500 watts;

3.oscillators with a pulse width of 200 nanoseconds or less;

(d)among excimer laser oscillators designed for use within a wavelength range exceeding 240 nanometers and less than 360 nanometers, and designed to generate a pulse, those falling under the following 1. and 2.:

1.oscillators with a pulse repetition frequency exceeding 250 hertz;

2.oscillators with an average output exceeding 500 watts;

(e)raman laser oscillators utilizing parahydrogen and designed for use at a wavelength of 16 micrometers, with a pulse repetition frequency exceeding 250 hertz;

(f)alexandrite laser oscillators designed for use within a wavelength range exceeding 720 nanometers and less than 800 nanometers that fall under all of the following 1. through 3.:

1.oscillators with a pulse repetition frequency exceeding 125 hertz;

2.oscillators with an average output exceeding 30 watts;

3.oscillators with a laser beam spectral line width of 0.005 nanometers or less;

(g)fixed laser oscillators with neodymium added, designed for use within a wavelength range exceeding 1,000 nanometers and less than 1,100 nanometers that fall under any of the following (excluding neodymium glass laser oscillators):

1.among oscillators utilizing pulse excitation and a Q-switch and emitting a pulse with a pulse width of 1 nanosecond or more, those falling under any of the following:

i.oscillators emitting a single-transverse-mode pulse, and with an average output exceeding 40 watts;

ii.oscillators emitting a multi-transverse-mode pulse, and with an average output exceeding 50W;

2.oscillators designed to generate a second harmonic within the frequency range exceeding 500 nanometers and less than 550 nanometers, and with an average output exceeding 40 watts;

(h)dye laser oscillators designed for use within a wavelength range exceeding 300 nanometers and less than 800 nanometers that fall under any of the following:

1.variable wavelength laser oscillators emitting a single-mode pulse (excluding equipment that only performs laser beam amplification) that fall under all of the following i. through iii.:

i.oscillators with a pulse repetition frequency exceeding 1 kilohertz;

ii.oscillators with an average output exceeding 1 watt;

iii.oscillators with a pulse width less than 100 nanoseconds;

2.variable wavelength oscillator emitting a pulse that fall under all of the following i. through iii. (excluding those falling under 1.):

i.oscillators with a pulse repetition frequency exceeding 1 kilohertz;

ii.oscillators with an average output exceeding 30 watts;

iii.oscillators with a pulse width less than 100 nanoseconds;

(i)among carbon monoxide laser oscillators designed for use within a wavelength range exceeding 5,000 nanometers and less than 6,000 nanometers, designed to generate a pulse, those falling under all of the following 1. through 3.:

1.oscillators with a pulse repetition frequency exceeding 250 hertz;

2.oscillators with an average output exceeding 200 watts;

3.oscillators with a pulse width of 200 nanoseconds or less;

(xxxvii)among mass spectrometers, capable of measuring ions with a mass of 230 or more expressed in atomic weight units, and capable of differentiating ions with an atomic weight difference less than 2, those falling under any of the following (a) through (e) (excluding those falling under (f)) or ion sources usable with the mass spectrometers:

(a)mass spectrometers utilizing inductively-coupled plasma;

(b)mass spectrometers utilizing glow discharge;

(c)mass spectrometers utilizing thermal ionization;

(d)among mass spectrometers possessing an ion source that ionizes by bombarding the materials under analysis with electrons, those which fall under the following 1. and 2.:

1.mass spectrometers with equipment that delivers parallel beams of molecules of the materials under analysis to the area of an ion source where molecules ionize using electron beams;

2.mass spectrometers with one or more cold traps capable of attaining temperatures at -80 degrees centigrade or less to capture molecules that do not ionize using electron beams in parallel beams of molecules of the materials under analysis;

(e)mass spectrometers possessing an ion source designed for ionization of actinides or fluorides thereof;

(f)mass spectrometers that fall under all of the following 1. through 5.:

1.mass spectrometers capable of measuring ions with a mass of 320 or more, expressed in atomic weight units, which have a resolution of more than 320, expressed in atomic weight units;

2.mass spectrometers possessing an ion source made from, or protected with, nickel, nickel copper alloys with a nickel content of 60% or more of the total weight, or nickel chrome alloys;

3.mass spectrometers possessing an ion source that ionizes by bombarding the materials under analysis with electrons;

4.mass spectrometers possessing a collector usable for isotope analysis;

5.mass spectrometers capable of taking samples without stopping the flow of uranium hexafluoride gas;

(xxxviii)pressure gauges or bellows valves that fall under any of the following:

(a)pressure gauges capable of measuring absolute pressure that fall under all of the following 1. through 3. (excluding 2. for those using no seal to cover up sensors tight):

1.pressure gauges utilizing a sensor made from, or protected with, aluminum, aluminum alloys, aluminum oxide, nickel, nickel alloys with a nickel content exceeding 60% of the total weight, or fluorinated hydrocarbon polymers;

2.pressure gauges indispensable to cover up sensors tight and coming into direct contact with the contents which utilize a seal made from, or protected with, aluminum, aluminum alloys, aluminum oxide, nickel, nickel alloys with a nickel content exceeding 60% of the total weight, or fluorinated hydrocarbon polymers;

3.pressure gauges that fall under any of the following:

i.when the full scale is less than 13 kilopascals, pressure gauges with a precision of less than plus/minus 1% of the full scale, in any full scale;

ii.when the full scale is 13 kilopascals or more, pressure gauges with a precision of less than plus/minus 130 kilopascals at 13 kilopascals;

(b)among bellows valves with a nominal diameter of 5A or more, those for which all portions that come into contact with the contents comprising, lined with, or coated with aluminum, aluminum alloys, nickel, or nickel alloys (limited to those with a nickel content exceeding 60% of the total weight);

(xxxix)superconducting solenoid electromagnets that fall under all of the following (a) through (d) (excluding those designed for use of clinical magnetic resonance equipment):

(a)superconducting solenoid electromagnets with magnetic flux density exceeding 2 teslas;

(b)superconducting solenoid electromagnets, the coil length of which divided by an internal diameter exceeds 2;

(c)superconducting solenoid electromagnets with a coil internal diameter exceeding 300 millimeters;

(d)a circle with the radius of 35% of the internal diameter, centered on the center of the coil axis, and with a magnetic field homogeneity less than 1% within the range of those perpendicular to the coil axis;

(xl)among vacuum pumps with an intake internal diameter of 38 centimeters or more, those with an exhaust speed of 15,000 liters or more per second and an ultimate pressure less than 13.3 millipascals;

(xl)-2among scroll-type compressors or vacuum pumps that use bellows seals, those falling under all of the following (a) through (c):

(a)those with a capacity of air-intake of 50 cubic meters per hour or more;

(b)those with a capacity of pressure ratio of 2 or more;

(c)those in which all surfaces that come into contact with the contents which are composed of, lined with, or coated with any of the following materials:

1.aluminum or aluminum alloys;

2.aluminum oxide;

3.stainless steel;

4.nickel or nickel alloys;

5.phosphorus bronze;

6.fluoropolymers;

(xli)direct current power units falling under any of the following:

(a)among direct current power units with an output current of 500 amperes or more, those with a current or voltage fluctuation rate less than 0.1%, and capable of use for exceeding 8 consecutive hours under an output voltage of 100 volts or more;

(b)among direct current power units with an output voltage of 20,000 volts or more, those with a current or voltage fluctuation rate less than 0.1%, and capable of use for exceeding 8 consecutive hours with an output current of 1 ampere or more;

(xlii)electron accelerators or flash X-ray generators falling under any of the following (excluding electron microscope components and medical equipment):

(a)electron accelerators or flash X-ray generators with a peak value for electron kinetic energy of 0.5 megaelectron volts or more and less than 25 megaelectron volts, and that fall under any of the following:

1.electron accelerators or flash X-ray generators with a beam pulse duration of 1 microsecond or less, and with a value of 0.25 or more when 1,700 is multiplied by the result of multiplying the peak value of electron kinetic energy expressed in megaelectron volts raised to the 2.65 power by the total charge quantity of accelerated electrons, expressed in coulombs;

2.electron accelerators or flash X-ray generators with a beam pulse duration exceeding 1 microsecond, and having a value of 0.25 or more when 1,700 is multiplied by the result of multiplying the peak value of electron kinetic energy expressed in megaelectron volts raised to the 2.65 power is multiplied by the maximum charge quantity of electrons accelerated for 1 microsecond, expressed in coulombs;

(b)electron accelerators or flash X-ray generators with a peak electron kinetic energy of 25 megaelectron volts or more and a peak output exceeding 50 megawatts;

(xliii)impact testing machines capable of supporting a maximum projectiles velocity of 1.5 kilometers per second or more;

(xliv)high speed cameras or components thereof that fall under any of the following:

(a)streak cameras or components thereof that fall under any of the following:

1.streak cameras with a photographing speed exceeding 0.5 millimeters per microsecond;

2.electronic streak cameras with a time resolution of 50 nanoseconds or less;

3.streak tubes for cameras that fall under 2.;

4.plugging units designed to be used in streak cameras having a module type structure which need to attain or exceed the functions or characteristics of the goods that fall under 1. or 2.;

5.assemblies of rotating reflectors composed of turbines, reflectors, and bearings, or synchronizing electronic equipment designed for cameras that fall under 1.;

(b)framing cameras or components thereof and that fall under any of the following:

1.framing cameras with a photographing speed exceeding 225,000 frames per second;

2.framing cameras with a shutter speed of 50 nanoseconds or less;

3.framing tubes or solid-state image sensors designed for cameras falling under 1 or 2. and with a shutter speed less than 50 nanoseconds;

4.plugging units designed for use in framing cameras having a module type structure which need to attain or exceed the functions or characteristics of the goods that fall under 1. or 2.;

5.assemblies of rotating reflectors composed of turbines, reflectors, and bearings, or synchronizing electronic equipment designed for cameras that fall under 1. or 2.;

(c)solid-state or electron tube cameras, or components thereof that fall under any of the following excluding those falling under (a) or (b)):

1.solid-state or electron tube cameras with a shutter speed of 50 nanoseconds or less;

2.solid-state image sensors or image intensifier tubes designed for cameras falling under 1. with a shutter speed of 50 nanoseconds or less;

3.electrically triggered shutters utilizing Kerr cells or Pockel cells with a shutter speed of 50 nanoseconds or less;

4.plugging units designed to be used in cameras having a module type structure which need to attain or exceed the functions or characteristics of the goods that fall under 1.;

(xlv)interferometers for measuring fluid velocities or pressure gauges capable of measuring fluid pressure, or quartz pressure transducers that fall under any of the following:

(a)interferometers for measuring fluid speeds falling under the following 1. and 2.:

1.interferometers capable of measuring speeds exceeding 1 kilometer per second;

2.interferometers capable of measuring speeds at intervals less than 10 microseconds;

(b)pressure gauges capable of measuring pressures exceeding 10 gigapascals;

(c)quartz pressure transducers capable of measuring pressures exceeding 10 gigapascals;

(xlvi)cold-cathode tubes having 3 or more electrodes and that fall under all of the following (a) through (c):

(a)cold-cathode tubes with a peak anode voltage of 2,500 volts or more;

(b)cold-cathode tubes with a peak anode current of 100 amperes or more;

(c)cold-cathode tubes with an anode delay time of 10 microseconds or less;

(xlvii)among trigger spark gaps with a cathode delay time of 15 microseconds or less, those with a peak current of 500 amperes or more;

(xlviii)assemblies having switching capabilities that fall under all of the following (a) through (c):

(a)assemblies with a peak anode voltage exceeding 2,000 volts;

(b)assemblies with a peak anode current of 500 amperes or more;

(c)assemblies with a turn-on time of 1 microsecond or less;

(xlix)pulse condensers falling under any of the following:

(a)pulse condensers possessing a rated voltage exceeding 1,400 volts that fall under all of the following 1. through 3.:

1.pulse condensers with a total energy exceeding 10 joules;

2.pulse condensers with a nominal capacitance exceeding 0.5 microfarads;

3.pulse condensers with series inductance less than 50 nanohenries;

(b)pulse condensers with a rated voltage exceeding 750 volts, and that fall under the following 1. and 2.:

1.pulse condensers with a nominal capacitance exceeding 0.25 microfarads;

2.pulse condensers with series inductance less than 10 nanohenries;

(l)pulse generators or xenon flashlamp drivers that fall under any of the following:

(a)modular pulse generators or xenon flashlamp drivers that fall under all of the following:

1.modular pulse generators or xenon flashlamp drivers capable of supplying a pulse for less than 15 microseconds against a resistance load less than 40 ohms;

2.modular pulse generators or xenon flashlamp drivers with an output exceeding 100 amperes;

3.modular pulse generators or xenon flashlamp drivers having a largest dimensional value of 30 centimeters or less;

4.modular pulse generators or xenon flashlamp drivers with a weight less than 30 kilograms;

5.modular pulse generators or xenon flashlamp drivers designed to be usable from below -50 degrees centigrade to over 100 degrees centigrade, or designed to be usable for space use;

(b)pulse generators or pulse heads generating pulses with voltage exceeding 6 volts against a resistance load less than 55 ohms, and requiring a pulse rise time less than 500 picoseconds (excluding those falling under (a));

(li)components of detonators that fall under all of the following:

(a)components of detonators capable of controlling the ignition of explosives through electric signals;

(b)components of detonators that have the stripline structure;

(c)components of detonators with a rated voltage exceeding 2 kilovolts;

(d)components of detonators with an inductance path of less than 20 nanohenries;

(lii)among photomultiplier tubes with photocathode area exceeding 20 square centimeters, those with an anode pulse rise time less than 1 nanosecond;

(liii)neutron generators utilizing electrostatic acceleration to induce a tritium-deuterium or deuterium-deuterium nuclear reaction that fall under any of the following:

(a)neutron generators utilizing electrostatic acceleration to induce a tritium-deuterium nuclear reaction designed to be operable without using a vacuum pump;

(b)among neutron generators utilizing electrostatic acceleration to induce a deuterium-deuterium nuclear reaction that are capable of producing 3 Giga neutrons or more per second, those designed to be operable without using a vacuum pump;

(liv)remote manipulators used in the prevention of radioactive exposure, and operable behind a radiation shielding wall with a thickness of 0.6 meters or more;

(lv)radiation shielding windows and that fall under all of the following (a) through (c), or frames thereof:

(a)windows with an area exceeding 0.09 square meters for the surface that protrudes into the cold area;

(b)windows made from materials with a density exceeding 3 grams per cubic centimeters;

(c)windows with a thickness of 100 millimeters or more;

(lvi)TV cameras or lenses specially designed for protection from the influence of radiation, and capable of withstanding radiation with total absorption exceeding 50,000 grays on a silicon conversion basis;

(lvii)tritium, tritium compounds or tritium mixtures, with a ratio of tritium atomicity to hydrogen atomicity exceeding 1/1,000 (excluding those installed in equipment, with total radioactivity per 1 equipment less than 1,480 gigabecquerels);

(lviii)equipment used for the production, collection or preservation of tritium that falls under any of the following:

(a)equipment designed for the production (including that for concentration), collection or preservation of tritium;

(b)equipment used for the production, collection or preservation of tritium that falls under any of the following (excluding that falling under (a)):

1.freezing equipment capable of cooling hydrogen or helium to -250 degrees centigrade or less, and with a freezing capacity exceeding 150 watts;

2.equipment for the storage of hydrogen isotopes that utilizes metal hydrides as storage catalyst;

(lix)platinized catalysts for the collection of tritium from heavy water or for the production of heavy water, and designed to promote hydrogen isotope exchange between hydrogen and water;

(lx)helium with a helium-3 mixing rate greater than the mixing rate in nature (excluding helium-3 sealed in containers or equipment with a weight less than 1 gram);

(lxi)rhenium, alloys with a rhenium content of 90% or more of the total weight, or alloys with a rhenium or tungsten content of 90% or more of the total weight weighing in excess of 20 kilograms, with a cylindrical shape and internal diameter exceeding 100 millimeters and less than 300 millimeters, or with a hollow hemispherical shape, and combinations of both shapes;

(lxii)explosion-proof containers designed to be used for the testing of explosives or explosive devices which fall under any of the following (a) and (b):

(a)explosion-proof containers designed to be capable of fully containing explosions equivalent to 2 kilograms or more of trinitrotoluene;

(b)explosion-proof containers that have a structure or properties to transmit analysis or measurement information of relevant tests.

Article 2(1)Goods specified by the Order of the Ministry of Economy, Trade and Industry in row 3 (i) of the appended table 1 of the Export Order fall under any of the following:

(i)substances for raw materials of chemical warfare agents falling under any of the following or mixtures containing the substances, wherein the content of any of the substances exceeds 30 % of the total weight:

(a)3-hydroxy-1-methylpiperidine;

(b)potassium fluoride;

(c)ethylene chlorohydrin;

(d)dimethylamine;

(e)dimethylamine hydrochloride;

(f)hydrogen fluoride;

(g)methyl benzilate;

(h)3-quinuclidinone;

(i)pinacolone;

(j)potassium cyanide;

(k)potassium bifluoride;

(l)ammonium bifluoride;

(m)sodium bifluoride;

(n)sodium fluoride;

(o)sodium cyanide;

(p)phosphorous pentasulfide;

(q)diisopropylamine;

(r)2-diethylamino ethanol;

(s)sodium sulfide;

(t)triethanolamine hydrochloride;

(u)phosphorous acid triisopropyl;

(v)diethyl thiophosphoric acid;

(w)diethyl dithio phosphoric acid;

(x)sodium hexafluorosilicic acid;

(ii)substances having equivalent toxic ability with chemical warfare agents falling under any of the following or mixtures containing such a substance (for mixtures containing a substance falling under (a) through (g), limited to those for which the content of a substance falling under any of (a) through (c) exceeds 1 % of the total weight, or those for which the content of the substance falling under any of (d) through (g) exceeds 30 % of the total weight):

(a)O,O-diethyl=S-[2-(diethylamino)ethyl] = phosphorothiolate and alkylate salts and protonate salts thereof;

(b)1,1,3,3,3-pentafluoro-2-(trifluoromethyl)-1-propane;

(d)carbonyl dichloride;

(e)cyanogen chloride;

(f)hydrogen cyanide;

(g)trichloronitromethane;

(iii)substances having equivalent toxic ability with chemical warfare agents falling under any of the following or mixtures containing the substances (for mixtures containing substances falling under (f) through (cc), limited to those for which the content of any of the substances falling under (f) through (p) exceeds 10 % of the total weight, or those for which the content of any of the substances falling under (f) through (cc) exceeds 30 % of the total weight):

(a)alkyl phosphonyl difluoride (limited to those having an alkyl group carbon number of 3 or less);

(b)O-alkyl = O-2-dialkylaminoethyl = alkyl phosphonite (including those O-alkyl alkyl group of which is a cycloalkyl group, though limited to those O-alkyl alkyl group carbon number of which is 10 or less and O-2-dialkylaminoethyl or alkyl phosphonite alkyl group carbon number of which is 3 or less) as well as alkylate salts and protonate salts thereof;

(c)O-2-dialkylaminoethyl = hydrogen = alkyl phosphonite (limited to those O-2-dialkylaminoethyl or alkyl phosphonite alkyl group carbon number of which is 3 or less) as well as alkylate salts and protonate salts thereof;

(d)O-isopropyl = methyl phosphonochloridate;

(e)O-pinacolyl = methyl phosphonochloridate;

(f)compounds containing phosphorus atoms having no bond with a carbon atom other than a bond with one alkyl group carbon number of which is 3 or less;

(g)N,N-dialkyl phosphoramidic = dihalide (limited to those with alkyl group carbon number of 3 or less);

(h)dialkyl = N,N-dialkyl phosphoramidate (limited to those with dialkyl or N,N-dialkyl phosphoramidate alkyl group carbon number of 3 or less);

(i)arsenic trichloride;

(j)2,2-diphenyl-2-hydroxyacetic acid;

(k)quinuclidine-3-ol;

(l)N,N-dialkylaminoethyl-2-chloride (limited to those alkyl group carbon number of which is 3 or less) and protonate salts thereof;

(m)N,N-dialkyl aminoethane-2-ol (limited to those alkyl group carbon number of which is 3 or less) and protonate salts thereof;

(n)N,N-dialkyl aminoethane-2-thiol (limited to those alkyl group carbon number of which is 3 or less) and protonate salts thereof;

(o)bis(2-hydroxyethyl) sulfide;

(p)3,3-dimethylbutane-2-ol;

(q)phosphoryl chloride;

(r)phosphorous trichloride;

(s)phosphorous pentachloride;

(t)trimethyl phosphite;

(u)triethyl phosphite;

(v)dimethyl phosphite;

(w)diethyl phosphite;

(x)sulfur monochloride;

(y)sulfur bichloride;

(z)thionyl chloride;

(aa)ethyl diethanol amine;

(bb)methyl diethanol amine;

(cc)triethanolamine.

(2)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 3 (ii) of the appended table 1 of the Export Order fall under any of the following:

(i)among reactor vessels or reactors having a capacity exceeding 0.1 cubic meters and less than 20 cubic meters of which all portions that come into contact with the contents, those composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and a chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)tantalum or tantalum alloys;

(f)titanium or titanium alloys;

(g)zirconium or zirconium alloys;

(h)niobium or niobium alloys;

(ii)among storage tanks, containers or receivers having a capacity exceeding 0.1 cubic meters, those all portions that come into contact with the contents of which are composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)tantalum or tantalum alloys;

(f)titanium or titanium alloys;

(g)zirconium or zirconium alloys;

(h)niobium or niobium alloys;

(iii)among heat exchangers or condensers having a heat transfer area exceeding 0.15 square meters and less than 20 square meters, or tubes, plates, coils or blocks designed as components thereof, those all portions that come into contact with the contents of which are composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)graphite or carbon graphite;

(f)tantalum or tantalum alloys;

(g)titanium or titanium alloys;

(h)zirconium or zirconium alloys;

(i)silicon carbide;

(j)titanium carbide;

(k)niobium or niobium alloys;

(iii)-2components of those listed in the preceding item and that fall under any of the following:

(a)tubes;

(b)plates;

(c)coils;

(d)blocks;

(iv)among distillation or absorption columns with a cross section area exceeding 0.00785 square meters, or liquid dispensers, vapor dispensers or liquid collectors designed as components thereof, those all parts that come into contact with the contents of which are composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)graphite or carbon graphite;

(f)tantalum or tantalum alloys;

(g)titanium or titanium alloys;

(h)zirconium or zirconium alloys;

(i)niobium or niobium alloys;

(v)filling equipment capable of remote operation all portions that come into contact with the contents of which are composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and a chrome content exceeding 20 % of the total weight;

(vi)among agitators used for those falling under item (i), or impellers, blades, or shafts designed as components thereof, those all portions that come into contact with the contents of which are composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)tantalum or tantalum alloys;

(f)titanium or titanium alloys;

(g)zirconium or zirconium alloys;

(h)niobium or niobium alloys;

(vii)valves nominal diameter of which is exceeding 10 A (i.e. 10mm) or casing or casing liners designed as components thereof, and all portions that come into contact with the contents of which are composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and a chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)tantalum or tantalum alloys;

(f)titanium or titanium alloys;

(g)zirconium or zirconium alloys;

(h)niobium or niobium alloys;

(i)ceramics that fall under any of the following:

1.ceramics with a silicon carbide content of 80 % or more of the total weight;

2.ceramics with an aluminum oxide content of 99.9 % or more of the total weight;

3.zirconium oxides;

(viii)multi-walled piping provided with a port for equipment for detecting content leaks all portions that come into contact with the contents of which are composed of, lined with or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)graphite or carbon graphite;

(f)tantalum or tantalum alloys;

(g)titanium or titanium alloys;

(h)zirconium or zirconium alloys;

(i)niobium or niobium alloys;

(ix)among pumps axes of which are sealed by 2 or more layers or seal-less pumps the maximum specified discharge volume of which exceeds 0.6 cubic meters per hour, or vacuum pumps the maximum specified discharge volume of which exceeds 5 cubic meters per hour, or casings, casing liners, impellers, rotors, or jet pump nozzles designed as components thereof, those in which all portions that come into contact with the contents of which are composed of, lined with, or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and a chrome content exceeding 20 % of the total weight;

(c)fluoropolymers;

(d)glass;

(e)graphite or carbon graphite;

(f)tantalum or tantalum alloys;

(g)titanium or titanium alloys;

(h)zirconium or zirconium alloys;

(i)ceramic;

(j)ferrosilicon;

(k)niobium or niobium alloys;

(x)among incinerators average temperature of incineration chamber during use of which exceeds 1,000 degrees centigrade, those which have portions for supplying the substance to be incinerated for which all portions that come into contact with the contents are composed of or coated with materials falling under any of the following:

(a)nickel or alloys with a nickel content exceeding 40 % of the total weight;

(b)alloys with a nickel content exceeding 25 % of the total weight and a chrome content exceeding 20 % of the total weight;

(c)ceramic;

(xi)gas monitoring systems that fall under any of the following:

(a)systems capable of detecting those listed in the preceding paragraph even when the concentration in the air is less than 0.3 milligrams per cubic meter and designed for continuous use;

(b)systems designed for detecting compounds having an anticholinesterase effect;

(xii)components of those listed in the preceding item and that fall under any of the following:

(a)detectors;

(b)sensor devices;

(c)sensor cartridges.

Article 2-2(1)Goods specified by the Order of the Ministry of Economy, Trade and Industry in row 3-2 (i) of the appended table 1 of the Export Order fall under any of the following:

(i)viruses (excluding vaccines): the African horse sickness virus, the African swine fever virus, the Andean potato latent virus, the Andes virus, the Ebola virus, the yellow fever virus, Aujeszky's disease virus, the Omsk hemorrhagic fever virus, the Oropouche virus, the Guanarito virus, the Kyasanur Forest disease virus, the cattle plague virus, the Crimean-Congo hemorrhagic fever virus, the foot-and-mouth disease virus, the Sabia virus, the monkeypox virus, the peste des petits ruminants virus, the Sin Nombre virus, the vesicular stomatitis virus, the western equine encephalitis virus, the Saint Louis encephalitis virus, the Seoul virus, the tick-borne encephalitis virus, the Chikungunya virus, the Chapare virus, the louping ill virus, the Teschen disease virus, the Choclo virus, the dengue fever virus, the smallpox virus, the eastern equine encephalitis virus, the Dobrava-Belgrade virus, the avian influenza virus (limited to those having the H5 or H7 H antigen), the swine fever virus, the Nipah virus, the Japanese encephalitis virus, the Newcastle disease virus, the Hantaan virus, porcine enterovirus type 9, the Junin virus, the blue tongue virus, the Venezuelan equine encephalitis virus, the Hendra virus, the potato spindle tuber viroid, the Powassan virus, the Machupo virus, the Marburg virus, the Murray Valley encephalitis virus, the goat pox virus, the sheep pox virus, the Laguna Negra virus, the Lassa fever virus, the lumpy skin disease virus, the Lyssavirus viruses (including the rabies virus), the Rift Valley fever virus, the lymphocytic choriomeningitis virus, the Lujo virus, or the Rocio virus;

(ii)bacteria (excluding vaccines): Clostridium argentinense, Brucella abortus, Chlamydia psittaci, the gas bacillus, Coxiella burnetii, Mycoplasma mycoides (small colony), the cholera bacillus, Shigella dysenteriae, Bacillus anthracis, the typhoid bacillus, enterohemorrhagic Escherichia coli (serotype O26, O45, O103, O104, O111, O121, O145, and O157), Rickettsia prowazekii, Clostridium baratii, Actinobacillus mallei, Brucella suis, Clostridium butyricum, Bacillus pestis, Bacillus botulinus, Brucella melitensis, Mycoplasma capricolum subspecies capripneumoniae (strain F38), Bacillus tularensis, or Pseudomonas pseudomallei;

(iii)toxins (excluding immunotoxins): aflatoxin, abrin, clostridium welchii toxin, HT-2 toxin, staphylococcal enterotoxin (enterotoxin, alpha-toxin, and toxic shock syndrome toxin), conotoxin, cholera toxin, diacetoxyscirpenol-toxin, Shigella dysenteriae toxin, T-2 toxin, tetrodotoxin, Viscum album lectin, verotoxin or Shiga toxin-like ribosome inactive protein, botulin toxin, Volkensin, microcystin, or modeccin;

(iv)subunits of those falling under the preceding item;

(v)bacteria or fungi: Clavibacter michiganensis ssp. sepedonicus, Coccidioides immitis, Coccidioides posadasii, Cochliobolus miyabeanus, Colletotrichum kahawae, Xanthomonas axonopodis pv. citri, Xanthomonas albilineans, Xanthomonas oryzae pv. oryzae, Synchytrium endobioticum, Sclerophthorarayssiae var.zeae, Thecaphora solani, Tilletia indica, Puccinia graminis var. graminis, Puccinia striiformis, Peronosclerospora philippinensis, Magnaporthe oryzae, Microcyclus ulei, or Ralstonia solanacearum race 3 or biovar 2;

(vi)genes (including chromosomes, genomes, plasmids, transposons, and vectors) having a base sequence of nucleic acids falling under item (i), item (ii), or the preceding item, wherein that base sequence of nucleic acids causes the expression of pathogenicity or the production of those falling under item (iii) or item (iv);

(vii)organisms (including microorganisms) the gene of which is altered such render a base sequence of nucleic acids falling under item (i), item (ii), or item (v), wherein that base sequence of nucleic acids causes the expression of pathogenicity or the production of substances falling under item (iii) or item (iv).

(2)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 3-2 (ii) of the appended table 1 of the Export Order fall under any of the following:

(i)physical containment facilities falling under any of the following:

(a)equipment for facilities with physical containment level of P3 or P4;

(b)isolators having physical containment functions equivalent to those of class III safety cabinets;

(ii)fermenters or components thereof that fall under any of the following:

(a)fermenters or components thereof, other than disposables, which fall under any of the following:

1.hermetically sealed fermenters, the capacity of which is 20 liters or more, capable of internal sterilization or disinfection in a fixed state;

2.culture vessels designed to be usable for fermenters that fall under 1. which are capable of internal sterilization or disinfection in a fixed state;

3.controllers designed to be usable for fermenters that fall under 1. which are capable of simultaneously monitoring or controlling two parameters or more for controlling fermentation equipment;

(b)disposable fermenters or components thereof that fall under any of the following:

1.hermetically sealed fermenters, the capacity of which is 20 liters or more;

2.containers for disposable culture vessels designed to be usable for fermenters that fall under 1.;

3.controllers designed to be usable for fermenters that fall under 1. which are capable of simultaneously monitoring or controlling two parameters or more for controlling fermentation equipment;

(iii)continuous centrifuge separators falling under all of the following (a) through (d):

(a)separators with a flow volume exceeding 100 liters per hour;

(b)separators comprised of polished stainless steel or titanium;

(c)separators having an axle sealed with a mechanical seal;

(d)separators capable of internal sterilization using vapor when fixed and in a closed state;

(iv)cross (tangential) flow filtration equipment falling under the following (a) or (b) (excluding those using a reverse penetration membrane):

(a)equipment with a total effective filtering area of 1 square meter or more;

(b)equipment that falls under the following 1. or 2.:

1.equipment capable of internal sterilization or disinfection in a fixed state;

2.equipment using disposable components;

(iv)-2components designed for use for those listed in the preceding item with an effective filtering area of 0.2 square meters or more;

(v)freeze-drying equipment falling under the following (a) and (b):

(a)equipment having the capacity to create 10 kilogram or more and less than 1,000 kilograms of ice in a 24-hour period;

(b)equipment capable of internal sterilization using vapor;

(v)-2spray-drying equipment that falls under all of the following (a) through (c):

(a)spray-drying equipment with a moisture evaporation of 0.4 kilograms or more and 400 kilograms or less per hour;

(b)spray-drying equipment capable of producing products with an average particle diameter of 10 micrometers or less, or spray-drying equipment, by replacing its smallest components, capable of producing products with an average particle diameter of 10 micrometers or less;

(c)spray-drying equipment capable of internal sterilization or disinfection in a fixed state;

(vi)among whole or half body clothing or hoods that possess protective equipment used in physical containment and airline ventilation use equipment, those capable of maintaining a positive internal pressure;

(vii)aerosol inhalation chambers with the capacity of 1 square meter or more;

(viii)spraying or fogging systems or components thereof, which fall under any of the following:

(a)spraying or fogging systems designed to be mounted in aircraft, airship, balloon, or unmanned aerial vehicles capable of dispersing droplets initial particles of which have a median cubic diameter less than 50 microns from an on-board liquid device at a rate exceeding 2 liters per minute;

(b)a spray boom or nozzle for an aerosol generators designed to be mounted in aircraft, airship, balloon, or unmanned aerial vehicles capable of dispersing droplets, the initial particles of which have a median cubic diameter less than 50 microns from an on-board liquid spraying devices at a rate exceeding 2 liters per minute;

(c)aerosol generators designed to be used in a devices capable of dispersing droplets initial particles of which have a median cubic diameter less than 50 microns from an on-board liquid spraying device at a rate exceeding 2 liters per minute.

Article 3Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 4 of the appended table 1 of the Export Order fall under any of the following:

(i)rockets or equipment or tools (including molds; hereinafter the same applies in this Article) for the manufacture of rockets capable of transporting payloads for 300 kilometers or more, test equipment, or components thereof;

(i)-2unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more or equipment or tools for the manufacture thereof, or test equipment, or components thereof;

(i)-3among unmanned aerial vehicles designed to be capable of atomizing aerosol and designed to be capable of transporting payloads exceeding 20 liters in a particulate or liquid form in addition to fuel, and falling under any of the following (excluding those falling under the preceding item and model aircraft used for entertainment or sports):

(a)vehicles having an autonomous flight control or navigation capability;

(b)vehicles having a function enabling flight control by a person exceeding the visible range;

(ii)goods falling under any of the following or equipment or tools for the manufacture thereof, or test equipment, or components thereof:

(a)goods usable in rockets capable of transporting payloads for 300 kilometers or more, and falling under any of the following:

1.individual stages of multiple-stage rockets;

2.solid rocket propulsion units or hybrid rocket propulsion unit with the total impulse of 841,000 Newton-seconds or more;

3.liquid rocket propulsion units with a total impulse of 841,000 Newton-seconds or more or liquid rocket engines designed to be incorporated into such units;

(b)goods capable of use in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more, falling under any of the following:

1.re-entry vehicles;

2.thermal shields (limited to those using ceramic or abrasion materials) for re-entry vehicles or components thereof;

3.heat sinks for re-entry vehicles and components thereof;

4.electronics parts designed for use for re-entry vehicles;

5.guidance equipment with a ratio of average error radius to flight distance of 3.33 % or less;

6.thrust vector controllers;

(iii)propulsion units or components thereof, motor case linings, or insulation materials falling under any of the following, or equipment or tools for the manufacture thereof, or test equipment, or components thereof:

(a)turbojet engines or turbo fan engines falling under the following 1. and 2.:

1.engines maximum thrust of which is 400 newtons or more when not mounted in an airframe (excluding those maximum thrust of which is 8,890 newtons or more when not mounted in an airframe and the use of which in private aircraft has been authorized by Japanese governmental institution);

2.engines fuel consumption of which at maximum continuous thrust is 0.15 kilograms per thrustnewton per hour or less in standard atmospheric conditions above the sea as defined by the International Civil Aviation Organization;

(b)ramjet engines, scramjet engines, pulse jet engines, or combined cycle engines (limited to those usable in rockets capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more) or components thereof;

(c)motor cases for solid rockets usable in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more;

(d)motor case linings for solid rockets (limited to those in which the propellant and motor case or insulation can be combined) usable in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more or designed for use in rockets or unmanned aircraft capable of transporting payloads weighing less than 500 kilograms for 300 kilometers or more;

(e)motor case insulation for solid rockets, usable in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more or designed for use in rockets or unmanned aircraft capable of transporting payloads weighing less than 500 kilograms for 300 kilometers or more;

(f)motor case nozzles for solid rockets usable in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more;

(g)control equipment for propellants in liquid, slurry or gel states, the frequency range of which is 20 hertz or more and 2,000 hertz or less and designed to be capable of withstanding vibrations with effective acceleration rate exceeding 98 meters per second squared (limited to control equipment which can be used in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more) and components thereof (excluding servo valves and pumps);

(h)components of hybrid rocket propulsion units that fall under (ii)(a) 2.;

(i)tanks for liquid propellants designed for use in those falling under any of the following:

1.propellants falling under item (vii) or raw materials thereof;

2.liquid propellants (excluding those falling under 1.) used in rockets capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more;

(j)turboprop engines designed for use in unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, and whose maximum output is 10 kilowatts or more in standard atmospheric conditions above the sea as defined by the International Civil Aviation Organization (excluding those certified for use in civil aircraft by the governmental organizations of Japan) or components thereof;

(iv)separation mechanisms or staging mechanisms for multiple-stage rockets (limited to those usable for a rocket capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more), or equipment or tools for the manufacture thereof, or test equipment, or components thereof;

(v)flow-forming machines that can be controlled by numerically-controlled coordinate measurement equipment and computers, with 3 or more axes capable of contouring control, or components thereof;

(vi)among pumps usable for servo valves or controllers for propellants and that fall under any of the following (a) and (b), those falling under (c) or (d):

(a)pumps designed for use in controllers for propellants in liquid, slurry, or gel states;

(b)pumps frequency range of which is 20 hertz or more and 2,000 hertz or less and designed to be able to withstand vibrations with effective acceleration rate exceeding 98 meters per second squared;

(c)pumps designed to allow a flow of 0.024 cubic meters per minute or more in a state wherein the absolute pressure is 7,000 kilopascals or more and the actuator response time of which is less than 100 milliseconds;

(d)pumps with the number of rotation of axles of 8,000 rotations per minute or more or discharge pressure of 7,000 kilopascals or more;

(vi)-2among radial ball bearings usable for pumps usable for controllers for propellants precision of which is class 2 or more as specified in Japanese Industrial Standards B1514-1 (Rolling bearings - Tolerances - Part 1: Radial bearings), those falling under all of the following (a) through (c):

(a)bearings with an inner wheel internal diameter of 12 millimeters or more and 50 millimeters or less;

(b)bearings with an outer wheel external diameter of 25 millimeters or more and 100 millimeters or less;

(c)bearings with a width of 10 millimeters or more and 20 millimeters or less;

(vii)propellants or raw material thereof falling under any of the following:

(a)hydrazine with concentration exceeding 70 %;

(b)a derivative of hydrazine;

(c)ammonium perchlorate;

(d)ammonium dinitramide;

(e)among aluminum powder the particles of which are globular or spheroidal and with diameter thereof less than 200 micrometers and with a weight-based purity level of 97% or more, those the content of those diameter of which is less than 63 micrometers as measured by measurement method specified in International Organization for Standardization ISO 2591:1988 or standards equivalent thereto is 10% or more of the total weight;

(f)among powder-state zirconium (containing hafnium contained in the zirconium at a natural ratio), beryllium, magnesium, or alloys thereof with a weight-based purity level of 97% or more, those for which particles of diameters less than 60 micrometers as measured using sieves, laser diffraction, optical scanning or other relevant methods account for 90% or more of the total volume or weight;

(g)among powder-state boron or alloys thereof with a weight-based purity level of 85% or more by a yield-to-weight comparison, those for which particles of diameters less than 60 micrometers as measured using sieves, laser diffraction, optical scanning or other relevant methods account for 90% or more of the total volume or weight;

(h)a perchlorate, a chlorate, or a chromate in which a powdered metal or fuel constituent is mixed;

(i)carborane, decaborane, or pentaborane, or a derivative thereof;

(j)a liquid oxidizer falling under any of the following:

1.dinitrogen trioxide;

2.nitrogen dioxide or dinitrogen tetraoxide;

3.dinitrogen pentoxide;

4.a mixture of nitrogen oxide;

5.red fuming nitric acid having resistance to corrosion;

6.a compound made from fluorine or other halogens, oxygen, or nitrogen (excluding nitrogen trifluoride gas);

(k)polybutadiene having a carboxyl group at its terminal;

(l)polybutadiene having a hydroxyl group at its terminal;

(m)a glycidylamide polymer;

(n)a polymer of butadiene and acrylic acid;

(o)a polymer of butadiene, acrylonitrile, and acrylic acid;

(p)a propellant falling under any of the following:

1.a solid or liquid propellant with heating value of 40,000,000 joules per kilogram or more;

2.fuel or fuel additives (excluding those produced by using fuels manufactured by using fossil fuels or organic substances derived from plants as raw materials) with a heating value of 37,500,000,000 joules per cubic meter when measured at a temperature of 20 degrees centigrade and 1 atmospheric pressure;

(q)tris-1-(2-methyl) aziridinyl phosphine oxide;

(r)a reaction product of tetraethylenepentamine, acrylonitrile, and glycidol;

(s)a reaction product of tetraethylenepentamine and acrylonitrile;

(t)a multi-functional aziridineamide having an isophthal-, trimesin-, isocyanur-, or trimethyladipin- skeleton having a 2-methylaziridine group or a 2-ethylaziridine group;

(u)triphenylbismuth;

(v)a ferrocene derivative;

(w)triethylene glycol dinitrate;

(x)trimethylolethane trinitrate;

(y)1,2,4-butanetrioltrinitrate;

(z)diethylene glycol dinitrate;

(aa)polytetrahydrofuran polyethlene glycol;

(bb)4,5-diazidomethyl-2-methyl--,2,3-triazole;

(cc)methyl-nitrate ethyl nitramine;

(dd)ethyl-nitrate ethyl nitramine;

(ee)butyl-nitrate ethyl nitramine;

(ff)bis (2,2-dinitropropyl) acetal;

(gg)bis (2,2-dinitropropyl) formal;

(viii)equipment or tools for the production of propellants or raw materials thereof, or test equipment or components thereof (excluding those falling under any of the next items through item (x), (ii)):

(a)goods falling under the preceding item;

(b)octogen or hexagen;

(c)a composite propellant;

(d)2-nitrodiphenylamine or N-methyl-p-nitroaniline;

(e)hydrazine nitroformate;

(f)hexanitrohexaazaisowurtzitane;

(ix)among batch mixers (excluding those for liquids) usable at an absolute pressure of 0 kilopascal or more and 13.326 kilopascals or less, those capable of controlling the temperature inside the mixing container, and falling under the following (a) and (b) or components thereof:

(a)mixers with total volume of 110 liters or more;

(b)mixers having at least one mixing axis or a kneading axis separated from the center axis thereof;

(ix)-2among continuous mixers (excluding those for liquids) capable of mixing at an absolute pressure of 0 kilopascal or more and 13.326 kilopascals or less, those capable of controlling the temperature inside the mixing container, and falling under the following, or components thereof:

(a)mixers having 2 or more mixing axles or kneading axles;

(b)mixers having one rotating axle with a vibration function and having a projection for kneading in the mixing container and on the rotating axle;

(x)jet mills capable of pulverizing propellants falling under any of item (vii) or item (viii), (b) through (f) or raw materials thereof or components thereof;

(x)-2equipment for the production of powder (limited to atomized powders, globular powders, or spheroidal powders) of metals falling under any of item (vii), (e) through (g) or components thereof;

(xi)equipment for the production of composites, fibers, prepregs, or preforms (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more) and that falls under any of the following or parts or accessories thereof:

(a)among filament winding machines or fiber placement machines for positioning fibers and carrying out wrapping operations and winding operations, those with three or more axles capable of controlling those operations in a correlated manner or controllers thereof;

(b)among equipment for the production of airframes of an aircraft or the structure of rockets comprised of composites, and for positioning tape or sheets and carrying out lamination operations, those with 2 or more axles capable of controlling those operations in a correlated manner;

(c)weaving machines or interlacing machines capable of three-dimensional weaving;

(d)equipment for the production of fibers that falls under any of the following:

1.equipment for the production of other fibers from polymer fibers;

2.equipment for vapor depositing elements or compounds on substrates in a heated filament form;

3.wet spinning apparatus for fire-resistant ceramics;

(e)equipment designed for surface treating of fibers or the production of prepregs or preforms;

(xii)nozzles used in fixing substances generated from the thermal decomposition of gas onto substrates (limited to that carried out in the temperature range 1,300 degrees centigrade or more and 2,900 degrees centigrade or less and the absolute pressure range of 130 pascals or more and 20,000 pascals or less) to substrates;

(xiii)equipment for the production of nozzle of rocket propulsion systems or re-entry vehicle nose tips, and that falls under any of the following or process controls thereof:

(a)equipment for the densification of carbon of structural materials;

(b)equipment for fixing carbon generated from the thermal decomposition of gas onto substrates;

(xiv)isostatic presses falling under all of the following (a) through (c) or controllers thereof:

(a)isostatic presses with maximum pressure of 69 megapascals or more;

(b)isostatic presses capable of temperature control in hollow cavities (limited to the case when the temperature of hollow cavities is 600 degrees centigrade or more);

(c)isostatic presses, with an internal diameter of hollow cavities of 254 millimeters or more;

(xv)furnaces designed for the densification of carbon of composites using carbon or carbon fibers for chemical vapor deposition or controllers thereof;

(xvi)structural materials falling under any of the following:

(a)composites (excluding prepregs with glass transition points of 145 degrees centigrade or less) made from organic substances reinforced with fibers specific strength exceeding 76,200 meters and specific elastic modulus exceeding 3,180,000 meters or those with metal in the matrix phase, or molded products thereof (limited to those designed for use in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, or goods falling under item (ii));

(b)composites using carbon and carbon fibers designed for rocket use or molded products thereof (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more);

(c)artificial graphite falling under any of the following (limited to artificial graphite usable for rocket nozzles or re-entry vehicles nose tips):

1.artificial graphite, the bulk density of which measured at 15 degrees centigrade is 1.72 grams per cubic centimeter or more and the particle diameter of which is 100 micrometers or less and which is capable of being processed into any of the following:

i.cylinders with a diameter of 120 millimeters or more and a height of 50 millimeters or more, or tubes with an inner diameter of 65 millimeters or more, a thickness of 25 millimeters or more, and a height of 50 millimeters or more;

ii.a rectangular parallelepiped, each of the dimensions of which is respectively 120 millimeters or more, 120 millimeters or more, and 50 millimeters or more;

2.pyrolytic graphite (limited to that usable in rockets capable of transporting payloads for 300 kilometers or more, or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more);

3.graphite strengthened with fibers (limited to that usable in rockets capable of transporting payloads for 300 kilometers or more or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more);

(d)composites of ceramics (limited to those with relative permittivity less than 6 in frequencies within the range of 100 megahertz or more and 100 gigahertz or less) for use in radomes (limited to those usable in rockets capable of transporting payloads for 300 kilometers or more or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more) of rockets or unmanned aerial vehicles;

(e)unfired ceramics reinforced by silicon carbide or reinforced silicon carbide ceramic composites usable for nose tips of rockets or unmanned aerial vehicles, re-entry vehicles, or nozzle flaps (limited to those usable in rockets capable of transporting payloads for 300 kilometers or more or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more);

(f)powders principally made from tungsten, molybdenum or alloys of those metals, or a consolidated powder (limited to those usable as structural materials for rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more):

1.tungsten or powders with a tungsten content of 97 % or more of the total weight of alloys, with a particle diameter of 50 micrometers or less;

2.molybdenum or powders with a molybdenum content of 97 % or more of the total weight of alloys, and a particle diameter of 50 micrometers or less;

3.consolidated tungsten or powders with a tungsten content of 97 % or more of the total weight of the alloys (for those impregnated with copper or silver, with a tungsten content of 80 % or more of the total weight of the alloys), and which is capable of being processed into any of the following:

ii.a rectangular parallelepiped, each of the dimensions of which is respectively 120 millimeters or more, 120 millimeters or more, and 50 millimeters or more;

(g)maraging steels usable in rockets capable of transporting payloads for 300 kilometers or more or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more which fall under the following 1. and 2.:

1.maraging steels falling under any of the following:

i.maraging steels with a maximum tensile strength as measured at the solution heat treatment stage at 20 degrees centigrade of 900,000,000 pascals or more;

ii.maraging steels with a maximum tensile strength as measured at the precipitation hardening heat treatment stage at 20 degrees centigrade of 1,500,000,000 pascals or more;

2.maraging steels falling under any of the following:

i.plates or tubes with a thickness of 5 mm or less;

ii.tubes with a thickness of 50 mm or less and with an internal diameter of 270 millimeters or more;

(h)austenitic-ferritic stainless steels stabilized by titanium, and that fall under the following 1. and 2. (limited to those usable in rockets capable of transporting payloads for 300 kilometers or more or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more):

1.steels falling under all of the following i. through iii.:

i.steels with a chrome content of 17 % or more and 23 % or less of the total weight and a nickel content of 4.5 % or more and 7 % or less of the total weight;

ii.steels with a titanium content exceeding 0.1 % of the total weight;

iii.steels with parts indicating an austenite structure of 10% or more of the total volume;

2.steels falling under any of the following:

i.ingots or rods with a smallest dimension value of 100 millimeters or more;

ii.sheets with a width of 600 millimeters or more and a thickness of 3 millimeters or less;

iii.tubes with an external diameter of 600 millimeters or more and a thickness of 3 millimeters or less;

(xvii)accelerometers or gyroscopes, or equipment, navigation equipment or magnetic director sensors using them, which fall under any of the following (limited to those usable in rockets or unmanned aerial vehicles) or components thereof:

(a)navigation equipment designed for use in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more and designed for use in a gyrostabilizer or automated flight controller;

(b)gyro-astro compasses, or devices that derive position or orientation by means of automatically tracking celestial bodies or satellites;

(c)linear accelerometers designed for use in inertial navigation systems or guidance systems with scale factor reproducibility less than 0.125 % per year and bias reproducibility less than 0.012263 meters per second squared per year (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more);

(d)gyroscopes with drift rate stability less than 0.5 degrees per hour in a state of linear acceleration of 9.81 meters per second squared (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more);

(e)accelerators or gyroscopes designed for use in inertial navigation systems or guidance systems, which are designed to be capable of use with linear acceleration exceeding 981 meters per second squared;

(f)equipment using accelerometers falling under (c) or (e) or gyroscopes falling under (d) or (e);

(g)magnetic director sensors that fall under all of the following 1. through 3., with 3 or more axes:

1.magnetic director sensors with an internal tilt compensation in the pitch angle (plus/minus 90-degrees) and in the roll angle (plus/minus 180-degree angle);

2.magnetic director sensors of which the effective value of the azimuthal precision at the point of plus/minus 80 degrees latitude is less than 0.5, reference to local magnetic field;

3.magnetic director sensors designed for integration with flight control or navigation systems;

(xvii)-2integrated navigation systems designed for use in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, and with precision of an average error radius of 200 meters or less;

(xvii)-3equipment or tools for the production of accelerometers or gyroscopes or equipment using those, or navigation systems, magnetic director sensors, or integrated navigation system, or test equipment, calibration equipment, or alignment equipment thereof, or components thereof, falling under any of the following:

(a)production equipment or tools or test equipment, calibration equipment, or alignment equipment for those falling under preceding two items (excluding those falling under any of the following (b) through (f)), or components thereof;

(b)centrifugal balancing machines (excluding those designed for testing dental equipment or medical equipment) falling under all of the following 1. through 4.:

1.machines that are not capable of testing rotors exceeding 3 kilograms;

2.machines capable of testing rotors with speed exceeding 12,500 rotations per minute;

3.machines capable of testing imbalance on 2 or more planes;

4.machines with residual imbalance with respect to the rotor weight of 0.2 gram-millimeters per kilogram or less;

(c)display equipment designed to be capable of use in machines falling under (b);

(d)motion simulators or rate tables falling under all of the following 1. through 3. (excluding those designed to be usable for machine tools or medical devices):

1.motion simulators or rate tables with 2 or more axles;

2.motion simulators or rate tables using a slip ring or non-contact type equipment capable of supplying electricity or transmitting signal information;

3.motion simulators or rate tables falling under any of the following:

i.motion simulators or rate tables the angular velocity in any axles of which is 400 degrees or more or 30 degrees or less per second, wherein the resolution of the angular velocity is 6 degrees per second or less, and the precision of the angular velocity is 0.6 degrees per second or less;

ii.motion simulators or rate tables angular velocity of which is stabilized at the precision of 0.05 % or less when the rotation of any axes is 10 degrees or more;

iii.motion simulators or rate tables with angular positioning precision of 5 seconds or less;

(e)positioning tables falling under the following 1. and 2. (excluding those designed for use in machine tools or medical devices):

1.positioning tables with 2 or more axles;

2.positioning tables with angular positioning precision of 5 seconds or less;

(f)centrifugal accelerator testing machines capable of applying an acceleration rate exceeding 980 meters per second squared, and that uses a slip ring or non-contact-type equipment capable of supplying electricity and transmitting signal information;

(xviii)flight controllers or attitude controllers designed for use in a rocket or unmanned aerial vehicle capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more;

(xviii)-2servo valves designed for use for those listed in the preceding item, and designed to be able to withstand vibrations with the effective rate of acceleration exceeding 98 meters per second squared within the frequency range from 20 hertz to 2,000 hertz;

(xviii)-3test equipment, calibration equipment, or alignment equipment for those listed in preceding two items;

(xix)avionics equipment falling under any of the following:

(a)radars (limited to those usable for rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more);

(b)passive sensors for detecting the direction of a specific electromagnetic wave source or landform characteristics (limited to those designed for use in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more);

(c)equipment for receiving radio waves from satellite navigational systems falling under the following 1 or 2, or components especially designed therefor:

1.equipment designed for use in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more;

2.equipment designed for use in mobile bodies that navigate or fly and that falls under any of the following:

i.equipment capable of providing information pertaining to navigation based on speeds exceeding 600 meters per second;

ii.equipment designed or improved for the purpose of use by the military or a governmental institution, and that has a function for decoding codes for accessing encoded signals or data used in a satellite navigational system (excluding those designed to receive navigational data for private use or for ensuring the safety of human life and physical safety);

iii.equipment designed such as to have a null-steerable antenna, an antenna capable of electronic scanning, or other functions of impedance elimination for the purpose of functioning in an environment where intentional impedance is received (excluding those designed so as to receive navigational data for private use or for ensuring the safety of human life and physical safety);

(d)umbilical electrical connectors or staging electrical connectors (including electrical connectors between payloads and rockets) designed for use in rockets capable of transporting payloads for 300 kilometers or more;

(xix)-2thermal batteries designed for use in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, and which contain solid non-conducting inorganic salt as the electrolyte;

(xx)among gravity meters for aircraft or ship mounting with precision of 0.7 milligals or less, those the time required for measurement of which is within 2 minutes (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more) or components thereof;

(xx)-2gravity gradiometers for aircraft or ship (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more) or components thereof;

(xxi)launch pads or associated ground launch support equipment for rockets or unmanned aerial vehicles falling under any of the following:

(a)equipment designed for handling, controlling, operating, or launching rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more;

(b)vehicles designed for transporting, handling, controlling, operating, or launching rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more;

(xxii)radio telemetry equipment or radio telecontrollers (including ground equipment) designed for use in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more and that does not fall under any of the following:

(a)equipment designed for use in manned aircraft or artificial satellites;

(b)equipment designed for use in mobile bodies used on land or the sea;

(c)equipment designed to receive information from satellite navigational systems for providing navigational data for private use or for ensuring the safety of human life and physical safety;

(xxii)-2tracking devices usable in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, falling under any of the following:

(a)tracking devices using code converters mounted in rockets or unmanned aerial vehicles and capable of instantly measuring flight position and speed data in a mutual coordination with linked devices on ground, the sea or aircraft, or with a satellite navigational system;

(b)among radars for distance measurement having a tracking device utilizing light, those falling under all of the following 1. through 3.:

1.radars with angular resolution less than 1.5 milliradians;

2.radars with the square mean value of distance resolution less than 10 meters and capable of measuring distances 30 kilometers or more;

3.radars with speed resolution less than 3 meters per second;

(xxiii)analog computers or digital computers designed for use in a rocket capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more falling under any of the following:

(a)computers designed to be usable from below -45 degrees centigrade to over 55 degrees centigrade;

(b)computers designed to be able to withstand radiation irradiation total absorbed dose of which on a silicon conversion basis is 500,000 rads or more;

(xxiv)integrated circuits for analog-to-digital conversion or analog-to-digital converters (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more), and that fall under any of the following:

(a)integrated circuits for analog-to-digital conversion designed to be able to withstand radiation exposure, the total absorbed dose of which is 500,000 rads or more on a silicon conversion basis or those falling under all of the following 1. through 3.:

1.integrated circuits with a resolution of 8 bits or more;

2.integrated circuits designed to be usable from below -54 degrees centigrade to over 125 degrees centigrade;

3.integrated circuits that are sealed airtight;

(b)assemblies or modules for electronic input-type analog-to-digital conversion and that fall under all of the following 1. through 3.:

1.assemblies or modules with a resolution of 8 bits or more;

2.assemblies or modules designed to be usable from below -45 degrees centigrade to over 55 degrees centigrade;

3.assemblies or modules that incorporate integrated circuit falling under (a);

(xxv)vibration test equipment or components thereof, aerodynamic test equipment, combustion test equipment, environmental test equipment, electron accelerators or equipment using those, and that fall under any of the following:

(a)vibration test equipment or components thereof falling under any of the following (limited to those usable in the development or testing of rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, or goods falling under item (ii)):

1.digitally controlled vibration test equipment falling under the following i and ii (limited to those usable in the development or testing of rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, or goods falling under item (ii)):

i.equipment with exciting force of 50 kilonewtons or more in a state with no test object present and capable of generating vibrations with effective rate of acceleration of 98 meters per second squared or more even at a frequency of 20 hertz or more and 2,000 hertz or less;

ii.equipment using feedback control technology or closed loop control technology;

2.components of vibration test equipment falling under any of the following (limited to those usable in the development or testing of rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, or goods falling under item (ii)):

i.components designed for use in controlling the vibration test equipment falling under 1 and that use a program for vibration testing and digitally control vibration testing in real time in a bandwidth exceeding 5 kilohertz;

ii.vibration generators usable for vibration test equipment falling under 1., with exciting force of 50 kilonewtons or more in a state with no test object present;

iii.parts of vibration tables or vibration generators usable for vibration test equipment falling under 1. and designed for use by connecting 2 or more vibration generators in order to generate vibrations with exciting force of 50 kilonewtons or more in a state with no test object present;

(b)aerodynamic test equipment for creating a state wherein the speed is Mach 0.9 or more (limited to those usable in the development or testing of rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, unmanned aerial vehicles falling under item (i)-3, or goods falling under item (ii). Excluding wind tunnels with speed of Mach 3 or less and with a cross-section length of 250 millimeters or less at the measuring part);

(c)combustion test equipment capable of testing solid rockets, liquid rockets with thrust exceeding 68 kilonewtons or rocket propulsion units or capable of measuring the thrust components in the three axial directions simultaneously (limited to those usable in the development or testing of rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, or goods falling under item (ii));

(d)environmental test equipment capable of simulating flying state and that falls under the following 1. and 2. (limited to those usable in the development or testing of rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, unmanned aerial vehicles falling under item (i)-3, or goods falling under item (ii)):

1.equipment capable of simulating states wherein the altitude is 15,000 meters or more or states with temperatures throughout the range of -50 degrees centigrade or more and 125 degrees centigrade or less;

2.equipment (limited to those with exciting force of 5 kilonewtons or more) capable of generating vibrations with frequency range between 20 hertz and 2,000 hertz and effective rate of acceleration of 98 meters per second squared or more in a state with no test object present, or those capable of generating sounds with sound pressure level of 140 decibels or more when the reference sound pressure is 20 micropascals, or those with total rated acoustic output of 4 kilowatts or more;

(e)electron accelerators capable of emitting electromagnetic waves by means of a bremsstrahlung from accelerated electrons having energy of 2 mega electron volts or more or equipment using those (excluding those designed for medical use and limited to those usable in the development or testing of rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, or goods falling under item (ii));

(xxv)-2rockets capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more, goods (limited to those usable in rockets capable of transporting payloads weighing 500 kilograms or more) falling under item (ii) (a), or hybrid computers (limited to those having programs falling under Article 16, paragraph (1), item (xi)) for the design of goods falling under item (ii) (b);

(xxvi)materials or equipment using stealth technology for reducing the level of the reflection or emission of radio waves, acoustic waves (including ultrasound), or light (limited to ultraviolet and infrared light) usable in rockets or unmanned aerial vehicles capable of transporting payloads for 300 kilometers or more, unmanned aerial vehicles falling under item (i)-3, or goods falling under item (ii), or test equipment thereof;

(xxvii)integrated circuits, detectors, or radomes (limited to those usable in rockets or unmanned aerial vehicles capable of transporting payloads weighing 500 kilograms or more for 300 kilometers or more) that fall under any of the following:

(a)integrated circuits designed to be able to withstand radiation exposure with total absorbed dose of 500,000 rads or more on a silicon conversion basis, and usable for protecting rockets or unmanned aerial vehicles from a nuclear impact;

(b)detectors designed to protect rockets or unmanned aerial vehicles from a nuclear impact;

(c)radomes designed to be able to withstand a thermal shock exceeding 4,184 kilojoules per square meter at a pressure exceeding 50 kilopascals and usable to protect rockets or unmanned aerial vehicles from a nuclear impact.

Article 4Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 5 of the appended table 1 of the Export Order fall under any of the following:

(i)fluorine compound products that fall under any of the following:

(a)products designed for use in aircraft, satellites and other types of spacecraft for space development, and seals, gaskets, sealants or fuel storage bags with a content of fluorine compounds and that fall under item (xiv), (b) or (c) exceeding 50% of the total weight;

(b)piezoelectric polymers or piezoelectric copolymers made of vinylidene fluorides falling under item (xiv), (a) and that fall under following 1. or 2.:

1.polymers that are sheet or film shaped;

2.polymers with a thickness exceeding 200 micrometers;

(c)seals, gaskets, valve seats, storage bags or diaphragms made of any rubbery fluorine compound that contains vinyl ether monomer, and those designed for use for aircraft, satellites and other types of spacecraft for space development;

(ii)molded products that use fibers (including semi-finished products; hereinafter the same applies in this item) that fall under any of the following:

(a)molded products that use prepregs or preforms and that fall under item (xv), (e) and whose matrix is an organic matter;

(b)molded products that use fibers that fall under any of the following and whose matrix is a metal or carbon:

1.carbon fibers that fall under any of i. or ii.:

i.carbon fibers with a specific elastic modulus exceeding 10,150,000 meters;

ii.carbon fibers with a specific strength exceeding 177,000 meters;

2.those that fall under item (xv), (c);

(iii)aromatic polyimide (limited to those for which polymerization by heat, radiation, catalysts, and other external action is impossible, and which do not melt without pyrolysis) products (limited to films, sheets, tapes or ribbon shaped ones) and that fall under any of the following (excluding those that are coated or laminated with copper and are for printed boards of electronic circuits):

(a)products with a thickness exceeding 0.254 millimeters;

(b)products coated or laminated with carbon, graphite, metals or magnetic materials;

(iv)devices for the manufacture of items that fall under item (ii), item (xv), or Article 14, item (i) and that fall under any of the following, or components or accessories thereof (excluding those falling under Article 3, item (xi)):

(a)among filament winding devices that perform fiber positioning or wrapping operations or winding operations, those that have 3 or more primary axes (limited to those that operate by servocontrol) and are capable of controlling and correlating those operations;

(b)among devices for the manufacture of airframes of aircraft or the structure of rockets made of fibers that position tapes, and perform laminating operations, those that have 5 or more primary axes (limited to those that operate by servocontrol) capable of controlling and correlating those operations;

(c)looms or interlacing machines capable of weaving three dimensionally, and which have been specially designed or modified to weave, knit or braid fiber for molded goods;

(d)fiber manufacturing devices that fall under any of the following:

1.devices that manufacture carbon fibers or silicon carbide fibers from polymer fibers;

2.devices that manufacture silicon carbide fibers and that chemically vapor deposit elements or compounds on heated filament-shaped substrates;

3.wet spinning equipment for fire resistant ceramics;

4.devices that manufacture alumina fibers from precursor fibers containing aluminum by heat treatment;

(e)devices that manufacture prepregs that use a hot melt method and fall under item (xv), (e);

(f)non-destructive inspection devices designed for inspecting composite materials, and that fall under any of the following:

1.X-ray tomography systems for three-dimensional defect inspection;

2.numerically controlled ultrasonic testing machines of which the motions for positioning transmitters or receivers, or positioning transceivers are simultaneously controlled and programmed in four or more axes to follow the three dimensional contours of the component at the time of inspection;

(g)among devices for the manufacture of airframes for aircrafts or the structure of rockets made of fibers that position tows and perform laminating operations, those that have two or more primary axes (limited to those that operate by servocontrol) capable of controlling and correlating those operations;

(v)devices for the manufacture of alloys or powders thereof (limited to those with contamination prevention measures taken) and designed for use in the methods that fall under any of item (vii), (c), 2., i through vii.;

(vi)tools (including molds) for super plastic forming or diffusion bonding of titanium, aluminum or alloys thereof and designed to manufacture things that fall under any of the following:

(a)structures of aircraft, satellites and other types of spacecraft for space development;

(b)engines for aircraft, satellites and other types of spacecraft for space development;

(c)components of those falling under (a) or (b);

(vii)alloys or powders thereof that fall under any of the following (excluding those used for coating by fixing on the substrate surface):

(a)alloys that have become aluminum compounds that fall under any of the following:

1.nickel alloys that contains alloy elements other than aluminum or nickel with a content of aluminum of 15% or more and 38% or less of the total weight;

2.titanium alloys that contain alloy elements other than aluminum or titanium with a content of aluminum of 10% or more of the total weight;

(b)alloys made of metals that fall under (c) and that fall under any of the following:

1.nickel alloys that fall under any of the following:

i.nickel alloys with a stress breakage time of 10,000 hours or more when a load is added that generates 676 megapascals stress at a temperature of 650 degrees centigrade;

ii.nickel alloys with a low cycle fatigue life of 10,000 cycles or more when a load is added that generates 1,095 megapascals stress at a temperature of 550 degrees centigrade;

2.niobium alloys that fall under any of the following:

i.niobium alloys with a stress breakage time of 10,000 hours or more when a load is added that generates 400 megapascals stress at a temperature of 800 degrees centigrade;

ii.niobium alloy with a low cycle fatigue life of 10,000 cycles or more when a load is added that generates 700 megapascals stress at a temperature of 700 degrees centigrade;

3.titanium alloys that fall under any of the following:

i.titanium alloys with a stress breakage time of 10,000 hours or more when a load is added that generates 200 megapascals stress at a temperature of 450 degrees centigrade;

ii.titanium alloys with a low cycle fatigue life of 10,000 cycles or more when a load is added that generates 400 megapascals stress at a temperature of 450 degrees centigrade;

4.aluminum alloys with a tensile strength falling under any of the following:

i.aluminum alloys with a tensile strength of 240 megapascals or more at a temperature of 200 degrees centigrade;

ii.aluminum alloys with a tensile strength of 415 megapascals or more at a temperature of 25 degrees centigrade;

5.among magnesium alloys with a tensile strength of 345 megapascals or more, those that incur corrosion of less than 1 millimeter per year when immersed in 3% brine;

(c)alloy powders that fall under all of the following 1. through 3.:

1.alloy powders made of materials that fall under any of the following:

i.nickel alloys with a number of particles other than metals mixed during the manufacturing process of less than 3 per 1,000,000,000 particles (limited to those with a diameter exceeding 100 micrometers) and made of elements of 3 types or more including aluminum and nickel;

ii.niobium alloys comprised of 3 types or more of elements including niobium and any of aluminum, silicon or titanium;

iii.titanium alloys comprised of 3 or more types of elements including aluminum or titanium;

iv.aluminum alloys comprised of 3 types or more of elements including aluminum and any of the elements of magnesium, zinc or iron;

v.magnesium alloys comprised of 3 or more types of elements including aluminum and magnesium;

2.alloy powders manufactured by any of the following methods:

i.vacuum atomization method;

ii.gas atomization method;

iii.rotary atomization method;

iv.splat-quenching method;

v.melt spinning method and pulverization method;

vi.melt extraction method and pulverization method;

vii.mechanical alloy method;

3.alloy powders that can manufacture the alloys that fall under (a) or (b);

(d)alloy materials that fall under all of the following 1. through 3.:

1.alloy materials made of alloy powders that fall under any of (c) 1. i. through v.;

2.alloy materials that are not finely pulverized but flake shaped, ribbon shaped or thin rod shaped;

3.alloy materials manufactured by any of the following methods:

i.splat-quenching method;

ii.melt spinning method;

iii.melt extraction method;

(viii)metallic magnetic materials that fall under any of the following:

(a)metallic magnetic materials with an initial relative permeability of 120,000 or more and with a thickness of 0.05 millimeters or less;

(b)magnetostrictive alloys that fall under any of the following:

1.those with a saturated magnetostriction exceeding 0.0005;

2.those with an electromechanical coupling coefficient exceeding 0.8;

(c)strip-shaped amorphous alloys or nano crystal alloys that fall under the following 1. and 2.:

1.those with a content of any of iron, cobalt or nickel, or with a total content thereof, of 75% or more of the total weight;

2.those with a saturated magnetic flux density of 1.6 teslas or more that fall under any of the following:

i.those with a thickness of 0.02 millimeters or less;

ii.those with an electrical resistivity of 2 microohm-meters or more;

(ix)among uranium-titanium alloys or tungsten alloys whose matrix is of iron, nickel or copper, those that fall under all of the following (a) through (d):

(a)those with a density exceeding 17.5 gram per cubic centimeter;

(b)those with an elastic limit exceeding 880 megapascals;

(c)those with a tensile strength exceeding 1,270 megapascals;

(d)those with a coefficient of extension exceeding 8 %;

(x)superconductive materials that fall under any of the following (limited to those with a length exceeding 100 meters or with the total weight exceeding 100 grams):

(a)among superconductive materials that have multiple filaments including niobium titanium filaments, those that fall under the following 1. and 2.:

1.those the filaments of which are embedded in a matrix other than copper or copper alloy;

2.those with a filament cross-section area less than 28/1,000,000 square millimeters;

(b)superconductive materials comprised of superconductive filaments other than niobium titanium that fall under all of the following 1. through 3.:

1.those with a critical temperature exceeding -263.31 degrees centigrade and where a magnetic field is not applied;

2.deleted;

3.those that can hold a superconductive state at a temperature of -268.96 degrees centigrade, when exposed to a magnetic field oriented in any direction perpendicular to the longitudinal axis of the material and corresponding to a magnetic flux density of 12 tesla, with a critical current density exceeding 300 amperes per square millimeter on an overall cross-section of the material;

(c)superconductive materials comprised of superconductive filaments, which can hold a superconductive state at a temperature exceeding -158.16 degrees centigrade;

(xi)liquids or materials that can be used as hydraulic oil or lubricants or liquids that can be used for preventing vibration or as coolant that fall under any of the following:

(a)liquids that can be used as hydraulic oil and the primary component of which fall under any of the following:

1.sila-hydrocarbon oils that fall under all of the following i. through iv.:

i.those with an ignition point exceeding 204 degrees centigrade;

ii.those with a pour point of -34 degrees centigrade or less;

iii.those with a viscosity index of 75 or more;

iv.those that are stable at a temperature of 343 degrees centigrade;

2.chlorofluorocarbons that fall under all of the following i. through v.:

i.those that do not have an ignition point;

ii.those with a self-ignition temperature exceeding 704 degrees centigrade;

iii.those with a pour point of -54 degrees centigrade or less;

iv.those with a viscosity index of 80 or more;

v.those with a boiling point of 200 degrees centigrade or more;

(b)materials that can be used as a lubricant and the primary component of which falls under any of the following:

1.phenylene ether, alkylphenylene ether, phenylene thioether, alkyl phenylene thioether or mixtures thereof, in which the total number of ether groups, or thioether groups or of these functional groups together is 3 or more;

2.fluorinated silicone oils with dynamic viscosity measured at a temperature of 25 degrees centigrade less than 5,000 square millimeters per second;

(c)among liquids usable for vibration prevention with a purity exceeding 99.8% and in which the number of particle impurities of diameter greater than 200 micrometers is less than 25 per 100 milliliters, those with a total content of substances that fall under any of the following that is 85% or more of the total weight:

1.dibromo tetrafluoro ethane;

2.polychloro trifluoro ethylene;

3.polybromo trifluoro ethylene;

(d)among liquids usable for cooling electronic devices and made of fluorocarbons, those falling under the following 1. and 2.:

1.liquids with a total content of substances that fall under any of the following that is 85% or more of the total weight:

i.monomers of perfluoro polyalkyl ether triazine;

ii.monomers of perfluoro aliphatic ether;

iii.perfluoro alkylamine;

iv.perfluoro cycloalkane;

v.perfluoro alkane;

2.liquids that fall under all of the following i. through iii.:

i.those with a density at a temperature of 25 degrees centigrade of 1.5 grams or more per 1 milliliter;

ii.those that are liquids at the temperature of 0 degrees centigrade;

iii.those with a fluorine content of 60% or more of the total weight;

(xii)semi-finished ceramic products, primary ceramic products, ceramic composite materials, or substances that become ceramic materials, and that fall under any of the following:

(a)among titanium borides with a content of metallic impurities less than 0.5% of the total weight, those with an average value of particle diameter of 5 micrometers or less and with a total weight of the particles with diameters exceeding 10 micrometers of 10% or less of the total weight;

(b)semi-finished or primary products of ceramics made of titanium boride with a theoretical density ratio of 98% or more (excluding grinding materials);

(c)among ceramic composite materials that have glasses or oxides as a matrix, those that fall under any of the following:

1.those that are reinforced by fibers that fall under the following i. or ii.:

i.those with a specific strength exceeding 12,700 meters;

ii.those comprised of the combination of elements in any of the following systems:

a.silicon and nitrogen;

b.silicon and carbon;

c.silicon, aluminum, oxygen and nitrogen;

d.silicon, oxygen and nitrogen;

2.those reinforced by continuous fibers made of the following (1) or (2) (excluding those with a tensile strength at a temperature of 1,000 degrees centigrade less than 700 megapascals or those with a creep distortion exceeding 1% when a load that generates stress of 100 megapascals is added for 100 hours at a temperature of 1,000 degrees centigrade):

i.aluminum oxide;

ii.silicon, carbon and nitrogen;

(d)among ceramic composite materials reinforced by particles, whiskers or fibers, those having silicon, zirconium or boron carbide or nitride as a matrix;

(e)polydiorgano silane, polysilazane or polycarbo silazane;

(xiii)non-fluorinated compounds for which polymerization is possible, or non-fluorinated polymers that fall under any of the following:

(a)bismaleimide, aromatic polyamideimide with a glass transition point exceeding 290 degrees centigrade, aromatic polyimide with a glass transition point exceeding 232 degrees centigrade, or aromatic polyetherimides with a glass transition point exceeding 290 degrees centigrade;

(b)thermoplastic crystal liquid copolymers made of the following 1. and 2., among those with a thermo deformation temperature exceeding 250 degrees centigrade where a force of 1.80 newtons per square millimeter is applied:

1.substances that fall under any of the following:

i.phenylene, biphenylene or naphthalene;

ii.phenylene, biphenylene or naphthalene substituted by methyl group, tertiary butyl group or phenyl group;

2.acids that fall under any of the following:

i.terephthalic acid;

ii.hexahydroxy dinaphthoic acid;

iii.tetrahydroxy benzoate;

(c)deleted;

(d)polyallylene ketone;

(e)polyallylene sulfide having allylene groups comprised of biphenylene, tri phenylene or the combination thereof;

(f)polybiphenylene ether sulfone with a glass transition point exceeding 290 degrees centigrade;

(xiv)fluorine compounds that fall under any of the following:

(a)copolymers of vinylidene fluoride with a weight of the part having beta type crystal structure without being elongated of 75 % or more of the total weight;

(b)fluorinated polyimides with a content of bonded fluorine of 10% or more of the total weight;

(c)elastic bodies of fluorinated phosphazenes with a content of bonded fluorine of 30 % or more of the total weight;

(xv)fibers or prepregs or preforms that use the fibers that fall under any of the following:

(a)organic fibers (excluding polyethylene fibers) that fall under any of the following 1. and 2.:

1.those with a specific elastic modulus exceeding 12,700,000 meters;

2.those with a specific strength exceeding 235,000 meters;

(b)carbon fibers that fall under the following 1. and 2.:

1.those with a specific elastic modulus exceeding 14,650,000 meters;

2.those with a specific strength exceeding 268,200 meters;

(c)Inorganic fibers that fall under the following 1. and 2.:

1.those with a specific elastic modulus exceeding 2,540,000 meters;

2.those with melting points, softening points, decomposition points or sublimating temperature exceeding 1,649 degrees centigrade in an inactive environment, but excluding those that fall under any of the following:

i.those with a specific elastic modulus of less than 10,000,000 meters, and that are the short fibers of multiphase polycrystalline alumina fibers with a content of silica of 3% or more of the total weight and that are cut up in short pieces or are random mat shaped;

ii.molybdenum fibers or molybdenum alloy fibers;

iii.boron fibers;

iv.short fibers of ceramic fibers with melting points, softening points, decomposition points or sublimating temperature exceeding 1,770 degrees centigrade in an inactive environment;

(d)fibers made of those that fall under any of the following, or fibers woven by mixing those fibers and fibers that fall under any of (a) through (c) above:

1.aromatic polyetherimides that fall under item (xiii), (a);

2.fibers that fall under any of item (xiii), (b) through (f);

(e)prepregs or preforms that use the following 1. or 2.:

1.those that fall under the following i. and ii.:

i.inorganic fibers that fall under (c);

ii.organic fibers or carbon fibers that fall under the following a. and b.:

a.those with a specific elastic modulus exceeding 10,150,000 meters;

b.those with a specific strength exceeding 177,000 meters;

2.resins that fall under any of the following:

i.those that fall under item (xiii) or item (xiv), (b) with a glass transition point exceeding 110 degrees centigrade;

ii.phenol resin with a glass transition point of 180 degrees centigrade or more when measured by dynamic mechanical analysis;

iii.those with a glass transition point of 232 degrees centigrade or more when measured by dynamic mechanical analysis (excluding phenol resin and those falling under i.);

(xvi)boron with a particle diameter of 60 micrometers or less and with a weight-based purity level of boron of 85% or more, or a mixture thereof, boron alloy with a particle diameter of 60 micrometers or less and with a weight-based purity level of boron of 85% or more, or guanidine nitrate or nitro guanidine.

Article 5Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 6 of appended table 1 of the Export Order fall under any of the following:

(i)bearings that fall under any of the following, or components thereof (excluding balls of precision grade 55 or less as specified by ISO3290 (roller bearings -bearing components- balls for roller bearing units)):

(a)among ball bearings or bearings (excluding tapered roller bearings) with a precision grade 4 or more as specified by Japanese Industrial Standards B 1514-1 (Rolling bearings - Tolerances - Part 1: Radial bearings), those with inner and outer rings and rolling elements specified by International Standard ISO 5593 that are made of monel or beryllium;

(b)deleted;

(c)active magnetic bearing systems that fall under any of the following:

1.systems composed of materials with a magnetic flux density of 2 teslas or more and a yield point exceeding 414 megapascals;

2.systems that are entirely electromagnetic and employ a three-dimensional homopolar bias excitation actuator;

3.systems having a position detector that can be used at temperatures of 177 degrees centigrade and higher;

(ii)among machine tools (limited to those that can process metals, ceramics or composite materials) to which an electronic controller can be attached, those that fall under any of the following (a) through (e) (excluding those that fall under (f) and optical finishing machine tools):

(a)among machine tools capable of lathe turning, those that fall under the following 1. and 2.:

1.machine tools with a linear axis positioning precision of 0.003 millimeters or less in terms of any one or more of the axes when measured according to the method of measurement specified by International Standard ISO 230-2:2006;

2.machine tools that have two or more axes capable of controlling contour;

(b)machine tools capable of milling that fall under any of the following:

1.among machine tools with 3 linear axes that are capable of controlling contour and one rotational axis that is capable of controlling contour and that fall under any of the following, those with a linear axis positioning precision of 0.003 millimeters or less in terms of any one or more of the axes when measured according to the method of measurement specified by International Standard ISO 230-2:2006;

2.among machine tools with 5 or more axes capable of controlling contour, those which fall under any of the following:

i.machine tools with a linear axis positioning precision of 0.003 millimeters or less, when measured according to the method of measurement specified by International Standard ISO 230-2:2006, in terms of any one or more of the linear axes exhibiting a range of motion of less than 1 meter;

ii.machine tools with a linear axis positioning precision of 0.0045 millimeters or less, when measured according to the method of measurement specified by International Standard ISO 230-2:2006, in terms of any one or more of the linear axes exhibiting a range of motion of 1 meter or more and less than 2 meters;

iii.machine tools with a linear axis positioning precision of less than a value obtained by calculation using the following formula, when measured according to the method of measurement specified by International Standard ISO 230-2:2006 and expressed in millimeters, in terms of any one or more of the linear axes exhibiting a range of motion exceeding 2 meters;

0.0045 + 0.007 x (L(range of motion of the linear axis, represented in meters) -2)

iv.parallel mechanism machine tools;

3.jig boring machines with a linear axis positioning precision of 0.003 millimeters or less in terms of any one or more of the axes when measured according to the method of measurement specified by International Standard ISO 230-2:2006;

4.machine tools exclusively designed for fly cutting that fall under any of the following i. and ii.:

i.machine tools for which both the radial direction deflection and axial direction deflection are less than 0.0004 millimeters per single rotation of the spindle;

ii.machine tools with straightness of less than 2 seconds over a travel distance exceeding 300 millimeters;

(c)machine tools capable of grinding that fall under any of the following 1. or 2. (excluding those that fall under any of the following 3. through 5.):

2.machine tools with 5 or more axes capable of controlling contour;

3.external cylindrical grinders, internal cylindrical grinders or internal-external cylindrical grinders designed to grind a cylinder with an external diameter or length of less than 150 millimeters;

4.machine tools designed for use as jig grinders that do not have a Z axis or W axis with positioning precision of less than 0.003 millimeters when measured according to the method of measurement specified by International Standard ISO 230-2:2006;

5.flat surface grinders;

(d)machine tools capable of electrical discharge machining (excluding wire electrical discharge machining) with 2 or more rotational axes capable of controlling contour;

(e)machine tools capable of liquid jet machining, electron beam machines or laser beam machines with two or more rotational axes that fall under any of the following categories 1. or 2.:

1.machine tools or machines capable of controlling contour;

2.machine tools or machines with rotational axis positioning precision of less than 0.003 degrees when measured according to the method of measurement specified by International Standard ISO 230-2:2006;

(f)machine tools that were designed exclusively for the manufacture of any of the following:

1.gears;

2.crank shafts or cam shafts;

3.tools or blades;

4.extruder worms;

5.gemstones;

6.dentures;

(iii)among machine tools (limited to those that can process metals, ceramics or composite materials) to which an electronic controller can be attached and are capable of deep bore drilling or lathe turning (limited to those that are capable of deep bore drilling), those that can bore a hole to a depth exceeding 5,000 millimeters;

(iv)optical finishing machine tools capable of numerical control and of producing nonspherical optical surfaces by selectively removing materials, and that fall under all of the following (a) through (d):

(a)those with a finishing shape and dimensional tolerance of 1.0 micrometers or less;

(b)those having a root mean square roughness of less than 100 nanometers when finished;

(c)those with four or more axes capable of controlling contour;

(d)those using any of the following methods:

1.magnetorheological finishing;

2.electrorheological finishing;

3.energy particle beam finishing;

4.inflatable membrane tool finishing;

5.fluid jet finishing;

(v)machine tools designed for finish processing of gears with a Rockwell hardness of 40 or greater as measured by the C scale according to the measurement methods specified in Japanese Industrial Standard Z2245 (Rockwell hardness testing method), with pitch diameter exceeding 1,250 millimeters and face width with pitch diameter exceeding 15% of spur gears, helical gears, or double-helical gears, which are capable of finish processing with a precision grade of 3 or higher as specified by International Standard ISO 1328 (ISO system of precision for cylindrical gears) or the components, controllers, or accessories thereof;

(vi)isostatic presses that fall under any of the following categories (a) and (b), or the components or accessories thereof:

(a)isostatic presses having hollow cavities with an internal diameter of 406 millimeters or more and capable of controlling temperature inside the hollow cavities;

(b)isostatic presses that fall under any of the following:

1.isostatic presses with a maximum pressure exceeding 207 megapascals;

2.isostatic presses capable of controlling temperatures exceeding 1,500 degrees centigrade in hollow cavities;

3.isostatic presses that incorporate devices to inject hydrocarbons and devices to remove gaseous decomposition products;

(vii)among coating devices for non-electronic substrates which utilize the coating method listed in column 2 of the appended table 3 and perform the coatings listed in column 4 of the same table on base materials listed in column 3 in the same table, those which fall under any of the following, or the components especially designed for the automatic operation thereof:

(a)coating devices that employ methods of fixing to the substrate surface coating materials that are produced by the chemical reaction of source gases, and that fall under any of the following 1. and 2.:

1.coating devices that employ any of the following methods:

i.pulse method;

ii.controlled nucleation thermochemical deposition method;

iii.methods that fix coating materials to the substrate surface by plasma arc;

2.coating devices that fall under any of the following:

i.coating devices incorporating rotational axis seals that can be used at 10 millipascals or less;

ii.coating devices that have internal film thickness control functions;

(b)coating devices that employ ion implantation method and with a beam current of 5 milliamperes or more;

(c)among coating devices that employ methods of affixing to the substrate surface coating materials that have been vaporized by electron beams, and that incorporate power supply devices with a capacity exceeding 80 kilowatts, those that have the equipment falling under any of the following:

1.coating devices that effects molten liquid level control by employing laser light to control ingot feeding;

2.deposition rate monitoring devices capable of achieving control by employing computers and that utilize the principle of ionized atom photoluminescence of ionized atoms occurring in vapor flow to control the rate of deposition when coating with two or more elements;

(d)plasma spray coating devices that fall under the following:

1.plasma spray coating devices that can reduce pressure in vacuum chambers prior to plasma spraying to 10 millipascals and that can be used at a pressure of 10 kilopascals or less (referring to plasma spraying within 30 centimeters measured from the mouth of the nozzle;

2.plasma spray coating devices with internal film thickness control function;

(e)coating devices that use the sputtering method and has a current density of 10 milliamperes per square centimeter or more for hourly deposition rates of 15 micrometers or more;

(f)coating devices that employ methods to fix coating materials ionized by arc discharge to the substrate surface and that have a magnetic field to control arc spots on the cathodes;

(g)ion plating production equipment that can measure the following characteristics of the coating:

1.thickness and deposition rate of coating materials fixed to the substrate surface;

2.the optical properties of the substrate surface;

(viii)measuring devices (including machine tools that can be used as measuring devices; hereinafter the same applies in this Article) or components thereof that fall under any of the following (excluding those falling under item (ii) or (iii)):

(a)coordinate measuring instruments that are controlled by computer or numerically- controlled coordinate measuring equipment and that, when the precision of measurement of intervals is measured according to the measurement method specified in International Standard ISO 10360-2:2001 for any of the points of measurement within the limits of operation, have a maximum permissible error of length measurement of the axis displayed in micrometers that is equal to or less than the value obtained by multiplying the length of the measured axis in millimeters by 0.001 and then adding 1.7;

(b)components of equipment falling under Article 1, item (xvii), (b), 3. designed for providing a feedback function to the relevant equipment;

(c)measuring devices that measure surface roughness by treating the angles of the scattering of light as functions and that have a sensitivity of 0.5 nanometers or less;

(ix)robots (excluding operating robots and sequenced robots) that fall under any of the following, or the control equipment or end effectors thereof:

(a)robots that are capable of conducting complete instant three-dimensional image processing or complete three-dimensional scene analysis in order to create or rewrite programs or the numeric data of programs;

(b)robots of explosion-proof construction as specified in Japanese Industrial Standard C60079-0 (excluding those used for painting);

(c)robots designed to withstand a total absorbed atomic radiation dose exceeding 5,000 grays on a silicon conversion basis;

(d)devices designed for use at altitudes exceeding 30,000 meters;

(x)among feedback devices, compound rotary tables or spindles that can change angles in relation to axes other than the center line axis during processing, which are components or auxiliaries for measuring devices of machine tools, those that fall under any of the following:

(a)feedback devices for positions on a straight line in which the precision of the devices possesses a value that is less than the value obtained by adding 0.0008 millimeters to 6% of one hundred thousandth (100,000th) of the effective measurement length of the devices in millimeters;

(b)feedback devices for angles in which the precision of the devices is less than 0.00025 degrees;

(c)compound rotary tables or spindles that can change angles in relation to axes other than the center line axis during processing, and that by being fitted to machine tools make the machine tools fall under any of the specifications prescribed in item (ii) through item (v);

(xi)spin-forming machines that fall under all of the following (a), (b), and (c):

(a)spin-forming machines or flow-forming machines that are capable of exerting control by numerically - controlled coordinate measuring equipment or computers;

(b)spin-forming machines or flow-forming machines with 3 or more axes capable of controlling contour;

(c)spin-forming machines or flow-forming machines with a roller welding force exceeding 60 kilonewtons.

Article 6Goods with specifications prescribed by Order of the Ministry of Economy, Trade and Industry in row 7 of appended table 1 of the Export Order fall under any of the following:

(i)integrated circuits that fall under any of the following:

(a)integrated circuits designed to withstand any of the following categories of atomic radiation:

1.integrated circuits with a total absorbed dose of 5,000 grays or more on a silicon conversion basis;

2.integrated circuits with an absorbed dose of 5,000,000 grays or more in one second on a silicon conversion basis;

3.integrated circuits with a neutron flux corresponding to 1 megaelectron volt (integrated value) of 50 trillion or more per square centimeter (excluding MIS type);

(b)microprocessors, microcomputers, microcontrollers, programmable ROM that can electronically delete programs (including flash memory), static RAM, and devices using storage elements that employ compound semiconductors, analog-to-digital converters, digital-to-analog converters, electro-optical integrated circuits or optical integrated circuits used for signal processing, field programmable logic devices, custom integrated circuits (excluding those for which it is possible to determine whether or not they are goods that fall under any of (c) through (h), (k), or (l), or those for which it is possible to determine whether or not they are goods falling under any of the goods in the middle column of rows 5 through 15 of the appended table 1 of the Export Order; hereinafter the same applies in this Article) or FFT processors that fall under any of the following categories (excluding integrated circuits used for civil automobiles, or civil railway vehicles):

1.devices designed for use at temperatures exceeding 125 degrees centigrade;

2.devices designed for use at temperatures of less than -55 degrees centigrade;

3.devices designed for use at all temperatures in a range from -55 degrees centigrade or more to 125 degrees centigrade or less;

(c)microprocessors, microcomputers or microcontrollers employing compound semiconductors with a maximum clock frequency exceeding 40 megahertz;

(d)deleted;

(e)devices used for analog-to-digital conversion or digital-to-analog conversion that fall under any of the following (excluding those designed for use in other goods):

1.devices used for analog-to-digital conversion that fall under any of the following:

i.devices with 8 bits to less than 10 bits resolution with an output rate exceeding 1 giga samples per second;

ii.devices with 10 bits or more to less than 12 bits resolution with an output rate exceeding 300 mega samples per second;

iii.devices with 12 bits resolution with an output rate exceeding 200 mega samples per second;

iv.devices with resolution exceeding 12 bits and less than 14 bits, with an output rate exceeding 125 mega samples per second;

v.devices with resolution exceeding 14 bits, with an output rate exceeding 20 mega samples per second;

2.devices used for digital-to-analogue conversion, which fall under any of the following:

i.devices with a resolution of 10 bits or more with a coordinated update rate exceeding 3,500 mega samples per second;

ii.devices with a resolution of 12 bits or more with a coordinated update rate exceeding 1,250 mega or more samples per second, which fall under any of the following:

a.those with an analog output whose settling time to change from full scale level to a level of 0.024 % of full scale is less than nine nanoseconds, where operated with a resolution of 12 bits;

b.those with a spurious free dynamic range exceeding 68 decibels in cases where a full scale output is made by digital input signals of 100 megahertz or where maximum full scale output is made by digital input signals of less than 100 megahertz;

(f)electro-optical integrated circuits or optical integrated circuits used for signal processing that fall under all of the following 1. through 3.:

1.integrated circuits possessing laser oscillators;

2.integrated circuits possessing photo-detectors;

3.integrated circuits possessing optical waveguides;

(g)field programmable logic devices that fall under any of the following (excluding those designed for use in other goods):

1.devices with a maximum number of single-ended digital input and output at 500 or more;

2.devices with serial transceivers which have a total maximum data speed of 200 gigabits or more per second;

(h)devices employing neural networks;

(i)custom integrated circuits that fall under any of the following:

1.custom integrated circuits with terminals exceeding 1,500;

2.custom integrated circuits with a basic gate propagation delay time of less than 0.02 nanoseconds;

3.custom integrated circuits with an operating frequency exceeding 3 gigahertz;

(j)digital devices employing compound semiconductors that fall under any of the following (excluding those which fall under any of (c), (e) through (i), and (k)):

1.digital devices with a number of equivalent gates exceeding 3,000 on a dual-entry gate conversion basis;

2.digital devices with a toggle frequency exceeding 1.2 gigahertz;

(k)FFT processors with a Fast Fourier Transformation rated execution time expressed in milliseconds that is less than the value calculated by the following formula;

(l)direct digital synthesizer (DDS) integrated circuits that fall under any of the following:

1.direct digital synthesizer (DDS) integrated circuits with a digital-to-analogue conversion clock frequency of 3.5 gigahertz or more and with a digital-to-analogue conversion resolution of 10 bits or more and less than 12 bits;

2.direct digital synthesizer (DDS) integrated circuits with a digital-to-analogue conversion clock frequency of 1.25 gigahertz or more and with a digital-to-analogue conversion resolution of 12 bits or more;

(ii)components of devices using microwaves or millimeter waves that fall under any of the following:

(a)electron tubes that fall under the following 1. or 2. (excluding those that fall under 3. following):

1.traveling wave tubes that fall under any of the following:

i.traveling wave tubes with an operating frequency exceeding 31.8 gigahertz;

ii.traveling wave tubes having a hot cathode for which the time from the heating of the filament to attainment of the rated output is less than 3 seconds;

iii.traveling wave tubes with cavity coupling in which the value for the instantaneous bandwidth divided by the center frequency exceeds 7% or a maximum output exceeding 2.5 kilowatts;

iv.traveling wave tubes with helical form that fall under any of the following:

a.devices having an instantaneous bandwidth exceeding 1 octave, and for which the value obtained by multiplying the average output value expressed in kilowatts by the operating frequency value expressed in gigahertz exceeds 0.5;

b.devices having an instantaneous bandwidth of 1 octave or less, and for which the value obtained by multiplying the average output value expressed in kilowatts by the operating frequency value expressed in gigahertz exceeds 1;

c.devices designed for space use;

2.crossfield amplifier tubes with a gain exceeding 17 decibels;

3.devices designed to use frequency bands allotted for wireless transmission by the International Telecommunication Union (excluding frequency bands allotted for wireless radio determination) that fall under any of the following:

i.devices with an operating frequency of 31.8 gigahertz or less;

ii.devices other than those designed exclusively for use in space that have an average output of 50 watts or less and an operating frequency exceeding 31.8 gigahertz and 43.5 gigahertz or less;

(b)impregnated cathodes designed for use in electron tubes with continuous emission current density under rated operating conditions exceeding 5 amperes per square centimeter;

(c)power amplifiers employing microwave monolithic integrated circuits, which fall under any of the following:

1.among devices with an operating frequency exceeding 2.7 gigahertz and 6.8 gigahertz or less for which the value of the instantaneous bandwidth divided by the center frequency exceeds 15%, those which that fall under any of the following:

i.devices with an operating frequency exceeding 2.7 gigahertz and 2.9 gigahertz or less with a peak saturation output value exceeding 75 watts (48.75 dBm);

ii.devices with an operating frequency exceeding 2.9 gigahertz and 3.2 gigahertz or less with a peak saturation output value exceeding 55 watts (47.4 dBm);

iii.devices with an operating frequency exceeding 3.2 gigahertz and 3.7 gigahertz or less with a peak saturation output value exceeding 40 watts (46 dBm);

iv.devices with an operating frequency exceeding 3.7 gigahertz and 6.8 gigahertz or less with a peak saturation output value exceeding 20 watts (43 dBm);

2.among devices with an operating frequency exceeding 6.8 gigahertz and 16 gigahertz or less for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%, those which that fall under any of the following:

i.devices with an operating frequency exceeding 6.8 gigahertz and 8.5 gigahertz or less with a peak saturation output value exceeding 10 watts (40 dBm);

ii.devices with an operating frequency exceeding 8.5 gigahertz and 16 gigahertz or less with a peak saturation output value exceeding 5 watts (37 dBm);

3.among devices with an operating frequency exceeding 16 gigahertz and 31.8 gigahertz or less with a peak saturation output value exceeding 3 watts (34.77 dBm), those for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%;

4.devices with an operating frequency exceeding 31.8 gigahertz and 37 gigahertz or less, and a peak saturation output value exceeding 0.1 nanowatts (-70 dBm);

5.among devices with an operating frequency exceeding 37 gigahertz and 43.5 gigahertz or less and with a peak saturation output value exceeding 1.0 watts (30 dBm), those for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%;

6.devices with an operating frequency exceeding 43.5 gigahertz, and 75 gigahertz or less and with a peak saturation output value exceeding 31.62 milliwatts (15 dBm), those for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%;

7.devices with an operating frequency exceeding 75 gigahertz and 90 gigahertz or less and with a peak saturation output value exceeding 10 milliwatts (10 dBm), those for which the value of the instantaneous bandwidth divided by the center frequency exceeds 5%;

8.devices with an operating frequency exceeding 90 gigahertz, and a peak saturation output value exceeding 0.1 nanowatts (-70 dBm);

(d)microwave discrete transistors that fall under any of the following:

1.among devices with an operating frequency exceeding 2.7 gigahertz and 6.8 gigahertz or less, those which fall under any of the following:

i.devices with an operating frequency exceeding 2.7 gigahertz and 2.9 gigahertz or less and with a peak saturation output value exceeding 400 watts (56 dBm);

ii.devices with an operating frequency exceeding 2.9 gigahertz and 3.2 gigahertz or less and with a peak saturation output value exceeding 205 watts (53.12 dBm);

iii.devices with an operating frequency exceeding 3.2 gigahertz and 3.7 gigahertz or less and with a peak saturation output value exceeding 115 watts (50.6 dBm);

iv.devices with an operating frequency exceeding 3.7 gigahertz and 6.8 gigahertz or less and with a peak saturation output value exceeding 60 watts (47.78 dBm);

2.among devices with an operating frequency exceeding 6.8 gigahertz and 31. 8 gigahertz or less, those which fall under any of the following:

i.devices with an operating frequency exceeding 6.8 gigahertz and 8.5 gigahertz or less and with a peak saturation output value exceeding 50 watts (47 dBm);

ii.devices with an operating frequency exceeding 8.5 gigahertz and 12 gigahertz or less and with a peak saturation output value exceeding 15 watts (41.76 dBm);

iii.devices with an operating frequency exceeding 12 gigahertz and 16 gigahertz or less and with a peak saturation output value exceeding 40 watts (46 dBm);

iv.devices with an operating frequency exceeding 16 gigahertz and 31.8 gigahertz or less and with a peak saturation output value exceeding 7 watts (38.45 dBm);

3.devices with an operating frequency exceeding 31.8 gigahertz and 37 gigahertz or less and with a peak saturation output value exceeding 0.5 watts (27 dBm);

4.devices with an operating frequency exceeding 37 gigahertz and 43.5 gigahertz or less and with a peak saturation output value exceeding 1 watt (30 dBm);

5.devices with an operating frequency exceeding 43.5 gigahertz, and a peak saturation output value exceeding 0.1 nanowatts (-70 dBm);

(e)solid-state microwave amplifiers or assemblies or modules containing solid-state microwave amplifiers that fall under any of the following (excluding power amplifiers employing microwave monolithic integrated circuits):

i.devices with an operating frequency exceeding 2.7 gigahertz and 2.9 gigahertz or less and with a peak saturation output value exceeding 500 watts (57 dBm);

ii.devices with an operating frequency exceeding 2.9 gigahertz and 3.2 gigahertz or less and with a peak saturation output value exceeding 270 watts (54.3 dBm);

iii.devices with an operating frequency exceeding 3.2 gigahertz and 3.7 gigahertz or less and with a peak saturation output value exceeding 200 watts (53 dBm);

iv.devices with an operating frequency exceeding 3.7 gigahertz and 6.8 gigahertz or less and with a peak saturation output value exceeding 90 watts (49.54 dBm);

2.among devices with an operating frequency exceeding 6.8 gigahertz and 31.8 gigahertz or less for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%, those which fall under any of the following:

i.devices with an operating frequency exceeding 6.8 gigahertz and 8.5 gigahertz or less and with a peak saturation output value exceeding 70 watts (48.54 dBm);

ii.devices with an operating frequency exceeding 8.5 gigahertz and 12 gigahertz or less and with a peak saturation output value exceeding 50 watts (47 dBm);

iii.devices with an operating frequency exceeding 12 gigahertz and 16 gigahertz or less and with a peak saturation output value exceeding 30 watts (44.77 dBm);

iv.devices with an operating frequency exceeding 16 gigahertz and 31.8 gigahertz or less and with a peak saturation output value exceeding 20 watts (43 dBm);

3.devices with an operating frequency exceeding 31.8 gigahertz and 37 gigahertz or less, and a peak saturation output value exceeding 0.5 nanowatts (27 dBm);

4.among devices with an operating frequency exceeding 37 gigahertz and 43.5 gigahertz or less and with a peak saturation output value exceeding 2 watts (33 dBm), those for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%;

5.among devices with an operating frequency exceeding 43.5 gigahertz, those which fall under any of the following:

i.among devices with an operating frequency exceeding 43.5 gigahertz and 75 gigahertz or less and with a peak saturation output value exceeding 0.2 watts (23 dBm), those for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%;

ii.among devices with an operating frequency exceeding 75 gigahertz and 90 gigahertz or less and with a peak saturation output value exceeding 20 milliwatts (13 dBm), those for which the value of the instantaneous bandwidth divided by the center frequency exceeds 5%;

iii.devices with an operating frequency exceeding 90 gigahertz and with a peak saturation output value exceeding 0.1 nanowatts (-70 dBm);

6.devices with an operating frequency exceeding 2.7 gigahertz that fall under all of the following categories i. to iii.:

i.devices for which the value of the peak saturation output value expressed in watts multiplied by the maximum operating frequency expressed in gigahertz squared exceeds 400;

ii.devices for which the value of the instantaneous bandwidth divided by the center frequency is 5% or more;

iii.devices for which the value of the distance of vertically adjacent amplifiers or assemblies, or modules in array alignment expressed in centimeters multiplied by the minimum operating frequency expressed in gigahertz is 15 or less;

(f)electronically or magnetically tunable band-pass filters that fall under the following 1. and 2.:

1.devices having 6 or more variable frequency resonators capable of tuning across a half-octave frequency band in less than 10 microseconds;

2.devices capable of band-passing in excess of 0.5% of the center frequency;

(g)electronically or magnetically tunable band-elimination filters that fall under the following 1. and 2.:

1.devices having 6 or more variable frequency resonators capable of tuning across a half-octave frequency band in less than 10 microseconds;

2.devices capable of eliminating a band less than 0.5% of the center frequency;

(h)deleted;

(i)harmonic mixers or converters designed to expand the frequency bands of radio frequency analyzers, signal generators employing frequency synthesizers, network analyzers or microwave test receivers, and to have the frequency bands of such equipment fall under any of item (xii), (a), (b) or (c), item (xiii), (a), (b) or (e), item (xiv) or item (xv), (a);

(j)microwave power amplifiers equipped with electron tubes that fall under (a), and that fall under the following categories 1. and 2. (excluding equipment used on frequency bands allotted for wireless transmission by the International Telecommunication Union (excluding frequency bands allotted for wireless radio determination)):

1.devices with an operating frequency exceeding 3 gigahertz;

2.devices with a mass ratio of average output power exceeding 80 watts per kilogram and with a volume of less than 400 cubic centimeters;

(k)microwave power modules having traveling wave tubes, microwave monolithic integrated circuits and power conditioners, which fall under all of the following 1. through 3.:

1.those having a turn-on time from off to fully operational in less than 10 seconds;

2.those of which the volume is less than the numerical value obtained by multiplying the maximum rated output expressed in watts by 10 cubic centimeters per watt;

3.those having an instantaneous bandwidth of 1 octave or more, which fall under any of the following:

i.for those with a frequency of 18 gigahertz or less, those with a radio frequency output exceeding 100 watts;

ii.those with a frequency exceeding 18 gigahertz;

(l)oscillators or assemblies having oscillation function, which are designed to fall under the following 1. and 2.:

1.those for which the value of the single side band phase noise ratio per hertz relative to carrier signal is less than the value calculated according to the following method in any frequency band where the difference between the operating frequency and the offset frequency exceeds 10 hertz and less than 10 kilohertz:

20log10 (Operating frequency, expressed in megahertz) - 20log10 (Difference between the operating frequency and the offset frequency, expressed in hertz) -126

2.those for which the value of the single side band phase noise ratio per hertz relative to carrier signal is less than the value calculated according to the following method in any frequency band where the difference between the operating frequency and the offset frequency is 10 kilohertz or more and less than 500 kilohertz:

20log10(Difference between the operating frequency and the offset frequency, expressed in hertz) - 114

(m)among assemblies employing frequency synthesizers, those falling under any of the following:

1.assemblies for which the required time for frequency change is less than 156 picoseconds;

2.within the range of a combined output frequency exceeding 4.8 gigahertz and 10.6 gigahertz or less, assemblies for which the required time for any frequency change exceeding 1.6 gigahertz is less than 100 microseconds;

3.within the range of a combined output frequency exceeding 10.6 gigahertz and 31.8 gigahertz or less, assemblies for which the required time for any frequency change exceeding 550 megahertz is less than 250 microseconds;

4.within the range of a combined output frequency exceeding 31.8 gigahertz and below 43.5 gigahertz, assemblies for which the required time for any frequency change exceeding 550 megahertz is less than 500 microseconds;

5.within the range of a combined output frequency exceeding 43.5 gigahertz and 56 gigahertz or less, assemblies for which the required time for any frequency change exceeding 550 megahertz is less than 1 microsecond;

6.within the range of a combined output frequency exceeding 56 gigahertz and 75 gigahertz or less, assemblies for which the required time for any frequency change exceeding 2.2 gigahertz is less than 1 millisecond;

7.within the range of a combined output frequency exceeding 75 gigahertz, assemblies for which the required time for frequency change is less than 1 millisecond;

(iii)signal processing equipment utilizing elastic waves or acousto-optic effects that fall under any of the following (excluding those solely having any of the function of specific band-pass, low band pass, high band pass, band elimination, or resonance), or the components thereof:

(a)signal processing equipment using surface elastic waves or pseudo-surface elastic waves that fall under any of the following:

1.signal processing equipment with a carrier frequency exceeding 6 gigahertz;

2.signal processing equipment with a carrier frequency exceeding 6 gigahertz and 2.5 gigahertz or less that falls under any of the following:

i.signal processing equipment with a main lobe to side lobe power ratio exceeding 65 decibels;

ii.signal processing equipment for which the numeric value of the maximum delay time expressed in microseconds multiplied by the value of the bandwidth expressed in megahertz exceeds 100;

iii.signal processing equipment with a bandwidth exceeding 250 megahertz;

iv.signal processing equipment for which the distributed delay time (this refers to the difference between the maximum and minimum delay time values for a frequency) exceeds 10 microseconds;

3.signal processing equipment with a carrier frequency of 1 gigahertz or less that falls under any of the following:

i.signal processing equipment for which the numeric value obtained by multiplying the maximum delay time expressed in microseconds by the value of the bandwidth expressed in megahertz exceeds 100;

ii.signal processing equipment for which the distributed delay time exceeds 10 microseconds;

iii.signal processing equipment with a main lobe to side lobe power ratio exceeding 65 decibels and with a bandwidth exceeding 100 megahertz;

(b)signal processing equipment that utilizes bulk elastic waves and that is capable of performing direct signal processing at frequencies exceeding 6 gigahertz;

(c)signal processing that utilizes the interaction of elastic waves and light waves and that is capable of performing direct signal or image processing;

(iv)among devices using superconductive material that are electron devices or electronic circuits with components using superconductive materials, those designed for use at temperatures lower than the critical temperature of the superconductive materials used and that fall under any of the following:

(a)devices possessing a current switching function for use in digital circuits with superconducting gates for which the value obtained by multiplying the delay time per gate by the power consumption per gate is less than 1/100 billion millijoules;

(b)devices having frequency separation function and having resonant circuits with a cue value exceeding 10,000;

(v)cells that fall under any of the following:

(a)primary cells with an energy density exceeding 550 watts hours per kilogram at a temperature of 20 degrees centigrade;

(b)secondary cells with an energy density exceeding 300 watts hours per kilogram at a temperature of 20 degrees centigrade;

(vi)high voltage capacitors that fall under any of the following:

(a)capacitors with a repeated cycle of less than 10 hertz that fall under all of the following categories 1. to 3.:

1.capacitors with a rated voltage of 5 kilovolts or more;

2.capacitors with an energy density of 250 joules per kilogram or more;

3.capacitors with a total energy of 25 kilojoules or more;

(b)capacitors with a repetitive cycle of 10 hertz or more and that fall under all of the following categories 1. to 4.:

1.capacitors with a rated voltage of 5 kilovolts or more;

2.capacitors with an energy density of 50 joules per kilogram or more;

3.capacitors with a total energy of 100 joules or more;

4.capacitors designed for a charge/discharge cycle life equal to or more than 10,000 cycles;

(vii)superconducting magnets (including solenoid coil types) designed to fully generate or dissipate a complete magnetic field in less than one second that fall under all of the following categories (a) to (c):

(a)superconducting magnets that discharge energy exceeding 10 kilojoules in the first second of demagnetization;

(b)superconducting magnets with a coil internal diameter exceeding 250 millimeters;

(c)superconducting magnets with a rated maximum current density exceeding 300 amperes per square millimeter or with a rated magnetic flux density exceeding 8 teslas;

(vii)-2among solar batteries, cell-interconnect-coverglass (CIC) assemblies, solar panels or solar arrays, which are designed for space use, those for which the minimum average conversion efficiency when irradiated by 1,367 watts per square meter under air mass zero, exceeds 20 % at an operating temperature of 28 degrees centigrade;

(viii)rotary input type absolute encoders of which the absolute value of the conversion error of the angles is 1 second or less;

(viii)-2among thyristor devices or thyristor modules switching pulse output, which employ a switching method controlled electronically or optically or a switching method with a controlled electron emission, those that fall under any of the following (excluding those incorporated into a device designed for use in civil railway vehicles or civil aircraft):

(a)those with a maximum turn-on current exceeding 30,000 amperes per microsecond, and off-state voltage exceeding 1,100 volts;

(b)those with a maximum turn-on current exceeding 2,000 amperes per microsecond, and that fall under the following 1. and 2.:

1.those with an off-state voltage of 3,000 volts or more;

2.those with a maximum current of 3,000 amperes or more;

(viii)-3semiconductor devices or semiconductor modules that control electric power or rectify electric signals, and that fall under all of the following (a) through (c) (excluding those incorporated into a device designed for use in civil automobiles, civil railway vehicles, or civil aircraft):

(a)those designed for a maximum operating junction temperature to exceed 215 degrees centigrade;

(b)those with a repetitive peak off-state voltage exceeding 300 volts;

(c)those with a continuous current exceeding one ampere;

(ix)among sampling oscilloscopes utilizing the method of real-time sampling, those for which, where the input 3-decibel bandwidth of any channel is 60 gigahertz or more, the root-mean-square of noise voltage at the longitudinal axis range where noise of the channel is the smallest is less than 2% of the full scale;

(x)waveform digitizers and transient recorders that fall under the following categories (a) and (b):

(a)waveform digitizers and transient recorders with a sample rate of 200 million samples per second or more and with a resolution of 10 bits or more;

(b)waveform digitizers and transient recorders designed to continuously output data at 2 gigabits per second or more;

(xi)digital instrumentation recorders using magnetic disk storage technology and designed for use in instrumentation systems that fall under the following categories (a) and (b):

(a)digital instrumentation recorders with a sampling rate, for data to be measured, of 100 million samples per second or more, and a resolution of 8 bits or more;

(b)digital instrumentation recorders designed to be capable of continuously recording sample data at 1 gigabit per second or more;

(xii)wireless frequency analyzers that fall under any of the following:

(a)wireless frequency analyzers for which the resolution bandwidth for 3 decibels exceeds 10 megahertz in any frequency band exceeding 31.8 gigahertz and 37.5 gigahertz or less;

(b)wireless frequency analyzers of which the displayed average noise level is less than -150 dBm per hertz in any frequency band exceeding 43.5 gigahertz and 75 gigahertz or less;

(c)wireless frequency analyzers capable of analyzing frequencies exceeding 75 gigahertz;

(d)wireless frequency analyzers that fall under following 1. and 2.:

1.wireless frequency analyzers with real time bandwidth exceeding 85 megahertz;

2.wireless frequency analyzers that detect signals with a length of 15 microseconds or less with a probability of 100%, with a damping, due to gap or window effect, of less than 3 decibels from the total amplitude;

(e)wireless frequency analyzers with frequency mask trigger function that are capable of detecting signals with a length of 15 microseconds or less with a probability of 100%;

(xiii)among signal generators employing frequency synthesizers, those for which the precision and stability of combined output frequency devices are regulated by the input frequency or the devices' standard reference oscillator and that fall under any of the following (excluding signal generators employing frequency synthesizers designed for use in equipment and other goods that regulate the output frequency by the value obtained by adding or subtracting the frequencies of 2 or more quartz crystal oscillators or by the value obtained by multiplying these values):

(a)signal generators which generate, in any frequency band exceeding 31.8 gigahertz and 75 gigahertz or less, pulse modulated signals that fall under the following 1. and 2.:

1.pulse modulated signals with a pulse width of less than 100 nanoseconds;

2.pulse modulated signals with an on/off ratio of 65 decibels or more;

(b)signal generators with an output exceeding 100 milliwatts (20 dBm), in any frequency band exceeding 43.5 gigahertz and 75 gigahertz or less;

(c)signal generators that fall under any of the following:

1.deleted;

2.within the range of a combined output frequency exceeding 4.8 gigahertz and 10.6 gigahertz or less, signal generators for which the required time for any frequency change exceeding 1.6 gigahertz is less than 100 microseconds;

3.within the range of a combined output frequency exceeding 10.6 gigahertz and 31.8 gigahertz or less, signal generators for which the required time for any frequency change exceeding 550 megahertz is less than 250 microseconds;

4.within the range of a combined output frequency exceeding 31.8 gigahertz and 43.5 gigahertz or less, signal generators for which the required time for any frequency change exceeding 550 megahertz is less than 500 microseconds;

5.within the range of a combined output frequency exceeding 43.5 gigahertz and 56 gigahertz or less, signal generators for which the required time for any frequency change exceeding 550 megahertz is less than 1 millisecond;

6.within the range of a combined output frequency exceeding 56 gigahertz and 75 gigahertz or less, signal generators for which the required time for any frequency change exceeding 2.2 gigahertz is less than 1 millisecond;

(d)signal generators for which the value of the single side band phase noise ratio per hertz relative to carrier signal falls under the following 1. and 2.:

1.within any band of a combined output frequency exceeding 3.2 gigahertz and 75 gigahertz or less, signal generators for which the value of the single side band phase noise ratio per hertz relative to carrier signal is less than the value calculated according to the following method in any frequency band where the difference between the operating frequency and the offset frequency exceeds 10 hertz and less than 10 kilohertz:

20log10 (Operating frequency, expressed in megahertz) - 20log10 (Difference between the operating frequency and the offset frequency, expressed in hertz) - 126

2.within any band of a combined output frequency exceeding 3.2 gigahertz and 75 gigahertz or less, signal generators for which the value of the single side band phase noise ratio per hertz relative to carrier signal is less than the value calculated according to the following method in any frequency band where the difference between the operating frequency and the offset frequency exceeds 10 hertz and less than 10 kilohertz:

20log10 (Operating frequency, expressed in megahertz) - 20log10 (Difference between the operating frequency and the offset frequency, expressed in hertz) - 114

(e)signal generators with a maximum combined output frequency exceeding 75 gigahertz;

(xiv)Network analyzers that fall under any of the following:

(a)within any band of a combined output frequency exceeding 43.5 gigahertz and 75 gigahertz or less, network analyzers with an output exceeding 31.62 milliwatts (15dBm);

(b)within any band of a combined output frequency exceeding 75 gigahertz and 110 gigahertz or less, network analyzers with an output exceeding 1 milliwatt (0 dBm);

(c)within the frequency band exceeding 50 gigahertz and 110 gigahertz or less, network analyzers with a function of non-linear vector measurement (excluding those which fall under (a) or (b));

(d)signal generators with a maximum combined output frequency exceeding 110 gigahertz;

(xv)microwave receivers that fall under the following (a) and (b):

(a)devices designed for use at frequencies exceeding 110 gigahertz;

(b)devices that can simultaneously measure amplitude and phase;

(xvi)atomic frequency standards that fall under any of the following:

(a)atomic frequency standards not employing rubidium and for which stability when oscillated continuously for a 30 day period is less than 1/ 100 billion;

(b)atomic frequency standards designed for space use;

(c)atomic frequency standards not designed for space use and which fall under all of the following 1. through 3.:

1.atomic frequency standards employing rubidium;

2.atomic frequency standards with a stability of less than 1/ 100 billion when oscillated continuously for a 30 day period;

3.atomic frequency standards with the power consumption of less than 1 watt;

(xvi)-2among spray cooling method temperature control devices that are capable of cyclic use of the cooling medium within a closed device, those having atomizing nozzles specifically designed to spray isolating cooling medium on electric components and bring the components' temperature to within a fixed range, or the components specifically designed for that purpose;

(xvii)equipment for the manufacture or test of semiconductor devices, integrated circuits or semiconductor materials (referred to as "semiconductor manufacturing equipment" in (e)), or masks or reticles for the manufacture of integrated circuits, which fall under any of the following, or the components and accessories thereof:

(a)crystal epitaxial growth systems that fall under any of the following:

1.film of materials capable of generating films other than silicon of which the absolute value of the tolerance of the film thickness along a length of 75 millimeters or more is less than 2.5 %;

2.metal-organic chemical vapor deposition reactors that epitaxially grow compound semiconductors containing any two or more of the elements among aluminum, gallium, indium, arsenic, phosphor, antimony, and nitrogen;

3.molecular beam epitaxial growth systems employing gas sources or solid sources;

(b)ion implanters that fall under any of the following:

1.deleted;

2.ion implanters designed and optimized to operate when implanting hydrogen, heavy hydrogen, or helium, at beam energies of 20 kiloelectron volts or more and a beam current of 10 milliamperes or more;

3.ion implanters which are capable of direct writing;

4.ion implanters implanting oxygen on a heated semiconductor material substrate at beam energies of 65 kiloelectron volts or more and beam currents of 45 milliamperes or more;

5.ion implanters designed and optimized to operate, when implanting silicon on a semiconductor material substrate heated to a temperature of 600 degrees centigrade or more, at beam energies of 20 kiloelectron volts or more and a beam current of 10 milliamperes or more;

(c)among anisotropic plasma dry etching devices having cassette-to-cassette functions and load lock functions or devices designed to be connected to and used with equipment falling under (e), those that fall under the following 1. and 2.:

1.equipment that can achieve a circuit of which the minimum line width of a line producing a pattern is 65 nanometers or less;

2.equipment that can process a wafer to fit within the range of less than 10 % where the non-uniformity of the minimum line width of a line producing a pattern on the surface of the wafer, excluding the area 2 millimeters or less from the outside edge of the wafer, is 3 sigma distribution;

(d)deleted;

(e)automatic loading multi-chamber central wafer handling systems that fall under the following 1. and 2.:

1.semiconductor manufacturing equipment that falls under any of (a), (b) and (c) with wafer input and output designed to be capable of connecting 3 or more different units of semiconductor manufacturing equipment (limited to those capable of connecting semiconductor manufacturing equipment with different functions);

2.equipment designed to form an integrated system in a vacuum environment for consecutive multiple wafer processing;

(f)lithography equipment that falls under any of the following:

1.step and repeat method or step and scan method align and expose equipment for wafer processing using photo-optical or x-ray methods, which falls under any of the following:

i.equipment with a light source wavelength shorter than 245 nanometers;

ii.equipment for which the value obtained by multiplying the exposure light source wavelength expressed in nanometers by 0.35, then dividing that value by the numerical aperture is 95 or less;

2.imprint lithography equipment capable of producing a line width of 95 nanometers or less;

3.direct writing equipment designed to be capable of manufacturing masks, semiconductor devices or integrated circuits, among those using electron beams, ion beams or laser beams, those that fall under any of the following:

i.equipment with an irradiated area having a diameter of less than 0.2 micrometers;

ii.equipment that can burn a pattern with a line width of less than 1 micrometer;

iii.equipment with an overlay precision absolute value of less than 0.2 micrometers;

(g)masks and reticles used to manufacture integrated circuits that fall under any of item (i) through item (viii)-3;

(h)multilayer masks with a phase shift layer that fall under any of the following (excluding those which fall under (g) and those designed to manufacture storage elements that do not fall under any of item (i) through item (viii)-3):

1.those manufactured from mask substrate materials using glass with a birefringence ratio of less than 7 nanometers per centimeter;

2.those designed to be used in lithography equipment with a light source wavelength shorter than 245 nanometers;

(i)imprint lithography templates for manufacturing integrated circuits that fall under any of items (i) through (viii)-3;

(j)among test equipment for testing semiconductor devices or integrated circuits or those semi-finished products, those that fall under any of the following:

1.test equipment designed for testing S-parameters of transistors at frequencies exceeding 31.8 gigahertz;

2.deleted;

3.test Equipment designed for testing microwave integrated circuits that fall under item (ii), (c);

(xviii)substrates having multiple layers consisting of heteroepitaxial growth crystals that fall under any of the following:

(a)silicon;

(b)germanium;

(c)silicon carbide;

(d)III-V compounds (limited to gallium or indium compounds);

(xix)resists that fall under any of the following or the substrates to which they have been applied:

(a)resists used in semiconductor lithography that fall under any of the following:

1.positive resists that are designed for use at a light wavelength of 15 nanometers or more and less than 245 nanometers;

2.resists that are designed for use at a light wavelength of 1 nanometer or more and less than 15 nanometers;

(b)resists that are designed for use in electron beams or ion beams and have a sensitivity of 0.01 microcoloumbs per square millimeter or less;

(c)deleted;

(d)resists optimized for surface image technology;

(e)resists designed or optimized for use in imprint lithography equipment falling under item (xvii), (f), 2, which are thermoplastic or photocrosslinkable;

(xx)organic metallic compounds or organic compounds that fall under any of the following:

(a)aluminum, gallium or indium organic compounds with a purity exceeding 99.999%;

(b)phosphorus, arsenic or antimony organic compounds with a purity exceeding 99.999%;

(xxi)phosphorus, arsenic or antimony hydrides with a purity exceeding 99.999% (excluding those that contain inert gasses of 20 mole percent or less, or hydrogen);

(xxii)semiconductor substrates of silicon carbide, gallium nitride, aluminum nitride or aluminum gallium nitride (including semiconductor substrates of silicon carbide, gallium nitride, aluminum nitride or aluminum gallium nitride having at least more than one epitaxial layer of those substances), or ingots, boules or other preforms, with an electrical resistivity exceeding 10,000 ohm-centimeters at a temperature of 20 degrees centigrade.

Article 7Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 8 of the appended table 1 of the Export Order fall under any of the following:

(i)computers or electronic assemblies thereof that fall under any of the following, or the components thereof:

(a)electronic computers or electronic assemblies thereof designed for use at temperatures exceeding 85 degrees centigrade or below -45 degrees centigrade;

(b)electronic computers or electronic assemblies thereof designed to prevent the impact of radiation and that fall under any of the following:

1.electronic computers or electronic assemblies thereof designed to withstand atomic radiation with a total absorbed dose exceeding 5,000 grays on a silicon conversion basis;

2.electronic computers or electronic assemblies thereof designed not to malfunction from an absorbed dose of atomic radiation exceeding 5 million grays per second on a silicon conversion basis;

3.electronic computers or electronic assemblies thereof designed for a rate of error of less than 1/100 million per 1 bit per day from a single event error;

(ii)deleted;

(iii)digital computers, electronic assemblies thereof or components designed to improve the functions of digital electronic computers that fall under any of the following (a) to (h), or the component thereof (excluding those and components thereof that fall under any of the following (i) through (k)):

(a)deleted;

(b)deleted;

(c)digital computers with Adjusted Peak Performance exceeding 8.0 Weighted TeraFLOPS;

(d)deleted;

(e)components designed to improve digital computer functions with Adjusted Peak Performance exceeding 8.0 Weighted TeraFLOPS;

(f)deleted;

(g)digital computer assemblies with functions that fall under item (i), (e), 1. of the preceding Article;

(h)digital computer assemblies designed to transfer data between two or more digital computers with the purpose of improving the arithmetic processing capacity of digital computers, with a transfer rate of the data to be transferred exceeding 2.0 gigabytes per second;

(i)among devices that are embedded in other equipment and that are indispensable to the operation of the equipment, those that are not key elements of the equipment;

(j)among devices that are embedded in other equipment and that are indispensable to the operation, those the functions of which are limited to signal processing or image enhancement of that equipment;

(k)devices embedded in goods listed in row 9 (i) to (iii), or (v) to (v)-5 of the appended table 1 of the Export Order and that are indispensable to the operation of those devices;

(iv)computers that fall under any of the following, or the electronic assemblies or components thereof:

(a)systolic array computers;

(b)neural computers;

(c)optical computers;

(v)computers, or the electronic assemblies or components thereof, which are designed or modified to produce, operate, or distribute intrusion programs, or communicate with such programs.

Article 8Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 9 of the appended table 1 of the Export Order fall under any of the following:

(i)telecommunication transmission equipment, electronic changers, telecommunication optical fibers, phased array antennas, radio direction finding equipment for monitoring use, radio communication interception equipment, communication jamming equipment, equipment monitoring operation of radio communication interception equipment or communication jamming equipment, equipment capable of detecting the position of objects by observing the interference of radio waves or other electromagnetic waves, without transmitting radio waves or other electromagnetic waves, or equipment monitoring communication by the method of using the Internet, which fall under any of the following:

(a)equipment which is designed to be able to guard against transient electronic influence or pulses due to nuclear explosions;

(b)equipment which is designed to prevent the effect of gamma rays, neutron beams or heavy electric particle rays (excluding equipment designed for mounting on satellites);

(c)equipment which is designed for use at temperatures exceeding 124 degrees centigrade or at temperatures lower than -55 degrees centigrade and having electronic circuits (excluding those designed for mounting on satellites);

(ii)telecommunication transmission equipment, or components thereof or accessories that fall under any of the following:

(a)radio transmitters or radio receivers that fall under any of the following:

1.telecommunication transmission equipment which can be used within a frequency range of 1.5 megahertz or more and 87.5 megahertz or less that fall under the following i. and ii.:

i.telecommunication transmission equipment which is capable of automatically measuring and selecting the optimum transmission frequency and the optimum general transfer rate per channel;

ii.telecommunication transmission equipment which uses linear amplifiers that falls under all of the following a. through d.:

a.telecommunication transmission equipment which are capable of amplifying two or more signals simultaneously;

b.telecommunication transmission equipment having output characteristics of at least 1 kilowatts within a frequency range of 1.5 megahertz or more and less than 30 megahertz, and of at least 250 watts within a frequency range of 30 megahertz or more and 87.5 megahertz or less;

c.telecommunication transmission equipment having an instantaneous bandwidth of 1 octave or more;

d.telecommunication transmission equipment for which the high frequency or distortion component ratio relative to signal waves is less than - 80 decibels;

2.telecommunication transmission equipment which uses spread spectrum (including frequency hopping) and which fall under any of the following (excluding those falling under 3. or with an output of 1.0 watts or less):

i.telecommunication transmission equipment in which diffusion code is capable of being rewritten by the user;

ii.telecommunication transmission equipment having a transmission bandwidth of 100 times or more the bandwidth of the information channel and exceeding 50 kilohertz (excluding those designed to be used for public cellular radio communication, or fixed or mobile satellite communication earth stations for commercial public communication);

3.telecommunication transmission equipment which uses ultra wideband modulation techniques having channelizing codes, scrambling codes or network identification codes that are capable of being rewritten by the user, and which falls under any of the following:

i.telecommunication transmission equipment with a bandwidth exceeding 500 megahertz;

ii.telecommunication transmission equipment for which the value obtained by dividing the instantaneous bandwidth by the center frequency is 20 % or more;

(b)among telecommunication transmission equipment having a digital signal processing function that uses voice band compression technology, those with a coding speed of less than 2,400 bits per second;

(c)communication equipment designed for use under water that falls under any of the following (limited to those not wired):

1.communication equipment which utilizes acoustic waves (including ultrasound) having a carrier frequency of less than 20 kilohertz or exceeding 60 kilohertz;

2.communication equipment which utilizes electromagnetic waves and has a carrier frequency of less than 30 kilohertz;

3.communication equipment having a function whereby beams are scanned electronically;

4.communication equipment using laser oscillators or light emitted diode[s] of which the output wavelength is exceeding 400 nanometers and 700 nanometers or less, and which is used in local area networks;

(iii)deleted;

(iv)among Communication optical fibers with a length exceeding 500 meters, those that have a tensile strength of 2 giganewtons per square meter or more;

(v)phased array antennas which are capable of being scanned electronically and which are designed for use at frequencies exceeding 31.8 gigahertz (excluding those used for microwave land systems (MLS) based on international civil aviation standards);

(v)-2radio direction finding equipment for monitoring with an operating frequency exceeding 30 megahertz that falls under the following (a) and (b), or components thereof:

(a)radio direction finding equipment having an instantaneous bandwidth of 10 megahertz or more;

(b)radio direction finding equipment which is capable of finding a line of bearing to non-cooperating radio transmitters with a signal duration of less than 1 millisecond;

(v)-3radio communication interception equipment or communication jamming equipment, or equipment monitoring operation of such equipment that falls under any of the following, or components thereof:

(a)radio communication interception equipment designed to extract voice or data transmitted through wireless communication;

(b)radio communication interception equipment designed to extract identification information, control signals, or other metadata that are transmitted through wireless communication and needed to identify mobile communication devices or subscribers;

(c)communication jamming equipment designed to intentionally and selectively interfere with or intentionally or selectively inhibit, block, reduce, or induce mobile telecommunications that falls under any of the following:

1.communication jamming equipment simulating the functions of radio access network equipment;

2.communication jamming equipment detecting and exploiting the mobile telecommunications protocol employed;

3.communication jamming equipment exploiting the mobile telecommunications protocol employed (excluding that which falls under 2.);

(d)equipment designed to monitor operation of equipment that falls under any of (a) through (c);

(v)-4equipment capable of detecting the position of objects by observing the interference of radio waves or other electromagnetic waves, without transmitting radio waves or other electromagnetic waves, and which is designed to detect and track moving objects by measuring the reflections of ambient radio frequency emissions transmitted by non-radar transmitters;

(v)-5equipment monitoring communication by the method of using the Internet or components thereof that fall under the following (a) and (b) (excluding equipment designed for marketing activity, quality management of network services, or quality management of user experience):

(a)equipment that realizes all functions from the following 1. through 3. on carrier-class IP networks:

1.analysis of the application layer;

2.extraction of selected metadata and contents of applications;

3.indexing of extracted data;

(b)equipment designed to execute the following 1. and 2.:

1.retrieval based on hard selector;

2.analysis of relationship between specific individuals or groups;

(vi)equipment for the design, manufacture, measurement, or testing of goods that fall under item (ii), (a), 2., Article 14, item (v) or item (v)-2, or components or accessories thereof;

(vii)beyond what is listed in the preceding item, equipment for the design, manufacture, measurement, or testing of goods (excluding optical fiber testing equipment and measuring equipment) that fall under any of item (i), item (ii), item (iv), or item (v) through (v)-5, or components or accessories thereof;

(viii)deleted;

(viii)-2equipment for the design of telecommunication transmission equipment or electronic changers that falls under any of the following, or components or accessories thereof (excluding those that fall under item (vi)):

(a)equipment using laser oscillators that falls under any of the following:

1.laser oscillators which utilize laser light having a wavelength of more than 1,750 nanometers;

2.laser oscillators having a function for amplifying laser light that use optical fibers of praseodymium-doped fluorides;

3.laser oscillators which use a coherent transmission system;

4.laser oscillators which use an analog transmission system with a bandwidth exceeding 2.5 gigahertz (excluding television broadcasts (including CATV broadcasts));

(b)radio transmitters or radio receivers which use quadrature amplitude modulation technology exceeding 256;

(ix)cryptographic equipment or electronic assemblies, modules or integrated circuits having cryptographic functionality, which fall under any of the following (a) through (e) (excluding those falling under the following (f) through (q), Article 3, item (xix), (c),2. ii. or Article 10, item (v), (a)) or components thereof (limited to components designed to realize cryptographic functions):

(a)those which are designed to use cryptography employing digital techniques performing any cryptographic function other than authentication, digital signature, or execution of programs whose reproduction is prevented, and which fall under any of the following:

1.those which use a symmetric algorithm employing a key-length in excess of 56 bits (excluding parity bits added for odd-even testing);

2.those which use an asymmetric algorithm where the security of the algorithm is based on the difficulty of any of the following:

i.factorization of integers in excess of 512 bits;

ii.computation of discrete logarithms in a multiplicative group of a finite field of size greater than 512 bits;

iii.computation of discrete logarithms in a group other than those mentioned in ii. in excess of 112 bits;

(b)those which are designed for performing cryptanalytic functions;

(c)those which are designed to use cryptographic techniques to generate the spreading code for spread spectrum (including the generation of the hopping code for frequency hopping systems) (excluding those that fall under (d));

(d)those which are designed to use cryptographic techniques to generate channelizing codes, scrambling codes or network identification codes for systems using ultra-wideband modulation techniques, which fall under any of the following:

1.those whose bandwidth exceeds 500 MHz;

2.those for which the value of the instantaneous bandwidth divided by the center frequency is 20% or more;

(e)those which are designed to use quantum cryptography;

(f)smart cards or smart card readers/writers having a cryptographic functionality, and that fall under any of the following:

1.smart cards that fall under any of the following:

i.smart cards which are restricted for use in any of the equipment that falls under the following (g) to (n), or (q), and whose programs cannot be rewritten for other usage;

ii.smart cards recording or designed for recording information pertaining to personal information (meaning information about a living individual which can identify the specific individual by name, date of birth or other description contained in such information (including such information as will allow easy reference to other information and will thereby enable the identification of the specific individual); the same applies hereinafter)), and that falling under all of the following a. through c.:

a.smart cards whose cryptographic functionality is exclusively used for the protection of personal information recorded in the relevant smart card;

b.smart cards used exclusively at public facilities or commercial facilities, or for certification of information pertaining to the personal information recorded in the relevant smart card;

c.smart cards whose cryptographic functionality cannot be changed by the user of the relevant equipment;

2.readers/ writers designed exclusively for reading the information pertaining to the personal information recorded in the smart card falling under 1., or for recording the information pertaining to the personal information on the relevant smart card (including those that read or record through a telecommunications line);

(g)deleted;

(h)deleted;

(i)cryptographic equipment or electronic assemblies, modules or integrated circuits having a cryptographic functionality, which are designed for banking use or settlement transactions;

(j)portable radiotelephones (meaning telephones for mobile phone networks and other phones for wireless networks; hereinafter the same applies in (l)) or mobile radiotelephones (those exclusively designed for use in automobiles and other mobile bodies; hereinafter the same applies in (l)) for civil use, which fall under the following 1. and 2.:

1.those which cannot directly transmit encrypted data to other radiotelephones or other equipment (excluding radio access network equipment);

2.those which cannot convey encrypted data through a radio network controller, base station controller or other radio access network equipment;

(k)cordless telephone equipment not capable of end-to-end encryption where the maximum effective range of unboosted cordless operation is less than 400 meters in a single, unrelayed hop between terminal and home base station;

(l)among portable or mobile radiotelephones for civil use or other radiotelephones equivalent thereto that fall under all of the following 1. through 3., those whose designs have been customized for a specific civil industry use (limited to those whose cryptographic functionality has not been customized):

1.those based on cryptographic standards (including those for the prevention of unauthorized reproduction and which have not been published) which have already been published or sold;

2.those whose cryptographic functionality cannot be changed by the user;

3.those designed for use without technical support by the supplier or sales agency;

(m)among radio access network equipment for mobile telecommunications designed for civil use which falls under (p), 1., ii. and iii., that with a radio frequency output of 0.1 watts (20 dBm) or less, and capable of being simultaneously connected with 16 devices or fewer;

(n)among wireless personal area network equipment that implements published or commercial cryptographic standards, that whose range in which communications using cryptographic functionality pertaining to the relevant cryptographic standards can be conducted is limited to a range not exceeding 30 meters, or that which is not capable of being mutually connected with 8 devices or more whose range in which communications using cryptographic functionality pertaining to the relevant cryptographic standards can be conducted is limited to a range not exceeding 100 meters;

(o)equipment which does not have the functions falling under any of item (ix), (b) or items (x) through (xii), and that falls under any of the following in regard to all of the cryptographic functionality falling under any of (a), or (c) through (e) of item (ix):

1.equipment which cannot use the relevant cryptographic functionality;

2.equipment where the relevant cryptographic functionality becomes usable only by means of validation of the cryptographic functionality (excluding that for which the cryptographic functionality has already been validated);

(p)those listed in this item through item (xii) which fall under the following 1. or 2. (limited to those which can be confirmed as falling under by the manufacturer, seller, or exporter thereof in writing) (referred to as "commercial cryptographic equipment" in the next item through item (xii)):

1.those that fall under all of the following i. through iii.:

i.those that can be purchased with no restrictions and are sold in stores, or from the inventory of stores by placing orders by mail, by letter prescribed in Article 2, paragraph (2) of the Act on the Service of Letters by Private Business Operators (Act No. 99 of 2002) by a general letter services operator prescribed in paragraph (6) of the same Article or a specified letter service operator prescribed in paragraph (9) of the same Article, or through input-output equipment connected to public telecommunication lines (including telephone);

ii.those whose cryptographic functionality cannot be changed by the user of the goods;

iii.those whose cryptographic function can be used without technical support by the supplier or sales agency of the goods;

2.components designed for the goods that falls under 1. which fall under all of the following i. through iii.:

i.components whose main function is not security management of information systems;

ii.components that are neither capable of changing any cryptographic functions that the goods that fall under 1. have, nor capable of adding any new cryptographic functions thereto;

iii.components whose functions are fixed, and are not designed or modified for specific users;

(q)equipment other than computers or components thereof that falls under the following 1. and 2. (limited to the equipment that can be confirmed as falling under by the manufacturer, seller, or exporter thereof in writing) (referred to as "ancillary cryptographic equipment" in the next item through item (xii)):

1.those whose main function falls under none of the following:

i.security management of information systems;

ii.sending, receiving, or recording and storing of information (excluding functions amusement facilities or equipment have, and that performed for commercial broadcasting, digital copyright management, or management of medical records);

iii.construction, administration, or operation of telecommunication lines through wired or wireless networks;

2.those whose cryptographic functions are used solely for supporting main functions of the goods;

(ix)-2equipment, electronic assemblies, modules or integrated circuits, designed or modified to enable goods or programs to attain or exceed functions held by the goods that fall under any of item (ix), or items (x) through (xii), only through the use thereof (excluding commercial cryptographic equipment or ancillary cryptographic equipment);

(x)equipment designed to prevent the leakage of information transmission signals (excluding equipment designed to prevent the leakage of signals to prevent bodily harm or malfunctions of other equipment caused by radiation of electromagnetic waves, equipment designed to prevent leakage of signals based on electromagnetic wave obstruction standards, commercial cryptographic equipment, or ancillary cryptographic equipment), or components thereof (limited to components designed to realize functions to prevent leakage of signals transmitting information);

(xi)information and communications systems with an information security function (excluding those using cryptography to realize such a function) that have a sufficient information security function in light of the international standard (excluding commercial cryptographic equipment or ancillary cryptographic equipment), or components thereof (limited to components designed to realize the information security function);

(xii)communication cable systems capable of detecting surreptitious intrusion (excluding commercial cryptographic equipment or ancillary cryptographic equipment), or components thereof (limited to components designed to realize the intrusion detection function);

(xiii)equipment for the design or manufacture of goods that fall under any of item (ix) through the preceding item, or measurement equipment to evaluate or observe the information security function of the goods that fall under any of item (ix) through the preceding item (including those having any of the programs set forth in Article 21, paragraph (1), item (vii) or items (viii)-2 through (x)).

Article 9Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 10 of the appended table 1 of the Export Order fall under any of the following:

(i)underwater acoustic equipment utilizing acoustic waves (including ultrasound; hereinafter the same applies in this Article), positioning device for vessels or components thereof which fall under any of the following:

(a)those having a transmission function or components thereof which fall under any of the following (excluding those used solely for ocean depth measurement, for measuring underwater objects or the distance to objects buried under water or for finding schools of fish, as well as acoustic beacons, and emergency items and pingers designed to be installed at any position under water, among those used solely for vertical direction not having a scanning function exceeding plus/minus 20 degrees):

1.bathymetric survey systems for sea bed using water acoustic waves that fall under any of the following:

i.bathymetric survey systems for vessels for sea bed topographic mapping that fall under all of the following a. through d.:

a.bathymetric survey systems designed for measurement at angles which exceed 20 degrees from the vertical direction;

b.bathymetric survey systems designed to enable the measurement of sea bed topography at depths exceeding 600 meters beneath the surface of the water;

c.bathymetric survey systems with a resolution at the time of scanning of less than 2;

d.bathymetric survey systems that automatically compensate all of the following 1 through 3 and improve sounding precision:

1action of sensor;

2state of the acoustic wave used in scanning;

3speed of acoustic wave perceived by the sensor;

ii.bathymetric survey systems for underwater for sea bed topographic mapping that fall under any of the following:

a.those designed or modified to operate at depths exceeding 300 meters whose scanning efficiency exceeds 3,800;

b.those which fall under all of the following 1 through 4 (excluding those which fall under a.):

1those designed or modified to operate at depths exceeding 100 meters;

2those designed for measurement at angles which exceed 20 degrees from the vertical direction;

3those with an operating frequency less than 350 kilohertz, or those designed to enable the measurement of sea bed topography more than 200 meters away from the sensor;

4those which automatically compensate all of the following i. through iii. and improve sounding precision:

i.action of sensor;

ii.state of the acoustic wave used in scanning;

iii.speed of acoustic wave perceived by the sensor;

iii.side scan sonar or synthetic aperture sonar designed to prepare an image of the sea bed that falls under all of the following a. through c.:

a.those designed or modified to operate at depths exceeding 500 meters;

b.those whose scanning field exceeds 570 square meters per second when operating at the maximum range and for which the resolution in the traveling direction can be less than 15 centimeters;

c.those with a resolution in the direction perpendicular to the traveling direction of less than 15 centimeters;

2.underwater acoustic equipment which falls under any of the following:

i.underwater acoustic equipment in which the transmission frequency is less than 5 kilohertz or in which the operating frequency is 5 kilohertz or more and less than 10 kilohertz, and the acoustic compression level (0 decibels when the acoustic compression is 1 micropascal at a distance of 1 meter from the source of the sound; the same applies hereinafter) of which exceeds 224 decibels;

ii.underwater acoustic equipment with an operating frequency of 10 kilohertz or more and 24 kilohertz or less and with an acoustic compression level exceeding 224 decibels;

iii.underwater acoustic equipment, the operating frequency of which exceeds 24 kilohertz and is less than 30 kilohertz and the acoustic compression level of which exceeds 235 decibels;

iv.underwater acoustic equipment, the operating frequency of which is less than 100 kilohertz and the beam width of which is capable of forming acoustic beams of less than 1 degree;

v.underwater acoustic equipment which is designed for use at depths exceeding 1,000 meters which falls under any of the following:

a.underwater acoustic equipment having a transducer which is capable of compensating for water pressure;

b.underwater acoustic equipment having a transducer (an echo sender and receiver) with built-in transmitting and receiving element other than sending and receiving elements made of lead zirconate titanate;

vi.underwater acoustic equipment designed so that the measuring distance exceeds 5,120 meters;

3.underwater acoustic equipment with a transmission frequency of less than 10 kilohertz (excluding those falling under 2.);

4.acoustic transmitters (including transducers that incorporate piezoelectric materials, those with magnetostriction, those with electrostriction, or electric force or liquid pressure elements which independently operate) which fall under any of the following (excluding sonic water generators which are electronic (limited to those which are capable of being used only in a vertical direction) or mechanical or chemical):

i.acoustic transmitters which are capable of being used at frequencies of less than 10 kilohertz and the acoustic output density of which when transmitting instantaneously exceeds 0.01 milliwatts per square millimeter per hertz;

ii.acoustic transmitters which are capable of being used at frequencies of less than 10 kilohertz and the acoustic output density of which when transmitting continuous waves exceeds 0.001 milliwatts per square millimeter per hertz;

iii.acoustic transmitters in which the main rope output ratio to that of the side rope exceeds 22 decibels;

5.equipment for determining the position of vessels that falls under the following i. and ii. or components thereof:

i.those capable of detecting equipment transmitting signals to be received to determine the position of vessels (referred to as a "transponder" in ii. below), at a distance exceeding 1,000 meters;

ii.those whose root mean square for positioning accuracy when signals are received at a distance of 1,000 meters from a transponder, is less than 10 meters;

6.among sonars designed to automatically detect the position of the person active under water that fall under all of the following i. through iii., those designed for sending and receiving acoustic arrays:

i.those capable of detecting the subject at a distance exceeding 530 meters;

ii.those whose root mean square for positioning accuracy at a distance of 530 meters from the relevant equipment is less than 15 meters;

iii.those whose bandwidth of transmitted pulse exceeds 3 kilohertz;

(b)acoustic equipment possessing a receiving function or components thereof that fall under any of the following:

1.among hydrophones without a function which compensates for the effects of acceleration (0 decibels with 1 volt per micropascal; hereinafter the same applies in this item), those with an acoustic compression sensitivity which exceeds minus 180 decibels;

2.among signal processing equipment designed for towed hydrophone arrays and the programs of which are capable of being rewritten by the user, those which can carry out processing or correlation of the time domain or frequency domain (including spectrum analysis, digital filtering or beam formation) (excluding those which can process in real-time);

3.among heading sensors which are designed for use in towed hydrophone arrays and having an absolute precision value of less than 0.5 degrees, those which are designed for use at depths exceeding 35 meters or those having a depth sounding device which are capable of being coordinated or removed so that heading sensors can be used at depths exceeding 35 meters;

4.hydrophone arrays for ocean bottom or harbor/port cable which incorporate underwater acoustic wave sensors in 6.;

5.among signal processing equipment which are designed for sea floor or harbor cable systems and the programs of which are capable of being rewritten by the user, those which carry out processing or correlation of the time domain or the frequency domain (spectrum analysis, digital filtering or beam formation), (excluding real-time processing);

6.underwater acoustic wave sensors with accelerometers which fall under all of the following (excluding grain velocity sensors or underground sound detectors):

i.those composed of three-axis accelerometers;

ii.those with a total acceleration sensitivity exceeding 48 decibels;

iii.those designed to operate at depths exceeding 35 meters;

iv.those with an operating frequency of less than 20 kilohertz;

(ii)measuring equipment for the horizontal speed of the equipment carrier relative to the seabed at distances between the carrier and the seabed (limited to those utilizing acoustic waves) that fall under any of the following (a) or (b) (excluding those specially designed for installation on surface ships, or those set forth in the following (c)):

(a)those using a correlation-velocity log, which fall under any of the following:

1.those designed so that measurements are capable of being carried out at a position exceeding 500 meters from the bottom of the water;

2.those with a speed accuracy better than 1%;

(b)those using a Doppler-velocity log, with a speed accuracy better than 1%;

(c)echo sounding devices which cannot be used other than for ocean depth measurement, for measuring underwater objects or the distance to objects buried under water or for finding schools of fish;

(iii)optical detectors or components thereof that fall under any of the following:

(a)solid optical detectors designed for space use that fall under any of the following:

1.solid optical detectors having a maximum sensitivity within a wavelength range exceeding 10 nanometers and 300 nanometers or less and the sensitivity at wavelengths exceeding 400 nanometers is less than 0.1% of a maximum sensitivity;

2.solid optical detectors having a maximum sensitivity within a wavelength range exceeding 900 nanometers and 1,200 nanometers or less, and with a response time constant of 95 nanoseconds or less;

3.focal plane arrays with elements exceeding 2,048, and a maximum sensitivity within the wavelength range exceeding 300 nanometers and 900 nanometers or less;

(b)image reinforcing tubes which fall under any of the following 1. and 2. (excluding non-imaging photomultiplier tubes having in the vacuum space an electron sensing device consisting solely of a single metal anode or metal anodes where the distance between the centers of two anodes is exceeding 500 micrometers):

1.imaging reinforcing tubes that fall under all of the following i. through iii.:

i.image reinforcing tubes having a maximum sensitivity within a wavelength range exceeding 400 nanometers and 1,050 nanometers or less;

ii.image reinforcing tubes having electron image amplification and using any of the following:

a.microchannel plates where the distance between the centers of two adjoining channels is 12 micrometers or less;

b.among electron sensing devices which have been specially designed or modified to achieve charge multiplication other than by a microchannel plate, those where the distance between the center of two adjoining pixels is 500 micrometers or less;

iii.image reinforcing tubes having a photocathode which falls under any of the following:

a.photocathodes which use a multi-alkali for the main material and in which lumen sensitivity exceeds 700 microamperes per lumen;

b.photocathodes which use gallium arsenide or indium gallium arsenide as the main material;

c.photocathodes which use a III-V compound semiconductor (excluding gallium arsenide or indium gallium arsenide) as the main material with a maximum radiation sensitivity exceeding 10 milliamperes per watt;

2.components of image reinforcing tubes, which fall under all of the following i. through iii.:

i.components of image reinforcing tubes having a maximum sensitivity within a wavelength range exceeding 1,050 nanometers and 1,800 nanometers or less;

ii.components of image reinforcing tubes having electron image amplification and using any of the following:

a.microchannel plates where the distance between the centers of two adjoining channels is 12 micrometers or less;

iii.photocathodes or transferred electron photocathodes using a III-V compound semiconductor (excluding gallium arsenide or indium gallium arsenide) as the main material and having a maximum radiant sensitivity exceeding 15 milliamperes per watt;

(c)image reinforcing tubes or components thereof which fall under any of the following 1. and 2. (excluding non-imaging photomultiplier tubes having in the vacuum space an electron sensing device consisting solely of a single metal anode or metal anodes where the distance between the centers of two anodes is exceeding 500 micrometers):

1.image reinforcing tubes which fall under all of the following i. through iii.:

i.image reinforcing tubes having a maximum sensitivity within a wavelength range exceeding 400 nanometers and 1,050 nanometers or less;

ii.image reinforcing tubes having electron image amplification and using any of the following:

a.micro channel plates where the distance between the centers of two adjoining channels is 12 micrometers or less;

iii.image reinforcing tubes having a photocathode which uses a multi-alkali as the primary material and in which lumen sensitivity in the photocathode exceeds 350 microamperes per lumen and is 700 microamperes per lumen or less;

2.Components of image reinforcing tubes which fall under any of the following:

i.micro channel plates wherein the distance between the centers of two adjoining channels is 12 micrometers or less;

ii.among electron sensing devices which have been specially designed or modified to achieve charge multiplication other than by a microchannel plate, those where the distance between the center of two adjoining pixels is 500 micrometers or less;

iii.photocathodes using a III-V compound semiconductor (excluding gallium arsenide or indium gallium arsenide) as the main material (excluding photocathodes having a maximum sensitivity within a wavelength range exceeding 400 nanometers and 1,050 nanometers or less with a maximum radiant sensitivity of 10 milliamperes per watt or less, or photocathodes having a maximum sensitivity within a wavelength range exceeding 1,050 nanometers and 1,800 nanometers or less with a maximum radiant sensitivity of 15 milliamperes per watt or less) or transferred electron photocathodes;

(d)focal plane arrays not designed for space use that fall under the following 1. and 2. (excluding photoconduction cells with a sealed-in capsule having 16 or fewer factor elements; those using lead sulfide or lead selenide as well as pyroelectric detectors, those in which lanthanum has been added to 3 glycine sulfate and lead zirconate titanate, those to which lithium tartarate, vinylidene polyfluoride or strontium barium niobate has been added):

1.focal plane arrays which fall under any of the following:

i.focal plane arrays which are not heat-molded and which fall under any of the following:

a.focal plane arrays in which factor elements have a maximum sensitivity within a wavelength range exceeding 900 nanometers and 1,050 nanometers or less, and which fall under any of the following:

1focal plane arrays with a response time constant of less than 0.5 nanoseconds;

2focal plane arrays specially designed or modified to achieve charge multiplication, having a maximum radiant sensitivity exceeding 10 milliamperes per watt;

b.focal plane arrays in which factor elements have a maximum sensitivity within a wavelength range exceeding 1,050 nanometers and 1,200 nanometers or less, and which fall under any of the following:

1focal plane arrays with a response time constant of 95 nanoseconds or less;

2focal plane arrays specially designed or modified to achieve charge multiplication, having a maximum radiant sensitivity exceeding 10 milliamperes per watt;

c.focal plane arrays in which factor elements are arrayed two-dimensionally and in which the respective factor elements have a maximum sensitivity within a wavelength range exceeding 1,200 nanometers and 30,000 nanometers or less;

d.among focal plane arrays in which factor elements are arrayed one-dimensionally and in which the respective factor elements have a maximum sensitivity within a wavelength range exceeding 1,200 nanometers and 3,000 nanometers or less, those which fall under any of the following (excluding those having factor elements limited solely to germanium material, with 32 factor elements or less);

1focal plane arrays wherein the aspect ratio of the factor elements using the array direction of the factor elements is less than 3.8;

2focal plane arrays having a time delay and integrating function inside the same factor element;

e.focal plane arrays in which factor elements are arrayed one-dimensionally and in which the respective factor elements have a maximum sensitivity within a wavelength range exceeding 2,500 nanometers and 30,000 nanometers or less;

f.focal plane arrays in which factor elements have a maximum sensitivity within a wavelength range exceeding 400 nanometers and 900 nanometers or less, and which fall under the following 1 and 2:

1focal plane arrays specially designed or modified to achieve charge multiplication, and having a maximum radiant sensitivity exceeding 10 milliamperes per watt at wavelengths exceeding 760 nanometers;

2focal plane arrays with factor elements exceeding 32;

ii.infrared ray heat-molded focal plane arrays in which factor elements are arrayed two-dimensionally and in which the respective factor elements have a sensitivity within a wavelength range of 8,000 nanometers or more and 14,000 nanometers or less in an unfiltered state;

2.focal plane arrays which fall under any of the following:

i.focal plane arrays which use platinum silicon with less than 10,000 factor elements;

ii.focal plane arrays which use iridium silicon;

iii.focal plane arrays which use indium antimonide or lead selenide with less than 256 factor elements;

iv.focal plane arrays which use indium arsenide;

v.focal plane arrays which use lead sulfide;

vi.focal plane arrays which use indium gallium arsenide;

vii.scanning arrays which use mercury cadmium telluride and which fall under any of the following:

a.scanning arrays which do not have a time delay and integrating function inside the same detection factor element with 30 or less factor elements;

b.scanning arrays which have a time delay and integrating function inside the same detection factor element with 2 or less factor elements;

viii.steering arrays which use mercury cadmium telluride with less than 256 factor elements;

ix.quantum well focal plane arrays which use gallium arsenide or aluminum gallium arsenide with less than 256 factor elements;

x.heat-molded focal plane arrays with less than 8,000 factor elements;

xi.among focal plane arrays in which factor elements are arrayed one-dimensionally, and in which the respective factor elements have a maximum sensitivity within a wavelength range exceeding 400 nanometers and 900 nanometers or less, those with 4,096 factor elements or less;

xii.focal plane arrays in which factor elements are arrayed two-dimensionally and in which the respective factor elements have a maximum sensitivity within a wavelength range exceeding 400 nanometers and 900 nanometers or less, those whose maximum number of unidirectional factor elements are 4,096 or less and all of the factor elements are 250,000 or less;

(e)among focal plane arrays which are not designed for space use that fall under any of the following (excluding photoconduction cells with a sealed-in capsule having 16 or fewer factor elements, using lead sulfide or lead selenide as well as pyroelectric detectors in which lanthanum has been added to 3 glycine sulfate and lead zirconate titanate, using lithium tartarate vinylidene polyfluoride or strontium barium niobate), those other than items that fall under (d):

1.focal plane arrays which are not heat-molded which fall under any of the following:

i.focal plane arrays in which factor elements have a maximum sensitivity within a wavelength range exceeding 900 nanometers and 1,050 nanometers or less, and which fall under any of the following:

a.focal plane arrays with a response time constant of less than 0.5 nanoseconds;

b.focal plane arrays specially designed or modified to achieve charge multiplication, and having a maximum radiant sensitivity exceeding 10 milliamperes per watt;

ii.focal plane arrays in which factor elements have a maximum sensitivity within a wavelength range exceeding 1,050 nanometers and 1,200 nanometers or less, and which fall under any of the following:

a.focal plane arrays with a response time constant of 95 nanoseconds or less;

b.focal plane arrays specially designed or modified to achieve charge multiplication, having a maximum radiant sensitivity exceeding 10 milliamperes per watt;

iii.focal plane arrays in which factor elements are arrayed two-dimensionally and in which the respective factor elements have a maximum sensitivity within a wavelength range exceeding 1,200 nanometers and 30,000 nanometers or less;

iv.among focal plane arrays in which factor elements are arrayed one-dimensionally, and in which the respective factor elements have a maximum sensitivity within a wavelength range exceeding 1,200 nanometers and 3,000 nanometers or less, those which fall under any of the following (excluding those having factor elements limited solely to germanium material, with 32 factor elements or less):

a.focal plane arrays wherein the aspect ratio of the factor elements having a factor element array direction as a standard is less than 3.8;

b.focal plane arrays having a time delay and integrating function inside the same factor element;

v.focal plane arrays in which factor elements are arrayed one-dimensionally and in which respective factor elements have a maximum sensitivity within a wavelength range exceeding 2,500 nanometers and 30,000 nanometers or less;

vi.focal plane arrays in which factor elements have a maximum sensitivity within a wavelength range exceeding 400 nanometers and 900 nanometers or less, and which fall under the following a. and b.:

a.focal plane arrays specially designed or modified to achieve charge multiplication, having a maximum radiant sensitivity exceeding 10 milliamperes per watt at wavelengths exceeding 760 nanometers;

b.focal plane arrays with factor elements exceeding 32;

2.infrared heat-molded focal plane arrays in which factor elements are arrayed two-dimensionally and in which the respective factor elements have a sensitivity within a wavelength range exceeding 8,000 nanometers and 14,000 nanometers or less in an unfiltered state;

(iv)mono-spectrum image sensors or multi-spectrum image sensors designed for remote sensing which fall under any of the following:

(a)mono-spectrum image sensors or multi-spectrum image sensors with an instant visual field of less than 200 microradians;

(b)among mono-spectrum image sensors or multi-spectrum image sensors designed for use within a wavelength range exceeding 400 nanometers and 30,000 nanometers or less, in which image data are output digitally, those which fall under any of the following:

1.mono-spectrum image sensors or multi-spectrum image sensors designed for space use;

2.among mono-spectrum image sensors or multi-spectrum image sensors designed for installation in aircraft using non-silicon detectors, those the instant field of vision of which is less than 2.5 milliradians;

(v)among equipment which uses optical detectors having a direct field of vision, that which falls under any of the following (excluding medical equipment which do not have built-in photocathodes and which uses gallium arsenide or indium gallium arsenide as the main material):

(a)equipment that incorporates optical detectors that fall under any of the following:

1.image reinforcing tubes that fall under item (iii), (b);

2.focal plane arrays that fall under item (iii), (e);

3.solid optical detectors falling under item (iii), (a) or Article 14, item (vii);

(b)equipment with built-in optical detectors which fall under any of the following (excluding those that fall under (a)):

1.image reinforcing tubes which fall under item (iii), (c), 1.;

2.focal plane arrays which fall under item (iii), (d);

(vi)coolers for optical detectors which fall under any of the following:

(a)coolers for optical detectors designed for space use;

(b)among coolers for optical detectors which are not designed for space use, wherein the temperature of the contact surface used for cooling is less than -55 degrees centigrade, those which fall under any of the following:

1.circulation type coolers, the average breakdown life or average breakdown interval of which exceeds 2,500 hours;

2.joule-Thompson self-regulating coolers having a diameter of less than 8 millimeters;

(vii)optical fibers for use in sensors used to measure sound, temperature, acceleration, electromagnetism or radioactive rays;

(viii)high speed cinema recording cameras, mechanical cameras, streak cameras, electronic cameras, or components thereof that fall under any of the following (excluding those falling under Article 11):

(a)cameras which fall under any of the following:

1.cameras with built-in image reinforcing tubes which fall under item (iii), (b), and that fall under any of the following:

i.those not designed for underwater use;

ii.those designed for underwater use;

2.cameras with built-focal plane arrays which fall under item (iii), (e), and that fall under any of the following:

i.those not designed for underwater use;

ii.those designed for underwater use;

3.those with built-in solid optical detectors which fall under item (iii), (a) or Article 14, item (vii);

(b)cameras which fall under any of the following (excluding those which fall under (a)):

1.among cinema recording cameras which use film with a width of 8 millimeters or more and 16 millimeters or less, those with a photographing speed exceeding 13,150 frames per second;

2.mechanical cameras, the photographing speed of which, when photographing a frame with a screen height of 36 millimeters, exceeds 1,000,000 frames per second;

3.streak cameras, the photographing speed of which exceeds 10 millimeters per microsecond;

4.electronic framing cameras, the shutter speed of which exceeds 1 million frames per second;

5.electronic cameras which fall under the following i. and ii.:

i.electronic cameras in which shutter speed is less than 1 microsecond;

ii.electronic cameras in which signal read-out speed exceeds 125 frames per second;

6.plugging units which are capable of being used in cinema recording cameras having a module type structure, mechanical cameras, streak cameras, electronic framing cameras or electronic cameras which are capable of carrying out the functions which fall under any of 3. through 5.;

7.among video cameras that incorporate solid-state image sensors having a maximum sensitivity within a wavelength range exceeding 10 nanometer and 30,000 nanometers or less, those which fall under any of the following i. through iii. and also fall under any of the following iv. through vi.:

i.video cameras used for black and white photography in which solid-state image sensor have exceeding 4,000,000 effective pixels;

ii.video cameras used for color photography that incorporate three solid-state image sensors, in which the respective solid-state image sensor have exceeding 4,000,000 effective pixels;

iii.video cameras for color photography that incorporate one solid-state image sensor, in which the solid-state image sensor have exceeding 12, 000,000 effective pixels;

iv.video cameras having a reflector that fall under item (ix), (a);

v.video cameras having a control device having an optical device or optical components which fall under item (ix), (d);

vi.video cameras having a function which enables them to internally process tracking data for the object to be photographed by the camera and to record these in the image information;

8.scanning cameras or scanning camera equipment that fall under all of the following i. through iii.:

i.scanning cameras or scanning camera equipment having a maximum sensitivity within a wavelength range exceeding 10 nanometers and 30,000 nanometers or less;

ii.scanning cameras or scanning camera equipment that incorporates solid-state image sensor in which the pixels are arrayed in a linear fashion and the number of pixels is exceeding 8,192;

iii.scanning cameras or scanning camera equipment which scan mechanically in one direction;

9.scanning cameras or scanning camera equipment with a built-in image reinforcing tube which fall under item (iii), (c), 1.;

10.scanning cameras or scanning camera equipment with a built-in focal plane array which falls under item (iii), (d);

(ix)optical equipment or components thereof which fall under any of the following:

(a)reflectors which fall under any of the following:

1.reflectors which are capable of changing the shape of the mirror surface at frequencies exceeding 100 hertz, or components thereof;

2.among reflectors which do not have parts made of composite materials or foams, in which the mirror surface has a mass per square meter of less than 30 kilograms, those in which the total weight exceeds 10 kilograms;

3.among reflectors which do have parts made of composite materials or foams, in which the mirror surface has a mass per square meter of less than 30 kilograms, those in which the total weight exceeds 2 kilograms;

4.among reflectors used to control the direction of light and with a flatness of 316.5 nanometers or less, those in which the diameter of the mirror surface of which or the length of the major axis of which exceeds 100 millimeters, and in which control bandwidth exceeds 100 hertz;

(b)among optical components made up of zinc selenide or zinc sulfide, which are permeable to light with a wavelength exceeding 3,000 nanometers and 25,000 nanometers or less, those which fall under any of the following:

1.optical components with a volume exceeding 100 cubic centimeter;

2.optical components, the diameter or major axis length of which exceeds 80 millimeters and the thickness of which exceeds 20 millimeters;

(c)optical components designed for space use which fall under any of the following:

1.optical components which have been made lighter for weights which are less than 20 % compared to the condition of full density of the body;

2.substrates (including coating substrates or substrates having a protective film);

3.reflectors which are designed so that they are capable of being assembled during space flight and components which are equivalent to reflecting mirrors the sum of the light receiving surface areas when assembled of which is an aperture greater than 1 meter;

4.optical components made of composite materials, the linear coefficient of expansion in all directions of which is not more than 5/1,000,000 per degree of temperature;

(d)controllers of optical equipment or components that fall under any of the following:

1.controllers which are designed to maintain the surface shape or direction of optical components which have been designed for space use which fall under (c), 1. or (c), 3.;

2.optical components which are used to scan, track or stabilize light at bandwidths of 100 hertz or more or coordinate optical resonators, and the precision of which is 10 microradians or less;

3.gimbals with a maximum deflection angle exceeding 5 degrees, which are capable of being used in bandwidths of 100 hertz or more which fall under any of the following:

i.gimbals with a length of diameter or major axis exceeding 0.15 meters and 1 meter or less, and with an angular acceleration exceeding 2 radians per second squared and with a precision of 200 microradians or less;

ii.gimbals with a length of diameter or major axis exceeding 1 meter, and with an angular acceleration exceeding 0.5 radians per second squared and with a precision of 200 microradians or less;

4.controllers designed to control an optical system (limited to those which are capable of being used to adjust the phase of the reflecting mirror) made up of a reflector having a diameter or major axis length which is greater than 1 meter);

(ix)-2aspherical optical elements which fall under all of (a) through (c):

(a)aspherical optical elements, the maximum measurement for the optical aperture of which exceeds 400 millimeters;

(b)aspherical optical elements having a root mean square surface roughness of less than 1 nanometer at a sampling length of 1 millimeter or more;

(c)aspherical optical elements for which the absolute value of the linear coefficient of expansion at a temperature of 25 degrees centigrade is less than 3/1,000,000;

(x)laser oscillators or components thereof, accessories or test equipment that fall under any of the following:

(a)continuous wave laser oscillators other than variable wavelength laser oscillators, which fall under any of the following (excluding those falling under (d)):

1.those designed for use within a wavelength range of less than 150 nanometers, with a rated output exceeding 1 watt;

2.those designed for use at a wavelength range of 150 nanometers or more and 510 nanometers or less, with a rated output exceeding 30 watts (excluding argon laser oscillators with a rated output of 50 watts or less);

3.those designed for use within a wavelength range exceeding 510 nanometers and 540 nanometers or less and which fall under any of the following:

i.those that oscillate in a single transverse mode with a rated output exceeding 50 watts;

ii.those that oscillate in a multiple transverse mode with a rated output exceeding 150 watts;

4.those designed for use within a wavelength range exceeding 540 nanometers and 800 nanometers or less, with a rated output exceeding 30 watts;

5.those designed for use within a wavelength range exceeding 800 nanometers and 975 nanometers or less and which fall under any of the following:

i.those that oscillate in a single transverse mode with a rated output exceeding 50 watts;

ii.those that oscillate in a multiple transverse mode with a rated output exceeding 80 watts;

6.those designed for use within a wavelength range exceeding 975 nanometers and 1,150 nanometers or less which fall under any of the following:

i.those that oscillate in a single transverse mode that fall under any of the following with a rated output exceeding 200 watts;

ii.those that oscillate in a multiple transverse mode which fall under any of the following (excluding industrial laser oscillators with a rated output exceeding 2 kilowatts and 6 kilowatts or less with a total mass greater than 1,200 kilograms):

a.those with a wall-plug efficiency exceeding 18%, and a rated output exceeding 500 kilowatts;

b.those with an average output exceeding 2 kilowatts;

7.those designed for use within a wavelength range exceeding 1,150 nanometers and 1,555 nanometers or less, which fall under any of the following:

i.those that oscillate in a single transverse mode with a rated output exceeding 50 watts;

ii.those that oscillate in a multiple transverse mode with a rated output exceeding 80 watts;

8.those designed for use within a wavelength range exceeding 1,555 nanometers, with a rated output exceeding 1 watt;

(b)continuous wave laser oscillators other than variable wavelength laser oscillators, which fall under any of the following (excluding those falling under (d)):

1.those designed for use within a wavelength range of less than 150 nanometers, which fall under any of the following:

i.those which generate pulses exceeding 50 millijoules per pulse and with a peak output exceeding 20 watts;

ii.those with an average output exceeding 1 watt;

2.those designed for use within a wavelength range exceeding 150 nanometers and 510 nanometers or less and which fall under any of the following:

i.those which generate pulses exceeding 1.5 joules per pulse and with a peak output exceeding 30 watts;

ii.those with an average output exceeding 30 watts (excluding argon laser oscillators with an average output of 50 watts or less);

3.those which are designed for use within a wavelength range exceeding 510 nanometers and 540 nanometers or less and which fall under any of the following:

i.those that oscillate in a single transverse mode and fall under any of the following:

a.those which generate pulses exceeding 1.5 joules per pulse and with a peak output exceeding 50 watts;

b.those with an average output exceeding 50 watts;

ii.those that oscillate in a multiple transverse mode and fall under any of the following:

a.those which generate pulses exceeding 1.5 joules per pulse and with a peak output exceeding 150 watts;

b.those with an average output exceeding 150 watts;

4.those designed for use within a wavelength range exceeding 540 nanometers and 800 nanometers or less, which fall under any of the following:

i.those which generate pulses with a pulse width of less than 1 picosecond and fall under any of the following:

a.those which generate pulses exceeding 0.005 joules per pulse and with a peak output exceeding 5 gigawatts;

b.those with an average output exceeding 20 watts;

ii.those that generate pulses with a pulse width of 1 picosecond or more and fall under any of the following:

a.those which generate pulses exceeding 1.5 joules per pulse and with a peak output exceeding 30 watts;

b.those with an average output exceeding 30 watts;

5.those designed for use within a wavelength range exceeding 800 nanometers and 975 nanometers or less that fall under any of the following:

i.those that generate pulses with a pulse width of 1 picosecond or less and fall under any of the following:

a.those which generate pulses exceeding 0.005 joules per pulse and with a peak output exceeding 5 gigawatts;

b.those that oscillate in a single transverse mode with an average output exceeding 20 watts;

ii.those which generate pulses with a pulse width of 1 picosecond or more and 1 microsecond or less and fall under any of the following:

a.those which generate pulses exceeding 0.5 joules per pulse and with a peak output exceeding 50 watts;

b.those that oscillate in a single transverse mode with an average output exceeding 20 watts;

c.those that oscillate in a multiple transverse mode with an average output exceeding 50 watts;

iii.those which generate pulses with a pulse width of more than 1 microsecond and fall under any of the following:

a.those which generate pulses exceeding 2 joules per pulse and with a peak output exceeding 50 watts;

b.those that oscillate in a single transverse mode with an average output exceeding 50 watts;

c.those that oscillate in a multiple transverse mode with an average output exceeding 80 watts;

6.those designed for use in a wavelength range exceeding 975 nanometers and 1,150 nanometers or less, which fall under any of the following:

i.those which generate pulses with a pulse width of less than 1 picosecond and fall under any of the following:

a.those with a peak output exceeding 2 gigawatts per pulse;

b.those with an average output exceeding 10 watts;

c.those which generate pulses exceeding 0.002 joules per pulse;

ii.those which generate pulses with a pulse width of 1 picosecond or more and less than 1 nanosecond and fall under any of the following:

a.those with a peak output exceeding 5 gigawatts per pulse;

b.those with an average output exceeding 10 watts;

c.those which generate pulses exceeding 0.1 joules per pulse;

iii.those which generate pulses with a pulse width of 1 nanosecond or more and 1 microsecond or less and fall under any of the following:

a.those that oscillate in a single transverse mode and fall under any of the following:

1those with a peak output exceeding 100 megawatts;

2those with an average output exceeding 20 watts, of which the maximum pulse repetition frequency is designed to be 1 kilohertz or less;

3among those with a wall-plug efficiency exceeding 12% and an average output exceeding 100 watts, those operating at a pulse repetition frequency exceeding 1 kilohertz;

4those with an average output exceeding 150 watts, which operate at a pulse repetition frequency exceeding 1 kilohertz;

5those which generate pulses exceeding 2 joules per pulse;

b.those that oscillate in a multiple transverse mode and fall under any of the following:

1those with a peak output exceeding 400 megawatts;

2those with a wall-plug efficiency exceeding 18% and an average output exceeding 500 watts;

3those with an average output exceeding 2 kilowatts;

4those which generate pulses exceeding 4 joules per pulse;

iv.those which generate pulses with a pulse width exceeding 1 microsecond and fall under any of the following:

a.those that oscillate in a single transverse mode that fall under any of the following:

1those with a peak output exceeding 500 kilowatts;

2those with a wall-plug efficiency exceeding 12% and an average output exceeding 100 watts;

3those with an average output exceeding 150 watts;

b.those that oscillate in a multiple transverse mode and fall under any of the following:

1those with a peak output exceeding 1 megawatt;

2those with a wall-plug efficiency exceeding 18% and an average output exceeding 500 watts;

3those with an average output exceeding 2 kilowatts;

7.those designed for use within a wavelength range exceeding 1,150 nanometers and 1,555 nanometers or less, which fall under any of the following:

i.those which generate pulses with a pulse width of 1 microsecond or less and fall under any of the following:

a.those which generate pulses exceeding 0.5 joules per pulse and with a peak output exceeding 50 watts;

b.those that oscillate in a single transverse mode with an average output exceeding 20 watts;

c.those that oscillate in a multiple transverse mode with an average output exceeding 50 watts;

ii.those which generate pulses with a pulse width exceeding 1 microsecond and fall under any of the following:

a.those which generate pulses exceeding 2 joules per pulse and with a peak output exceeding 50 watts;

b.those that oscillate in a single transverse mode with an average output exceeding 50 watts;

c.those that oscillate in a multiple transverse mode with an average output exceeding 80 watts;

8.those designed for use in a wavelength range exceeding 1,555 nanometers which fall under any of the following:

i.those which generate pulses exceeding 100 millijoules per pulse and with a peak output exceeding 1 watt;

ii.those with an average output exceeding 1 watt;

(c)variable wavelength laser oscillators that fall under any of the following (excluding those falling under (d)):

1.those designed for use in a wavelength range of less than 600 nanometers, which fall under any of the following:

i.those which generate pulses exceeding 50 joules per pulse and with a peak output exceeding 1 watt;

ii.those with an average output or continuous wave rated output exceeding 1 watt;

2.those designed for use within a wavelength range exceeding 600 nanometers and 1,400 nanometers or less which fall under any of the following:

i.those which generate pulses exceeding 1 joules per pulse and with a peak output exceeding 20 watts;

ii.those with an average output or continuous wave rated output exceeding 20 watts;

3.those designed for use in a wavelength range exceeding 1,400 nanometers, which fall under any of the following:

i.those which generate pulses exceeding 50 millijoules per pulse and with a peak output exceeding 1 watt;

ii.those with an average output or continuous wave rated output exceeding 1 watt;

(d)laser oscillators that fall under any of the following:

1.semiconductor laser oscillators which fall under any of the following:

i.a single semiconductor laser diode that oscillates in a single transverse mode and falls under any of the following:

a.those which are designed for use within a wavelength range of 1,510 nanometers or less, those with an average output or continuous wave rated output exceeding 1.5 watts;

b.those which are designed for use within a wavelength range exceeding 1,510 nanometers, those with an average output or continuous wave rated output exceeding 500 milliwatts;

ii.a single semiconductor laser diode that oscillates in a multiple transverse mode and falls under any of the following:

a.among those which are designed for use within a wavelength range of less than 1,400 nanometers, those with an average output or continuous wave rated output exceeding 15 watts;

b.among those which are designed for use within a wavelength range of 1,400 nanometers or more and less than 1,900 nanometers, those with an average output or continuous wave rated output exceeding 2.5 watts;

c.among those which are designed for use within a wavelength range of 1,900 nanometers or more, those with an average output or continuous wave rated output exceeding 1 watt;

iii.a single semiconductor laser bar that falls under any of the following (excluding those incorporated into semiconductor laser stacked arrays referred to in iv. or v.):

a.a single semiconductor laser bar designed for use within a wavelength range of less than 1,400 nanometers, with an average output or continuous wave rated output exceeding 100 watts;

b.a single semiconductor laser bar designed for use within a wavelength range of 1,400 nanometers or more and less than 1,900 nanometer, with an average output or continuous wave rated output exceeding 25 watts;

c.a single semiconductor laser bar designed for use within a wavelength range of 1,900 nanometers or more, with an average output or a continuous wave rated output exceeding 10 watts;

iv.semiconductor laser stacked arrays falling under any of the following:

a.semiconductor laser stacked arrays designed for use in a wavelength range of less than 1,400 nanometers, which fall under any of the following:

1semiconductor laser stacked arrays with a total average output or continuous wave rated output of less than 3 kilowatts, and an average output density or continuous wave rated output density exceeding 500 watts per square meter;

2semiconductor laser stacked arrays with a total average output or total continuous wave rated output of 3 kilowatts or more and 5 kilowatts or less, and an average output density or continuous wave rated output density exceeding 350 watts per square meter;

3semiconductor laser stacked arrays with a total average output or total continuous wave rated output exceeding 5 kilowatts;

4semiconductor laser stacked arrays with a peak pulsed output density exceeding 2,500 watts per square meter;

5semiconductor laser stacked arrays with a spatially coherent total average output or total continuous wave rated output exceeding 150 watts;

b.semiconductor laser stacked arrays designed for use in a wavelength range of 1,400 nanometers or more and less than 1,900 nanometers, which fall under any of the following:

1semiconductor laser stacked arrays with a total average output or total continuous wave rated output of less than 250 watts, and an average output density or continuous wave rated output density exceeding 150 watts per square meter;

2semiconductor laser stacked arrays with a total average output or continuous wave rated output of 250 watts or more and 500 watts or less, and an average output density or continuous wave rated output density exceeding 50 watts per square meter;

3semiconductor laser stacked arrays with a total average output or continuous wave rated output exceeding 500 watts;

4semiconductor laser stacked arrays with a peak pulsed output density exceeding 500 watts per square meter;

5semiconductor laser stacked arrays with a spatially coherent total average output or total continuous wave rated output exceeding 15 watts;

c.semiconductor laser stacked arrays designed for use in a wavelength range of 1,900 nanometers or more, which fall under any of the following:

1semiconductor laser stacked arrays with an average output density or continuous wave rated output density exceeding 50 watts per square meter;

2semiconductor laser stacked arrays with a total average output or total continuous wave rated output exceeding 10 watts;

3semiconductor laser stacked arrays with a spatially coherent total average output or continuous wave rated output exceeding 1.5 watts;

d.semiconductor laser stacked arrays that contain at least one or more semiconductor laser bar that fall under iii.;

v.among semiconductor laser stacked arrays that are designed to be combined with other semiconductor laser stacked arrays, those having integrated connections to share electronic circuits and cooling units with other semiconductor laser stacked arrays (excluding those falling under iv.);

2.carbon monoxide laser oscillators which fall under any of the following:

i.carbon monoxide laser oscillators which generate pulses exceeding 2 joules per pulse, with a peak output exceeding 5 kilowatts;

ii.carbon monoxide laser oscillators with an average output or continuous wave rated output exceeding 5 kilowatts;

3.carbon dioxide laser oscillators which fall under any of the following:

i.carbon dioxide laser oscillators with a continuous wave rated output exceeding 15 kilowatts;

ii.carbon dioxide laser oscillators which generate pulses at a pulse width exceeding 10 microseconds and fall under any of the following:

a.carbon dioxide laser oscillators with an average output exceeding 10 watts;

b.carbon dioxide laser oscillators with a peak output exceeding 100 kilowatts;

iii.carbon dioxide laser oscillators which generate pulses at a pulse width of 10 microseconds or less, and fall under any of the following:

a.carbon dioxide laser oscillators which generate pulses exceeding 5 joules per pulse;

b.carbon dioxide laser oscillators with an average output exceeding 2.5 kilowatts;

4.excimer laser oscillators which fall under any of the following:

i.excimer laser oscillators designed for use within a wavelength range of 150 nanometers or less that fall under any of the following:

a.excimer laser oscillators which generate pulses exceeding 50 millijoules per pulse;

b.excimer laser oscillators with an average output exceeding 1 watt;

ii.excimer laser oscillators which are designed for use within a wavelength range exceeding 150 nanometers and 190 nanometers or less and which fall under any of the following:

a.excimer laser oscillators which generate pulses exceeding 1.5 joules per pulse;

b.excimer laser oscillators with an average output exceeding 120 watts;

iii.excimer laser oscillators which are designed for use within a wavelength range exceeding 190 nanometers and 360 nanometers or less and which fall under any of the following:

a.excimer laser oscillators which generate pulses exceeding 10 joules per pulse;

b.excimer laser oscillators with an average output exceeding 500 watts;

iv.excimer laser oscillators which are designed for use at a wavelength range exceeding 360 nanometers and which fall under any of the following:

a.excimer laser oscillators which generate pulses exceeding 1.5 joules per pulse;

b.excimer laser oscillators with an average output exceeding 30 watts;

5.chemical laser oscillators which fall under any of the following:

i.hydrogen fluoride laser oscillators;

ii.deuterium fluoride laser oscillators;

iii.transfer laser oscillators which fall under any of the following:

a.iodine laser oscillators designed to be capable of being excited by excitation transfer from oxygen;

b.carbon dioxide laser oscillators designed to be capable of being excited by excitation transfer from deuterium fluoride;

6.neodymium glass laser oscillators which generate non-repetitive pulses and fall under any of the following:

i.neodymium glass laser oscillators which generate pulses at a pulse width of 1 microsecond or less, and pulses exceeding 50 joules per pulse;

ii.neodymium glass laser oscillators which generate pulses at a pulse width exceeding 1 microsecond and pulses exceeding 100 joules per pulse;

(e)components for laser oscillators which fall under any of the following:

1.reflectors which are designed for cooling by using a heat pipe or by passing a fluid at a position which is less than 1 millimeter beneath the surface of the mirror;

2.reflectors, or optical components or electro-optical components which are permeable (including partially permeable), and which are designed for use in laser oscillators which fall under any of (a) through (d);

(f)test equipment or accessories for laser oscillators which fall under any of the following:

1.among equipment for measuring wave surface which is capable of measuring the phase of a wave surface of laser light at 50 or more locations, those that fall under any of the following:

i.equipment for measuring wave surface with a frame speed of 100 hertz or more and with a phase identification capability of 5 % or less of the wavelength of the laser light;

ii.equipment for measuring wave surface with a frame speed of 1,000 hertz or more and with a phase identification capability of 20 % or less of the wavelength of the laser light;

2.test equipment for laser oscillators which is capable of measuring errors in the beam deflection angle of an ultra-high output laser oscillator (laser oscillators which are capable of output energy exceeding 1 kilo-joule per 50 milliseconds or the average output or continuous wave rated output of which exceeds 20 kilowatts; the same applies hereinafter) of less than 10 microradians;

3.accessories for phased array type ultra-high output laser oscillators which synthesize coherent light at 1/10 of the wavelength used or at a precision of 0.1 micrometers or less;

4.projection telescopes which are designed for use in combination with ultra-high output laser oscillators;

(x)-2equipment to detect sounds by using laser beams, which falls under all of the following (a) through (e):

(a)those with a continuous wave rated output of the laser oscillator of 20 milliwatts or more;

(b)those where frequency stability of the laser oscillator is 10 megahertz or less;

(c)those for which the wavelength range of the laser oscillator is 1,000 nanometers or more and 2,000 nanometers or less;

(d)those for which the resolution of the optical system is less than 1 nanometer;

(e)those for which the signal noise ratio is 1,000 or more;

(xi)magnetometers, magnetic gradiometers (excluding those designed for medical use), or underwater electric field sensors (excluding those for fishery) or calibration equipment or components thereof which fall under any of the following (excluding those designed for medical purposes):

(a)magnetometers which utilize superconducting technology which fall under any of the following:

1.among magnetometers which utilize superconducting technology designed so that they are capable of being operated in a stationary state, not having a device which is designed to reduce noise occurring during operations, those for which the sensitivity at a 1 hertz frequency (the effective value indicated per square root of the band frequency; the same applies hereinafter) is 50 femtoteslas or less;

2.magnetometers which utilize superconducting technology having a device designed to reduce noise occurring during operations, the sensitivity at a 1 hertz frequency of which is less than 20 picoteslas;

(b)magnetometers which utilize an optical pump or nuclear magnetic resonance technology, the sensitivity at a 1 hertz frequency of which is less than 2 picoteslas;

(c)magnetometers which utilize an optical pump or nuclear magnetic resonance technology, the sensitivity at a 1 hertz frequency of which is 2 picoteslas or more and less than 20 picoteslas;

(d)magnetometers which utilize triaxial flux gate technology, the sensitivity at a 1 hertz frequency of which is 10 picoteslas or less;

(e)magnetometers using an induction coil which fall under any of the following:

1.magnetometers which use an induction coil, the sensitivity at a frequency of less than 1 hertz of which is less than 0.05 nanoteslas;

2.magnetometers which use an induction coil, the sensitivity at frequencies of 1 hertz or more and 10 hertz or less of which is less than 0.001 nanoteslas;

3.magnetometers which use an induction coil, the sensitivity at frequencies exceeding 10 hertz of which is less than 0.0001 nanoteslas;

(f)magnetometers which use optical fibers, the sensitivity of which is less than 1 nanotesla;

(g)underwater electric field sensors, the sensitivity where measured at a frequency of 1 hertz is less than 8 nanovolts per meter;

(h)magnetic gradiometers using two or more magnetometers which fall under any of (a) through (f) above;

(i)among magnetic gradiometers which use optical fibers and intrinsic type gradiometers (those having a single detection element per axle; hereinafter the same applies in this item), those the sensitivity of which is less than 0.3 nanoteslas per meter;

(j)among magnetic gradiometers which do not use optical fibers and which are intrinsic gradiometers, those the sensitivity of which is less than 0.015 nanoteslas per meter;

(k)among calibration equipment for magnetometers, magnetic gradiometers or underwater electric field sensors, those designed for magnetometers, magnetic gradiometers or underwater electric field sensors having the functions equivalent or more to the functions held by the goods that fall under any of (a) through (j) (excluding goods falling under (l) below));

(l)calibration equipment for magnetometers or magnetic gradiometers or underwater electric field sensors which are designed for goods falling under any of the following:

1.magnetometers which fall under (c) and utilize an optical pump or nuclear magnetic resonance technology to achieve a sensitivity of less than 2 picoteslas;

2.underwater electric field sensors which fall under (g);

3.magnetic gradiometers which fall under any of (h) through (j), and which achieve a sensitivity of less than 3 picoteslas;

(m)magnetic gradiometers using magnetometers which fall under (a) or (b);

(xi)-2equipment to detect magnetic fields or electric fields underwater, which falls under any of the following:

(a)equipment that incorporates magnetometers that fall under (a) or (b) of item (xi);

(b)equipment that incorporates magnetometers that fall under any of (c) through (f) of item (xi) or underwater electric field sensors that fall under (g) of the same item;

(xii)gravity meters that fall under any of the following or gravity gradiometers:

(a)gravity meters designed for ground use with a precision of less than 10 microgals when gravity is measured in a stationary state (excluding Woldon types);

(b)gravity meters designed for mounting on movable bodies that fall under the following 1. and 2.:

1.gravity meters the precision of which when gravity is measured in a stationary state is less than 0.7 milligals;

2.gravity meters the precision of which when gravity is measured in a fluctuating state is less than 0.7 milligals and for which required measuring time is less than 2 minutes;

(xiii)radar that falls under any of the following or components thereof (excluding secondary supervisory radars, civil automotive radars, meteorological radars, precision approach radars based on International Civil Aviation Organization standards and components thereof (including components for a radar that are display equipment for air traffic control):

(a)radar that can be used within a frequency range of 40 gigahertz or more and 230 gigahertz or less and fall under any of the following:

1.radar with an average output exceeding 100 milliwatts;

2.radar with a locating accuracy of 1 meter or less in range, and a locating accuracy of 0.2 degrees or less in azimuth;

(b)radar having a bandwidth capable of being tuned that exceeds the center frequency by 12.5 %;

(c)radar which is capable of using three or more carrier frequencies simultaneously;

(d)radar which is capable of being used as synthetic aperture radar, reverse synthetic radar or supervisory radar;

(e)radar with built-in array antennas which are capable of electronic scanning;

(f)radar which is capable of measuring a target altitude;

(g)radar which is designed to be mounted on balloons or aircraft and which utilize the Doppler effect to detect a moving target;

(h)radar which utilizes any of the following technologies:

1.spread spectrum;

2.frequency agility;

(i)radar for ground use, the measured distance of which exceeds 185 km (excluding fishing ground supervisory radar and ground radar and meteorological balloon tracking radar designed for air traffic control);

(j)laser radar (including lidar) which falls under any of the following:

1.laser radar designed for space use;

2.laser radar which utilizes heterodyne phase detection or homodyne phase detection technology and the angular resolution of which is less than 20 microradians;

3.laser radar designed for implementing bathymetric littoral surveys using aircraft, which has sufficient precision in light of the standard specified by the International Hydrographic Organization (IHO) for hydrographic surveys, and which uses one or more of the laser oscillators used within a wavelength exceeding 400 nanometers and 600 nanometers or less;

(k)radar which utilizes pulse compression technology which fall under any of the following:

1.radar with a pulse compression ratio exceeding 150;

2.radar with a compressed pulse width less than 200 nanoseconds (excluding two-dimensional marine radar or two-dimensional radar for ship navigation services which falls under all of the following i. through v.):

i.radar with a pulse compression ratio of less than 150;

ii.radar with a compressed pulse width exceeding 30 nanoseconds;

iii.radar with a single rotating mechanical scanning antenna;

iv.radar with a peak output of less than 250 watts;

v.radar without the capability of frequency hopping;

(l)radar which utilizes data processing technology which falls under any of the following (excluding equipment used for ship navigation services or components thereof):

1.automatic target tracking technology which is capable of estimating the future position of a target starting from the point where the next antenna beam passes (excluding collision prevention functions for air traffic control or marine radar);

2.deleted;

3.technology which carries out the superposition, correlation, or fusion of target data obtained from two or more radars with a mutual distance exceeding 1,500 meters within 6 seconds, for the purpose of improving the aggregate performance beyond that of any single radar falling under (f) or (i) of item (xiii);

4.technology which carries out the superposition, correlation, or fusion of target data obtained from two or more types of radar which include radar installed on airframes for vehicles, vessels, aircraft or satellites or other types of spacecraft for space development within 6 seconds, for the purpose of improving the aggregate performance beyond that of any single radar falling under (f) or (i) of item (xiii);

(xiv)optical measuring equipment that falls under any of the following:

(a)equipment for measuring optical reflectance (limited to those which measure the absolute value of reflectance) the precision absolute value of which is 0.1 % or less;

(b)among equipment (limited to non-contact type) for measuring the surface shape of lenses or reflectors, which uses a method other than measurement of light scattering, that having an aperture diameter exceeding 10 centimeters and designed for measuring surface shapes which are not planar at a precision of 2 nanometers or less;

(xv)equipment for the manufacture or calibration equipment of gravity meters for ground use (limited to those the precision of which, when gravity is measured in a stationary state, is less than 0.1 milligals);

(xvi)crystals for optical detectors and other material or laser oscillators made of a material for optical components that falls under any of the following:

(a)tellurium with a purity of 99.9995 % or more;

(b)wafers having a single crystal or epitaxial growth crystal which fall under any of the following:

1.cadmium zinc telluride the mole ratio for zinc telluride relative to cadmium telluride and zinc telluride for which is less than 6 %;

2.cadmium telluride;

3.cadmium mercury telluride;

(c)among substrate materials made up of zinc selenide or zinc sulfide manufactured by the chemical vapor phase growth methods, those which fall under any of the following:

1.substrate materials, the volume of which exceeds 100 cubic centimeters;

2.substrate materials, the diameter of which exceeds 80 millimeters and the thickness of which is 20 millimeters or more;

(d)electro-chemical materials or non-linear optical materials which fall under any of the following:

1.potassium titanyl arsenate;

2.silver gallium selenide;

3.arsenic thallium selenide;

4.zinc germanium phosphide;

5.gallium selenide;

(e)non-linear optical materials which fall under any of the following (excluding those which fall under (d)):

1.non-linear optical materials whose dynamic cubic non-linear susceptibility is greater than 1/1,000,000 per square meter per volt per volt and whose response time is less than 1 millisecond;

2.non-linear optical materials whose quadratic non-linear susceptibility is 33/1,000,000,000,000 or more, expressed in meter per volt;

(f)substrate materials made up of materials having beryllium stacked on beryllium or substrate material made up of silicon carbide having a diameter or major axis length which exceeds 300 millimeters;

(g)optical glass which falls under all of the following 1. through 3.:

1.optical glass the hydroxide ion content of which is less than 0.0005 % of the total weight;

2.optical glass the metal impurities content of which is less than 0.0001 % of the total weight;

3.optical glass the refractive index variation of which is less than 5/1,000,000;

(h)artificial diamonds the absorption coefficient of which is less than 1/100,000 per centimeter within a wavelength range exceeding 200 nanometers and 14,000 nanometers or less;

(i)among artificial crystals for laser oscillators that are unfinished, sapphires with titanium added.

Article 10Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 11 of the appended table 1 of the Export Order fall under any of the following:

(i)accelerometers that fall under any of the following or components thereof:

(a)linear accelerometers that fall under any of the following:

1.linear accelerometers designed to be capable of being used at a linear acceleration of 147.15 meters per second squared, which fall under any of the following:

i.linear accelerometers with a bias stability (following calibration; hereinafter the same applies in this Article) of less than 0.00128 meters per second squared per year;

ii.linear accelerometers with a scale factor stability of less than 0.013 % per year;

2.linear accelerometers designed to be capable of being used at a linear acceleration exceeding 147.15 meters per second squared and 981 meters per second squared or less, and that fall under the following i. and ii.:

i.linear accelerometers with a bias reproducibility of less than 0.0122625 meters per second squared per year;

ii.linear accelerometers with a scale factor reproducibility of less than 0.125% per year;

3.linear accelerometers designed for use in inertial navigation systems or guidance systems, and designed to be capable of being used at a linear acceleration exceeding 981 meters per second squared;

(b)angular accelerometers or rotary accelerometers designed to be capable of being used at a linear acceleration exceeding 981 meters per second squared;

(ii)gyroscopes or angular accelerometers which fall under any of the following or components thereof:

(a)gyroscopes or angular accelerometers designed to be capable of being used at a linear acceleration of 981 meters per second squared or less, and that fall under any of the following:

1.gyroscopes or angular accelerometers with a rate range of less than 500 degrees per second, which fall under any of the following:

i.gyroscopes or angular accelerometers with a bias stability of less than 0.5 degrees per hour when measured in a 9.81 meters per second squared environment over a period of one month;

ii.gyroscopes or angular accelerometers the effective value of which indicates the angular random walk in degrees per square root of hours of 0.0035 degrees or less (excluding spinning mass gyro);

2.gyroscopes or angular accelerometers with a rate range of 500 degrees per second or more, which fall under any of the following:

i.gyroscopes or angular accelerometers with a bias stability of less than 4 degrees per hour when measured in a 9.81 meters per second squared environment over three minutes;

ii.gyroscopes or angular accelerometers the effective value of which indicates the angle random walk in degrees per square root of hours of 0.1 degrees or less (excluding spinning mass gyro);

(b)gyroscopes, angular accelerometers or rotary accelerometer designed so that they are capable of being used at a linear acceleration which exceeds 981 meters per second squared;

(iii)inertial navigation systems and other systems utilizing inertia force which fall under any of the following (excluding those certified for civil aviation use by Japan or by any of the government organizations indicated in the regions listed in the appended table 2) or components thereof:

(a)those designed for aircraft use, land vehicle use, or ship use that provide location information without relying on location reference information, and with an accuracy after normal alignment that falls under any of the following:

1.those in which mean error radius is 0.8 nautical miles per hour or less;

2.those in which mean error radius is 0.5% or less of a travel distance;

3those in which mean error radius is 1 nautical mile or less in total drift per 24 hours;

(b)those designed for aircraft use, land vehicle use, or ship use which incorporate location reference information and provide location information within 4 minutes after the loss of all location reference information, and with a mean error radius of less than 10 meters;

(c)those designed for aircraft use, land vehicle use, or ship use which indicate the true north direction and fall under any of the following:

1.those with the maximum operating angular velocity of less than 500 degrees per second and in which the accuracy of nose direction without using location reference information is the value obtained by dividing 0.07 degrees by the cosine of latitude or less, or six minutes or less at 45 degrees latitude;

2.those with the maximum operating angular velocity of 500 degrees or more per second and in which the accuracy of nose direction without using location reference information is the value obtained by dividing 0.2 degrees by the cosine of latitude or less, or 17 minutes or less at 45 degrees latitude;

(d)those which provide acceleration measurement values or angular velocity measurement values in two dimensions or more and fall under any of the following:

1.those of specifications specified in item (i) or the preceding item along any axis, without using any reference information;

2.those designed for space use whose effective value indicates the angular random walk along any axis in degrees per square root of hours of 0.1 degrees or less, and which provide angular velocity measurement values (excluding inertial navigation systems and other systems utilizing inertia force that incorporate spinning mass gyros only);

(iv)gyroscopes for celestial navigation, devices that derive position or orientation by means of automatically tracking celestial bodies or satellites, or components thereof which fall under any of the following:

(a)gyroscopes for celestial navigation or devices that derive position or orientation by means of automatically tracking celestial bodies or satellites and which have a bearing accuracy of 20 seconds or less;

(b)among components designed for gyroscopes for celestial navigation or devices that derive position or orientation by means of automatically tracking celestial bodies or satellites and which fall under (a), those which fall under any of the following:

1.optical heads or baffles;

2.data processing units;

(v)devices which receive radio waves from global navigation satellite systems that fall under any of the following, or components thereof:

(a)those having a decryption algorithm to access the ranging code for position and time (excluding those designed for civil use);

(b)those constituting an adaptive antenna system;

(vi)among aircraft altimeters which are designed for use at frequencies greater than 4.4 gigahertz or at frequencies lower than 4.2 gigahertz, those which fall under any of the following:

(a)aircraft altimeters having a transmission output control function;

(b)aircraft altimeters having a phase deviation modulation function;

(vii)among underwater sonar navigation systems integrating a heading sensor and using Doppler velocity or correlation velocity, those having a positioning accuracy of 3 % or less of distance travelled by circular error probability, or components thereof;

(viii)test equipment, calibration equipment, alignment equipment or equipment for manufacture that fall under any of item (i) through item (vii);

(ix)devices which are designed to confirm the characteristics of the mirror surface of a ring laser gyro that fall under any of the following:

(a)scatterometers having a measuring precision of 0.001 % or less;

(b)profilometers having a measuring precision of 0.5 nanometers or less.

Article 11Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 12 of the appended table 1 of the Export Order fall under any of the following:

(i)among small mooring-rope type submersible boats which are designed so that they are capable of being used at depths exceeding 1,000 meters, those which fall under any of the following:

(a)manned submersible vessels;

(b)unmanned submersible vessels which fall under any of the following:

1.small unmanned submersible vessels which use direct current propulsion electric motors and which are designed so that they are capable of being used for navigation unaided;

2.small unmanned submersible boats capable of transmitting and receiving data using optical fiber;

(ii)equipment which is used to recover objects at depths exceeding 250 meters having a cargo unloading capability exceeding 5 meganewtons and which fall under any of the following:

(a)equipment having an automatic ship position maintaining device which is capable of maintaining the position of the ship within a range of 20 meters from a point set by the navigation device;

(b)equipment which is capable of maintaining a position within a range of 10 meters from a preset point at depths exceeding 1,000 meters;

(iii)surface ships which fall under any of the following:

(a)air-cushion vehicles which fall under any the following:

1.among side wall type vehicles (limited to those with attached flexible skirts on the periphery of the ship's hull) designed so that the maximum value of the speed when full, and when the significant wave height is 1.25 meters or more, and the speed of which exceeds 30 knots, those for which the cushioning pressure exceeds 3,830 pascals and the ratio of light load displacement relative to full load displacement is less than 70 %;

2.side wall type vehicles which are designed so that the maximum value of the speed when full when the significant wave height is 3.25 meters or more, exceeds 40 knots;

(b)among hydrofoil ships which are designed so that the maximum value of the speed when full when significant wave height is 3.25 meters or more exceeds 40 knots, those which have a device to automatically control the hydrofoil by measuring the condition of the waves and other data;

(c)vessels which are designed so that they are capable of reducing wave creation resistance by reducing the area of the water line which falls under any of the following:

1.vessels in which full load displacement exceeds 500 tons and which are designed so that the maximum value of the speed when full when the significant wave height is 3.25 meters or more exceeds 35 knots;

2.vessels for which full load displacement exceeds 1,500 tons and which are designed so that the maximum value of speed when full when the significant wave height is 4 meters or more exceeds 25 knots;

(iv)components or auxiliaries for submersible vessels which fall under any of the following:

(a)components for submersible vessels which are designed so that they are capable of being used at depths exceeding 1,000 meters which fall under any of the following:

1.pressure-resistant containers or pressure-resistant shells in which maximum internal dimensions exceed 1.5 meters;

2.direct current propulsion electric motors or thrusters;

3.umbilical cables or connectors which use tension members made of optical fiber and synthetic materials;

4.components using material that falls under item (xii);

(b)among automatic control devices which are designed so that they are capable of being used in submersible vessels which use navigation data and which are servo control systems, those that fall under the following 1. and 2.:

1.automatic control devices which are capable of being used for submersible vessels which fall under item (i), (b) or Article 14, item (ix);

2.automatic control devices which fall under any of the following:

i.automatic control devices which are capable of moving submersible vessels inside a water column having a radius of 10 meters having a preset center point in the water;

ii.automatic control devices which are capable of holding a submersible vessel inside a water column having a radius of 10 meters having a preset center point in the water;

iii.automatic control devices which are capable of holding a small submersible vessel to within 10 meters of a cable when moving along a cable which is at the bottom of the sea or beneath the sea;

(c)among automatic control devices which are designed so that they are capable of being used in submersible vessels, which use navigation data and which are servo control systems, those that fall under 1. and 2. (excluding those falling under (b)):

1.automatic control devices which are designed so that they are capable of being used in submersible vessels and which fall under item (i), (a);

2.automatic control devices that fall under any of the following:

i.automatic control devices which are capable of moving submersible vessels inside a water column having a radius of 10 meters having a preset center point in the water;

ii.automatic control devices which are capable of holding submersible vessels within a water column having a radius of 10 meters having a present center point in the water;

iii.automatic control devices which are capable of holding submersible vessels inside a water column within 10 meters from the cable when moving along a cable which is on the sea floor or beneath the sea;

(d)lead-through hardware of pressure-resistant shells used to draw optical fiber inside the hull of a ship;

(e)observation devices for underwater use that fall under any of the following:

1.underwater television devices which are designed so that they are capable of being mounted onto submersible vessels for remote control and with a resolution in air exceeding 800;

2.observation devices for underwater use which are designed so that they are capable of being used in submersible vessels for remote control and having a function which reduces the effect of backscattering;

(v)underwater cameras or auxiliaries thereof which fall under any of the following:

(a)television cameras that fall under any of the following:

1.television cameras with a resolution in air exceeding 1,100;

2.television cameras with a built-in image reinforcing tube listed in Article 9, item (iii), (b), 1. having more than 150,000 effective pixels for its solid-state image sensors;

(b)cameras which are designed or manufactured so that they are capable of being used at depths exceeding 150 meters (limited to those using film with a width of 35 millimeters or more) which fall under any of the following:

1.cameras which are capable of recording the depth, position and other measurement data on film;

2.cameras having a function which automatically compensates for the back focal distance;

3.cameras having an automatic control device which is designed so that its housing is capable of being used at depths exceeding 1,000 meters;

(c)lighting systems which fall under any of the following:

1.among lighting systems which use the stroboscopic method, in which energy per flash exceeds 300 joules, those that are capable of emitting light in excess of five times per second;

2.lighting systems which use argon arcs which are designed so that they are capable of being used at depths exceeding 1,000 meters;

(vi)underwater robots (excluding maneuvering robots and sequence robots) which fall under any of the following:

(a)underwater robots which control use of information from a sensor which measures the force or torque applied to an external object or the distance to tactual sense with the external object;

(b)underwater robots which use titanium alloy or fiber reinforced composite materials as structural materials and which are capable of being operated under a force of more than 250 newtons or at a torque greater than 250 newton meters;

(vii)remote control manipulators (limited to those which are articulated) which are designed so that they can be used together with submersible vessels which fall under any of the following:

(a)remote control manipulators which use information from a sensor which measures the force applied to an external object or the torque or the tactual sense upon the external object;

(b)remote control manipulators which control the use of a master-slave system with a degree of freedom of motion of 5 or more;

(viii)power units which are capable of being used when they are cut off from the air that fall under any of the following:

(a)brayton cycle engines or Rankine cycle engines having a device that falls under any of the following:

1.equipment which is designed so that it is capable of removing carbon monoxide, carbon dioxide as well as particles from the exhaust air which is circulating;

2.equipment designed so that it is capable of utilizing monoatomic gases;

3.soundproofing devices or enclosures designed so that they are capable of reducing underwater noise at frequencies of less than 10 kilohertz or equipment which is designed so that it is capable of mitigating; collisions;

4.equipment designed so that it is capable of compressing reaction products or recycling them as fuel, storing the reaction products and discharging the reaction products at pressures of more than 100 kilopascals;

(b)diesel engines having equipment that falls under all of the following 1. through 4.:

1.equipment designed so that it is capable of removing carbon monoxide, carbon dioxide and fine particles from exhaust air which is circulating;

2.equipment which is designed so that it is capable of utilizing monoatomic gases;

3.soundproofing devices or enclosures which are designed so that they are capable of reducing underwater noise at frequencies of less than 10 kilohertz or equipment which is designed so that it is capable of mitigating collisions;

4.equipment which is designed so that it is capable of discharging combustion products intermittently;

(c)fuel cells with an output exceeding 2 kilowatts and having a device that falls under any of the following:

1.soundproofing devices or enclosures which are designed so that they are capable of reducing underwater noise at frequencies of less than 10 kilohertz or equipment designed so that it is capable of mitigating collisions;

2.equipment which is designed so that it is capable of compressing reaction products or recycling them as fuel, which are capable of storing the reaction products and discharging reaction products at pressures greater than 100 kilopascals;

(d)sterling cycle engines having equipment which falls under any of the following 1. and 2.:

1.soundproofing devices or enclosures which are designed so that they are capable of reducing underwater noise at frequencies of less than 10 kilohertz or equipment which is designed so that it is capable of mitigating collisions;

2.equipment which is designed so that it is capable of discharging reaction products at pressures greater than 100 kilopascals;

(ix)components for surface ships which fall under item (iii), and which fall under any of the following:

(a)flexible skirts, seals or fingers which fall under any of the following:

1.among flexible skirts, seals or fingers which are designed so that they are capable of being used in air-cushion vehicles which fall under item (iii), (a), 1. in which cushioning pressure is 3,830 pascals or more, those which are capable of being used when the significant wave height is 1.25 meters or more;

2.among flexible skirts, seals or fingers which are designed so that they are capable of being used in air-cushion vehicles which fall under item (iii), (a), 2. and in which cushioning pressure is greater than 6,224 pascals, those which are designed so that they are capable of being used when the significant wave height is 3.25 meters or more;

(b)levitation fans which are designed so that they are capable of being used on air-cushion vehicles which fall under item (iii), (a) in which rated output exceeds 400 kilowatts;

(c)totally submersible hydrofoils which are designed so that they are capable of being used in hydrofoil ships which fall under item (iii), (b) which are designed to reduce capitation damage;

(d)automatic stabilizing control devices which utilize the shaking of the ship's hull, wave conditions and other measurement data;

(e)super capitation propellers, semi-submersible propellers or surface propellers, the rated output of which exceeds 7.5 megawatts;

(f)double reversing propeller devices, the rated output of which exceeds 15 megawatts;

(g)equipment having a function which rectifies the stream which faces the propeller;

(h)decelerators the K value of which is indicated in the standards of the American Gear Industry Association and exceeds 300;

(i)transmission shaft equipment which uses composite materials which are capable of transmitting output greater than 1 megawatt;

(x)vessel components which fall under any of the following:

(a)variable pitch propellers or hubs thereof with a rated output exceeding 30 megawatts;

(b)internal liquid-cooling type electric propulsion engines in which output exceeds 2.5 megawatts;

(c)superconductive propulsion engines or electric propulsion engines using a permanent magnet having an output greater than 0.1 megawatts;

(d)power transmission shaft equipment using a composite material which is capable of transmitting output exceeding 2 megawatts;

(e)among screw propeller devices which are designed so that air from the propeller is capable of being discharged or so that air is capable of being supplied to the propeller, those with a rated output exceeding 2.5 megawatts;

(f)among soundproofing devices which are capable of being used on vessels in which the displacement is greater than 1,000 tons which reduces sound or vibration at frequencies of less than 500 hertz generated from diesel engines, diesel generators, gas turbine engines, gas turbine generators, propulsion electric motors, reducers, those made of a composite sound insulating base the intermediate mass weight of which exceeds 30 % of the weight of the device installed on it;

(g)equipment which uses a divergent nozzle or which uses technology relating to a straightening vane to upgrade the driving force of the screw propeller or to reduce underwater noise in which the output exceeds 2.5 megawatts;

(xi)a rotation current water tank designed to measure noise coming from the stream around a model propeller in a sound field, with a background noise of less than 100 decibels within a frequency range of 0 hertz or more and 500 hertz or less when the standard sound pressure is 1 micropascal and the frequency width is 1 hertz;

(xii)buoyant materials which fall under the following (a) and (b):

(a)buoyant materials designed so they are capable of being used at depths exceeding 1,000 meters;

(b)buoyant materials the density of which is less than 561 kilograms per cubic meter;

(xiii)closed-circuit or semi-closed circuit self-contained diving equipment;

(xiv)equipment that disrupts a person's underwater activities by utilizing acoustic waves, and that is designed to have a sound pressure level of 190 decibels or more where frequencies of the acoustic wave used are 200 hertz or less.

Article 12Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 13 of appended table 1 of the Export Order fall under any of the following:

(i)gas turbine engines for aircraft which fall under any of the following:

(a)gas turbine engines for aircraft using technology (excluding programs) required for the design or manufacture of those which fall under any of Article 25, paragraph (3), item (ii), (a) through (g) and (j), item (iii) of the same paragraph, or item (iv) of the same paragraph or technology required for the design or manufacture of those which fall under the items of Article 27, paragraph (6); provided, however, that those falling under any of the following 1. and 2. are excluded:

1.gas turbine engines for aircraft which fall under all of the following:

i.gas turbine engines for aircraft certified by the governmental organization in Japan or in the region listed in the appended Table 2;

ii.those designed for use in civil aircraft for which a type certificate or documents equivalent to a type certificate which have been recognized by the International Civil Aviation Organization have been issued, with the relevant gas turbine engine;

2.aerial vehicle gas turbine engines designed for auxiliary power units which are certified by the governmental organization in Japan or in the region listed in the appended Table 2;

(b)gas turbine engines which are designed for use in aircraft designed so that the cruising time at speeds greater than Mach 1 exceeds 30 minutes;

(ii)gas turbines for vessels that fall under the following (a) and (b) or components thereof:

(a)gas turbines for vessels, the continuous rated output of which under standard conditions determined by international standardization organizations is greater than 24,245 kilowatts;

(b)gas turbines for vessels, with a fuel consumption per kilowatt of 0.219 kilograms or more at ranges where the continuous rated output under international standards is 35 % or more and 100 % or less;

(iii)among components of gas turbine engines using technology (excluding programs) required for design or manufacture of those which fall under any of Article 25, paragraph (3), item (ii), (a) through (g) and (j), item (iii) of the same paragraph, or item (iv) of the same paragraph or technology required for designing or manufacturing those which fall under the items of Article 27, paragraph (6), those designed for use in gas turbine engines which fall under any of the following:

(a)components which fall under item (i);

(b)components for which the region where they were designed or manufactured is Japan or a region outside the regions indicated in appended table 2 or not specified;

(iv)spacecraft for aerospace or spacecraft for launching thereof;

(v)internally stored liquid rocket propulsion units which fall under the next item;

(vi)components of liquid rocket propulsion units which fall under any of the following:

(a)very low temperature cooling systems, Dewar vessels, heat pipes and other very low temperature systems which are designed for use in spacecraft for aerospace or for spacecraft for launching thereto and with a liquid loss at very low temperatures of less than 30 % per year;

(b)among very low temperature containers or closed cycle cooling systems for use at temperatures of -173 degrees centigrade or less, those which are designed for use in spacecraft for aerospace, spacecraft for launch or aircraft which are capable of cruising at speeds exceeding Mach 3;

(c)storage containers or supply systems for hydrogen slush;

(d)gas generators or expander cycle turbine drive units for turbine pumps or components thereof with a discharge pressure of more than 17.5 megapascals or for turbine pumps therefor;

(e)propulsion generators or nozzles therefor having a thrust exceeding 10.6 megapascals;

(f)propellant storage equipment which utilizes capillary action or flexible bladders;

(g)liquid fuel injection devices in which individual orifice areas are 0.114 square millimeters or less;

(h)among thrust chambers or exit cones which are formed integrally of a single piece using a composite material of carbon and carbon fiber, and the density of which is exceeding 1.4 grams per cubic centimeter, those the tensile strength of which is exceeding 48 megapascals;

(vii)solid rocket propulsion units which fall under any of the following:

(a)solid rocket propulsion units, the specific impulse of which is more than 2.4 kilonewtons second per kilogram when the outlet pressure is brought to atmospheric pressure at sea level and the effective thrust capacity is greater than 1.1 meganewtons or when the pressure inside the combustor is 7 megapascals;

(b)solid rocket propulsion units in which stage mass fraction exceeds 88 % and in which propellant solid ratio exceeds 86 %;

(c)solid rocket propulsion units internally stored which fall under the next item;

(d)solid rocket propulsion units used to join the insulating material and propellant which use direct bonding motor design methods to obtain a mechanical joining strength which is greater than the strength of the propellant or to make a barrier for the chemical migration between the solid propellant and the insulating material of the motor case;

(viii)components for solid rocket propulsion units which fall under any of the following:

(a)components which join insulating material and propellant and which use liners to obtain a mechanical bonding strength which is greater than the strength of the propellant and to make a barrier against chemical migration between the solid propellant and the insulating material for the motor case;

(b)motor cases which use composite materials made using the filament winding method having a diameter greater than 0.61 meters or in which structural efficiency ratio is greater than 25 km;

(c)nozzles the thrust of which is greater than 45 kilonewtons or in which nozzle throat erosion ratio is less than 0.075 millimeters per second;

(d)movable nozzle or secondary injection propulsion direction control equipment which falls under any of the following:

1.those in which absolute value for the deflection range in the thrust vector is exceeding 5 degrees;

2.those in which angular velocity when changing the thrust vector is greater than 20 degrees per second;

3.those in which angular acceleration when changing the thrust vector is greater than 40 degrees per second squared;

(ix)hybrid rocket propulsion units which fall under any of the following:

(a)those total thrust capacity of which is greater than 1.1 meganewtons second;

(b)those the thrust of which when the outlet is in a vacuum is greater than 220 kilonewtons;

(x)components for spacecraft used for launching or propulsion equipment thereof or spacecraft for aerospace use which fall under any of the following:

(a)components of spacecraft used for launching (limited to those other than nose cones, the weight of which exceeds 10 kilograms) metal matrix composite materials which fall under Article 4, item (xii) or Article 4, item (xv), organic composite materials, ceramic matrices or intermetallic compound reinforcing materials;

(b)among components of propulsion equipment of spacecraft used for launching which are designed for use in propulsion equipment that falls under any of item (v), item (vii) or the preceding item, those using metal matrix composites, organic composites, ceramic matrices or intermetallic compound reinforcing materials which fall under Article 4, item (xii) or Article 4, item (xv) (excluding those listed in item (vi) or item (viii));

(c)components for spacecraft for aerospace use which are used to control dynamic response for structures or to actively control torsion;

(d)among liquid pulse rocket engines in which the thrust weight ratio is 1 kilonewton per kilogram or more, those engines whose response time is less than 0.030 seconds;

(x)-2unmanned aerial vehicles or components or auxiliaries therefor which fall under the following (a) or (b) (excluding model aircraft used for entertainment or sports):

(a)unmanned aerial vehicles that fall under any of the following:

1.unmanned aerial vehicles having autonomous flight capability;

2.unmanned aerial vehicles having a function which enables human control of flight exceeding a visible range using remote control based on a television monitor;

(b)components or auxiliaries for unmanned aerial vehicles that fall under any of the following:

1.components or auxiliaries for unmanned aerial vehicles designed for remotely controlling the unmanned aerial vehicles that fall under (a);

2.navigation systems, systems to measure attitude, guidance systems, attitude controllers, or flight controllers (excluding those falling under Article 10) that are designed to provide autonomous flight functions to the unmanned aerial vehicles that fall under (a);

3.components or auxiliaries for unmanned aerial vehicles designed to convert manned aerial vehicles to unmanned aerial vehicles that fall under (a);

4.air breathing reciprocating engines or rotary internal combustion type engines, designed or modified to propel unmanned aerial vehicles at altitudes above 15,240 meters;

(xi)equipment or tools (including molds) used to manufacture blades, vanes or tip shrouds by gas turbine casting which fall under any of the following:

(a)equipment for unidirectional solidification or for casting of single crystals;

(b)ceramic cores or shells;

(xii)real time controlling devices, measuring instruments (including sensors) or devices which collect and analyze data automatically, which fall under the following (a) and (b):

(a)those specially designed for the development of gas turbine engines or components therefor;

(b)those using technologies (excluding programs) necessary for the design or manufacture of those falling under Article 25, paragraph (3), item (iii) or (iv);

(xiii)devices for manufacturing brush seals for gas turbine engines or test equipment or components thereof whose peripheral speed when tipped exceeds 335 meters per second and are designed so that they are capable of being operated at temperatures exceeding 500 degrees centigrade;

(xiv)tools used for solid phase joining of wing and disk parts of gas turbine engines made of intermetallic compounds, super alloys or titanium;

(xv)devices for real-time control, measuring instruments (including sensors) or devices which collect and analyze data automatically which are designed for use in wind tunnels or devices which fall under any of the following:

(a)wind tunnels which are capable of creating conditions for velocities of Mach 1.2 or more;

(b)equipment which is capable of simulating flow environments exceeding Mach 5;

(c)wind tunnels or equipment which are capable of simulating the flow for a Reynolds number exceeding 25,000,000. However, this does not include test models which are restricted to two-dimensional sections;

(xvi)acoustic vibration test equipment which falls under all of the following (a) through (c):

(a)acoustic vibration test machines the sound pressure of which when the standard sound pressure is 20 micropascals is greater than 160 decibels;

(b)acoustic vibration test machines, the rated output of which is greater than 4 kilowatts;

(c)acoustic vibration test machines in which the laboratory temperature exceeds 1,000 degrees centigrade;

(xvii)equipment used to test rocket motors using non-destructive examination technology;

(xviii)converters which are designed so that they are capable of directly measuring the wall friction of a flow in which temperatures at stagnation point are greater than 560 degrees centigrade;

(xix)among components which are used for the rotating parts of gas turbine engines, and manufactured using powder metallurgy, tools which are used to manufacture components which are capable of being used at temperatures of 600 degrees centigrade or more when stress is applied which have a limit tensile strength of more than 60 %;

(xx)devices for the manufacture of those falling under item (x)-2.

Article 13(1)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry with row 14 (i) of appended table 1 of the Export Order fall under any of the following:

(i)aluminum powder, the particles of which are globular with a diameter of 60 micrometers or less and with an aluminum purity of 99 % or more;

(ii)iron powder with a particle diameter of 3 micrometers or less (limited to those manufactured using a method which reduces iron oxide using hydrogen) and with an iron purity of 99 % or more.

(2)Goods specified by the Order of the Ministry of Economy, Trade and Industry in row 14 (ii) of the appended table 1 of the Export Order fall under any of the following:

(i)substances having low explosives or high explosives as their major components which fall under any of the following:

(a)anidine triamine nitrate;

(b)titanium subhydride with a chemically correct mixture ratio of 0.65 or more and 1.68 or less;

(c)dinitroglycolyl;

(d)3-nitro-1,2,4-triazole-5-one;

(e)deleted;

(f)deleted;

(g)ammonium nitrate

(h)ammonium perchlorate;

(i)2-(5-cyanotetrazolate) pentamine cobalt (111) perchlorate;

(j)cis-bis (5-nitrotetrazolate) tetra amino cobalt(III) perchlorate;

(k)amino dinitrobenzofuroxan;

(l)diamino dinitrobenzofuroxane;

(ii)substances which are additives or precursors to low explosives or high explosives which fall under any of the following:

(a)azide methyl methyl oxetane or polymers thereof;

(b)basic copper salicylate;

(c)lead salicylate;

(d)deleted;

(e)deleted;

(f)bis (2,fluoro-2,2-dinitroethyl) formal;

(g)bis (2-hydroxyethyl) glycol amide;

(h)bis (2-methyl aziridinyl) methyl amino phosphine oxide;

(i)bis azide methyl oxetane or polymers thereof;

(j)bis chloromethyl oxetane;

(k)butadiene nitrile oxide;

(l)1,2,3-butanetriol trinitrate;

(m)dinitro azetidine tertiary butyl salt;

(n)high energy monomers having a nitro group, azide group, nitrate group, nitraza group or a difluoro amino group;

(o)poly-2,2,3,3,4,4-hexafluoro pentane-1,5-diol formal;

(p)poly-2,4,4,4,5,5,6,6-heptafluoro-2-trifluoro methyl-3-oxaheptane-1,7-diol formal;

(q)derivatives of polymers of glycidyl azide;

(r)hexabenzylhexaazaisowurtzitane;

(s)ultrafine powdered ferric oxide in which the surface area exceeds 250 square meters per gram and in which average particle diameter is 0.003 micrometers or less;

(t)beta lead resorcinate resorcinol acid;

(u)lead stannate;

(v)lead maleate;

(w)lead citrate;

(x)chelate of beta lead resorcinate or lead-copper lead salicylate;

(y)polymers of nitrate methyl methyl oxetane or 3-nitrate methyl-3-methyl oxetane;

(z)3-nitraza-1,5-pentane diisocyanate;

(aa)coupling agents for organic metal which are additive for propellant;

(bb)polycyano difluoroamino ethylene oxide;

(cc)polymers of polyglycidyl nitrate or nitrate methyl oxylane;

(dd)polynitro ortho carbonate;

(ee)propylene imine;

(ff)tetraacetyl benzyl hexaazoisoultrane;

(gg)cyanoethylated polyamine (excluding those listed in Article 3, item (vii), (s)) or cyanoethylated polyamine salts;

(hh)cyanoethylated poly amine with added glycydol (excluding those listed in Article 3, item (vii), (r));

(ii)derivatives of tris-1-(2-methyl) aziridinyl phosphine oxide;

(jj)additives of 1,2,3-tris (1,2-bis (difluoro amine) ethoxy) propane or tris binoxypropane;

(kk)1,3,5-trichlorobenzene;

(ll)1,2,4-butane triol;

(mm)1,3,5,7-tetraacetyl-1,3,5,7-tetraazocyclooctane;

(nn)1,4,5,8-tetraazadecaline;

(oo)polyepichlorohydrin, polyepichlorohydrin diol or polyepichlorohydrin triol having a low-molecular weight (molecular weight of 10,000 or less) and alcohol functional groups.

(3)Goods with specifications prescribed by the Order of the Ministry, Trade and Industry in row 14 (iii) of the appended table 1 of the Export Order which are diesel engines with an output of 37,3 kilowatts or more in which parts were made of non-magnetic materials weighting more than 75 % of the total weight, or components thereof.

(4)Deleted.

(5)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 14 (v) of the appended table 1 of the Export Order fall under any of the following:

(i)closed-circuit type self-contained diving equipment or components thereof;

(ii)semi-closed circuit type self-contained diving equipment or components thereof;

(iii)components for self-contained diving equipment, those designed for use in converting open circuit type self-contained diving equipment to closed circuit self-contained diving equipment or semi-closed circuit self-contained diving equipment.

(6)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 14 (vii) of appended table 1 of the Export Order are robots (excluding maneuvering robots and sequence robots; hereinafter the same applies in this paragraph) or controller or end effectors used for robots, and those which fall under the following or components thereof (excluding end effectors for robots):

(i)robots which are designed so that they are capable of using pressure oil in which ignition point is exceeding 566 degrees centigrade;

(ii)those which are designed to prevent the effect of electromagnetic pulses.

(7)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 14 (viii) of appended table 1 of the Export Order are electric braking shutters that have a shutter speed of less than 100 microseconds and utilize photochromic action or electro-optical effect (excluding those designed for cameras).

(8)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 14 (ix) of appended table 1 of the Export Order fall under any of the following:

(i)bromobenzyl cyanide;

(ii)chlorobenzal malononitrile;

(iii)chloroacetophenone;

(iv)dibenzo (b,f)-1,4-oxazebine;

(v)N-Nonanoylmorpholine;

(vi)diphenyl chloroarsine;

(vii)diphenyl amine chloroarsine (Adamsite);

(viii)diphenyl cyanoarsine;

(ix)equipment for application, protection, location or identification of substances which fall under any of the preceding items, or components thereof.

(9)Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 14 (x) of the appended table 1 of the Export Order are equipment specially designed to remove or dispose of improvised explosive devices, which fall under any of the following, or components or accessories thereof:

(i)those which are remotely operated vehicles;

(ii)those preventing the operation of improvised explosive devices by projectiles.

(10)Electronic equipment designed to automatically detect or identify explosives, which detects traces of explosives by utilizing any of the methods such as the measurement of surface acoustic waves, ion mobility spectrometry, differential mobility spectrometry, or mass spectrometry (limited to equipment capable of detecting less than 1 ppm vapor, or 1 mg solid or liquid, and excluding equipment designed solely for use as laboratory equipment or that designed to detect explosives without having the object passing through the equipment have any contact with such equipment).

Article 14Goods with specifications prescribed by the Order of the Ministry of Economy, Trade and Industry in row 15 of the appended table 1 of the Export Order fall under any of the following:

(i)molded goods (including semi-manufactured goods) using fibers that fall under Article 4, item (xv), (c) or (d) and whose matrix is an organic matter;

(ii)radio wave absorbers or conductive polymers that fall under any of the following:

(a)absorbers designed to be used as radio wave absorbers and that have a frequency exceeding 200 megahertz and less than 3 terahertz. However, this excludes those falling under any of the following, into and not mixed into coating materials:

1.non-magnetic fibrous absorbers;

2.absorbers (excluding those which are plate shaped) that do not absorb radio waves through magnetic loss;

3.plate shaped absorbers that fall under all of the following i. through iii.:

i.absorbers made of any of the following:

a.absorbers that use plastic foams containing carbon or organic matter and fall under 1 or 2:

1absorbers having radio wave reflectivity, measured for frequencies other than the frequency range of plus/minus 15% centered on the radio wave frequency for which absorption is a maximum, of 5% or more of the electric wave reflectivity of a metal plate;

2absorbert that cannot be used under exceeding 177 degrees centigrade;

b.absorbers that use ceramics and fall under the following 1 and 2:

1absorbers having radio wave reflectivity, measured for frequencies other than the frequency range of plus/minus15% centered on the radio wave frequency for which absorption is a maximum, of 20% or more of the electric wave reflectivity of a metal plate;

2absorbers that cannot be used at temperatures exceeding 527 degrees centigrade;

ii.absorbers with a tensile strength less than 7 meganewtons per square meter;

iii.absorbers with a compression strength less than 14 meganewtons per square meter;

4.absorbers made of sintered ferrites that fall under the following i. and ii.:

i.absorbers with the specific gravity exceeding 4.4;

ii.absorbers that cannot be used under temperatures exceeding 275 degrees centigrade;

(b)among optically non-transparent absorbers designed for the use as radio wave absorbers with the frequency exceeding 150 terahertz and less than 370 terahertz, those that do not transmit visible light;

(c)among absorbers that are conductive polymers with volume conductivity exceeding 10 kilosiemens per meter or surface electrical resistivity less than 100 ohms, those comprising any of the following polymers:

1.polyaniline;

2.polypyrole;

3.polythiophene;

4.polyphenylene vinylene;

5.polythylene vinylene;

(iii)pre-separated neptunium 237 with a weight exceeding 1 gram;

(iv)deleted;

(v)digitally controlled radio receivers with exceeding 1,000 channels (excluding those designed for the use in public cellular wireless communication) or components or accessories thereof that fall under all of the following (a) through (c):

(a)receivers capable of automatically scanning the electromagnetic spectrum;

(b)receivers capable of specifying the type of signals received and waves transmitted;

(c)receivers in which the time required for channel switching is less than 1 millisecond;

(v)-2equipment preventing the operation of improvised explosive devices or auxiliaries thereof which fall under any of the following:

(a)radio transmitters designed to explode improvised explosive devices before they reach their target or to prevent the explosion thereof (excluding those which fall under Article 8, item (v)-3);

(b)equipment which is used together with radio transmitters listed in (a) and uses technologies designed to be capable of maintaining radio lines with the same frequency as that of the transmitters;

(vi)among underwater acoustic equipment utilizing acoustic waves (including ultrasound) or components thereof and that fall under any of the following:

(a)hydrophones that fall under any of the following:

1.hydrophones that incorporate flexible sensors;

2.hydrophones that incorporate devices consisting of flexible sensors less than 20 millimeters in diameter or length connected at intervals less than 20 millimeters;

3.hydrophones that have any of the following detecting elements:

i.optical fibers;

ii.piezoelectric polymer membrane (excluding vinylidene fluoride resin and copolymers thereof);

iii.flexible piezoelectric composite materials;

iv.piezoelectric single crystals of lead magnesium niobate-lead titanate (those growing from solid solution);

v.piezoelectric single crystals of lead indium niobate-lead magnesium niobate -lead titanate (those growing from solid solution);

4.hydrophones designed for the use at water depths exceeding 1,000 meters;

5.hydrophones that have the function of compensating for the effects of acceleration and designed for the use at water depths exceeding 35 meters;

(b)towed hydrophone arrays that fall under any of the following:

1.arrays in which the hydrophone group interval (referring to the distance between the centers of two adjacent hydrophone groups; hereinafter the same applies in the same item) is less than 12.5 meters or those wherein the interval can be altered to less than 12.5 meters;

2.arrays designed to be capable of use at water depths exceeding 35 meters or that can be so modified;

3.arrays having a heading sensor that falls under Article 9, item (i), (b), 3.;

4.arrays having array hoses reinforced in the long axis direction;

5.arrays with diameter less than 40 millimeters;

6.deleted;

7.arrays that have hydrophones that fall under (a) or Article 9, item (i), (b), 1.;

8.hydroacoustic sensors in Article 9, item (i), (b), 6.;

(c)among signal processors designed for towed hydrophone arrays and capable of being reprogrammed by the user, those which are capable of real-time processing of process or correlation of the time domain or the frequency domain (including spectral analysis, digital filtering or beam formation);

(d)hydrophone arrays for ocean bottom or harbor/bay cable that fall under any of the following:

1.cable systems that incorporate hydrophones that fall under (a) or Article 9, item (i), (b), 1.;

2.cable systems that can process by multiplexing hydrophone group signals and that fall under the following i. and ii.:

i.cable systems designed to be capable of use at water depths exceeding 35 meters or those having a depth sounding device that can be adjusted or removed to be used at water depths exceeding 35 meters to make the array capable of use at water depth exceeding 35 meters;

ii.cable systems that can be converted into a towed hydrophone array;

(e)among signal processors reprogrammable by the user and designed for the use in ocean bottom or a harbor/ bay cable system, which are capable of real-time processing of process or correlation of the time domain or the frequency domain (include spectrum analysis, digital filtering or beam formation);

(f)among underwater acoustic equipment having transmission functions and an operating frequency range of 30 hertz or more and 2 kilohertz or less, those with the sound pressure levels exceeding 210 decibels;

(vii)solid optical detectors designed for space applications with the maximum sensitivity within the range exceeding 1,200 nanometers to 30,000 nanometers or less;

(viii)pulse radar cross-section area measuring devices with pulse duration transmitted of 100 nanoseconds or less, or components thereof;

(ix)untethered submersible vessels that fall under any of the following:

(a)manned submersible vessels that fall under any of the following:

1.submersible vessels designed to be capable of independent submerged travel submerged and that possess a load lifting capability of the following i. and ii.:

i.10% or more of the weight-in-air of the submersible vessel;

ii.15 kilonewtons or more;

2.submersible vessels designed for the use at water depths exceeding 1,000 meters;

3.submersible vessels that fall under the following i. and ii.:

i.submersible vessels designed to be capable of independent submerged travel continuously for 10 hours or more;

ii.submersible vessels capable of traveling submerged for a distance of 50 nautical miles or more;

(b)unmanned submersible vessels that fall under any of the following:

1.unmanned submersible vessels designed to automatically determine their own course over all types of seafloor terrain;

2.unmanned submersible vessels capable of transmitting and receiving date or command by acoustic waves;

3.unmanned submersible vessels capable of transmitting and receiving data or commands at a distance exceeding 1,000 meters by optical transmission;

(x)sound proofing devices or magnetic bearings capable of being used for vessels whose displacement is 1,000 tons or more, and that are designed for use in transmission gears;

(xi)ramjet engines, scramjet engines, combined cycle engines, or components thereof.

(Foreign Exchange Order, pertaining to the Appended Table)

Article 15(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 2 (i) of the appended table of the Foreign Exchange Order (hereinafter referred to as "Foreign Exchange Order") falls under any of the following:

(i)the technology pertaining to the design, manufacture or use of goods that fall under any of Article 1, item (i) through item (v), item (vi) (limited to the devices of mold processing of nuclear fuels), item (vii), item (viii), (a), item (x), (a), item (x)-2, or item (x)-3;

(ii)among programs designed for the use of goods that fall under any of Article 1, item (viii), (b), item (xi), item (xvii), item (xviii), (b) or (c), item (xix), item (xx), item (xxi), (a) or (b), 1. or 3. or item (xxxv) or item (xxxvi), or technologies (excluding programs) pertaining to the design, manufacture, or use of such programs, those necessary to attain or exceed the functions or characteristics of the goods;

(iii)among programs designed for the design, manufacture or use of goods that fall under Article 1, item (xiv), or technologies (excluding programs) pertaining to the design, manufacture, or use of those programs, the technology necessary to attain or exceed the functions or characteristic of those goods (excluding programs to produce part programs generating numerical-control codes which cannot directly use equipment to process types of components);

(iv)among technologies (excluding programs) pertaining to the design, manufacture, or use of goods that fall under any of Article 1, item (viii), (b), item (ix), item (x), (b), item (xi), item (xiv), from item (xvii) through item (xxiv), from item (xxvi) through (xxviii), from item (xxx) through item (l), item (lii), from item (liv) through item (lviii), or item (lx) through item (lxii), the technology necessary to attain or exceed the functions or characteristics of those goods;

(v)the technology (excluding programs) pertaining to the design, manufacture or use of goods that fall under any of Article 1, item (vi) (limited to the device for separation lithium isotopes), item (xxv), item (xxix), item (liii) or item (lix);

(vi)programs, or cryptographic keys or cryptographic codes designed to extend performance characteristics, or deactivate functions, of frequency changers (excluding those fall under Article 1, item (viii), (b)), so that the frequency changers will fall under Article 1, item (viii), (b);

(vii)programs designed to extend or release performance characteristics of frequency changers that fall under Article 1, item (viii), (b);

(viii)programs, or cryptographic keys or cryptographic codes designed to extend performance characteristics, or deactivate functions, of high speed cameras or components thereof (excluding those fall under Article 1, item (xliv)), so that the high speed cameras or components thereof will fall under Article 1, item (xliv);

(ix)programs, or cryptographic keys or cryptographic codes designed to extend performance characteristics, or deactivate functions, of high speed cameras or components thereof (limited to those fall under Article 1, item (xliv)).

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 2 (ii) of the appended table of the Foreign Exchange Order is, among those pertaining to programs that enable a device to function as numerically-controlled coordinate measuring equipment for machine tools with 5 or more axes capable of contour control or the technology (excluding programs) for design, manufacture or use of those programs, technology necessary for enabling the numerical-control of 5 or more axes capable of contour control.

Article 15-2The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 3 (ii) of the appended table of the Foreign Exchange Order is, among those pertaining to the design, manufacture, or use of goods that fall under Article 2, item (ii), technology necessary to attain or exceed the functions or characteristics of the goods.

Article 15-3The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 3-2 (ii) of the appended table of the Foreign Exchange Order is, among those pertaining to the design, manufacture or use of goods that fall under Article 2-2, paragraph (2), technology necessary to attain or exceed the functions or characteristics of the goods.

Article 16(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 4 (i) of the appended table of the Foreign Exchange Order is, among those pertaining to the design, manufacture, or use of goods that fall under Article 3, technology that falls under any of the following and is necessary to attain or exceed the functions or characteristics of the goods:

(i)programs designed for the use of rockets capable of transporting a payload of 500 kilograms or more over a distance of 300 kilometers or more or equipment or tools (including molds; hereinafter the same applies in this Article) for manufacturing goods that fall under Article 3, item (ii), (b) or test equipment therefor, or the components thereof, or goods that fall under any of (a), 2. or 3. or (b), 4. through 6. of the same item, or technology (excluding programs) pertaining to the use, manufacturing or design of those programs;

(ii)programs designed for the use of rockets capable of carrying a payload of 500 kilograms or more a distance of 300 kilometers or more, and which can adjust the functions of two or more goods (limited to those that fall under Article 3, item (ii), (a), or (b)) or the technology (excluding programs) pertaining to the design, manufacture or use thereof;

(iii)programs designed for the design, manufacture or use of equipment or tools for manufacturing the goods that fall under Article 3, item (ii), (a), the test equipment therefor or the components thereof, or technology (excluding programs) pertaining to the design, manufacture or use of those programs;

(iv)the technology (excluding programs) pertaining to the design, manufacture or use of rockets capable of carrying a payload of 500 kilograms or more for over 300 kilometers, or manufacturing devices or tools, test equipment, or components therefor or goods that fall under Article 3, item (ii);

(v)programs designed for the use of equipment for manufacturing goods that fall under any of Article 3, item (iii), (a) through (i) or tools or test equipment therefor or components thereof or goods that fall under any of (a), (b), (g) or (h) of the same item, or item (iv) through item (vi), item (xvii) through item (xix), item (xxi), (a), item (xxii) or item (xxv) or technology (excluding programs) pertaining to the design, manufacture or use of those programs;

(v)-2programs designed for the operation, maintenance, or inspection of goods that fall under Article 3, item (xi), or technologies (excluding programs) pertaining to the design, manufacture, or use of such programs;

(vi)the technology (excluding programs) pertaining to the design, manufacture or use of rockets or unmanned aircraft that are capable of carrying a payload over a distance of 300 kilometers or more (excluding those capable of carrying a payload of 500 kilograms or more) or the goods that fall under any of Article 3, items (iii) through (vi) or items (vii) through (xxvii);

(vii)the technology (excluding programs) pertaining to programs designed for the design of the goods that fall under Article 3, item (iii), (b), (c), (e) or (f), or item (iv), or the design, manufacture, or use of those programs;

(viii)programs designed for the operation, maintenance, or inspection of goods that fall under any of Article 3, item (viii) through item (x)-2;

(ix)programs designed for the design, manufacture, or use of goods that fall under any of Article 3, item (xiii) through item (xv) or item (xxvi) or technology (excluding programs) pertaining to the design, manufacture, or use of those programs;

(x)programs designed for the design or manufacture of goods that fall under Article 3, item (xvii), (a) or (f) or item (xvii)-2 or technology (excluding programs) pertaining to the design, manufacture, or use of those programs;

(xi)programs designed for the design of rockets capable of carrying a payload over a distance of 300 kilometers or more, or goods that fall under Article 3, item (ii), (a) or goods that fall under (b) of the same item, or technology (excluding programs) for the design, manufacture, or use of those programs;

(xii)programs that are designed for the use of rockets capable of carrying a payload over a distance of 300 kilometers and are capable of adjusting the functions of 2 or more goods (limited to those that fall under Article 3, item (ii), (a))(excluding those that fall under item (ii)).

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 4 (ii) of the appended table of the Foreign Exchange Order, is technology (excluding programs) pertaining to the design of rocket avionics equipment or components thereof and used for preventing the impact of electromagnetic pulses or electromagnetic interference.

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 4 (iii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) that integrates data pertaining to flight control, guidance or propulsion into the flight control device, in order to optimize the flight path of rockets capable of carrying a payload over a distance of 300 kilometers or more;

(ii)programs that enable the determination of the position of an airframe over its entire route during flight by processing the data recorded during flight (limited to programs that can be used for rockets or unmanned aerial vehicles that are capable of carrying a payload for over 300 kilometers) or technology (excluding programs) pertaining to the design, manufacture, or use of those programs.

(4)The technology specified by the Order of Ministry of Economy, Trade and Industry in row 4 (iv) of the appended table of the Foreign Exchange Order is technology pertaining to the use of autoclaves, and the data or procedures to provide for the environment inside the autoclaves (limited to those that use goods that fall under Article 3, item (xvi)).

(5)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 4 (v) of the appended table of the Foreign Exchange Order is technology used to fix onto substrates substances formed by thermal decomposition of raw gas (limited to execution within the temperature range from 1,300 degrees centigrade to 2,900 degrees centigrade inclusive and the range of absolute pressure from 130 pascals to 20,000 pascals inclusive).

Article 17(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs designed for the design or manufacture of items that fall under any of Article 4, item (iv) through item (vi);

(ii)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 4, item (ii), item (xii), (c), 1. or (d) or item (xv), (c) or (d);

(iii)the technology (excluding programs) necessary for the design or manufacture of items that fall under any of Article 4, item (i), (b) or (c) or item (iii) through item (xvi) (excluding those falling under the preceding item).

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (ii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs designed to use an item that falls under any of Article 4, item (iv) through item (vi);

(ii)the technology (excluding programs) pertaining to the use of an item that falls under Article 4, item (ii) or item (xii), (c), 1. or (d) or Article 14, item (i) (limited to those pertaining to repairs).

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (iii) of the appended of the Foreign Exchange Order table is technology (excluding programs) pertaining to the design or manufacture of ceramic materials or ceramics (excluding composites) that fall under any of the following:

(i)ceramic materials that fall under all of the following (a) through (c):

(a)ceramic materials consisting of any of the following:

1.single or composite oxides of zirconium and silicon or aluminum composite oxides;

2.single nitrides of boron (limited to cubic crystalline boron);

3.single or composite carbides of silicon or boron;

4.single or composite nitrides of silicon;

(b)items in which the ratio of the content of metal impurities as a part of the total weight is less than following numeric values:

1.0.1% with respect to single oxides or single carbides;

2.0.5% with respect to composite compounds or single nitrides;

(c)ceramic materials that fall under any of the following:

1.among zirconium oxides, having particles the diameter of which is 1 micrometer or less, and wherein the total weight of particles exceeding 5 micrometers in diameter is 10% or less of total weight;

2.those having particles the average diameter of which is 5 micrometers or less and wherein the total particle weight of particles exceeding 10 micrometers in diameter is 10% or less of total weight (excluding those that fall under 1.);

3.platelets having ratio of length to thickness exceeding 5 and ratio of length to diameter exceeding 10, and having whiskers the diameter of which is less than 2 micrometers and fibers the diameter of which is less than 10 micrometers;

(ii)ceramic made of substances in the preceding item (excluding grinding materials).

(4)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (iv) of the appended table of the Foreign Exchange Order is technology (excluding programs) pertaining to the design or manufacture of polybenzothiazole or polybenzoxazole.

(5)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (v) of the appended table of the Foreign Exchange Order is technology (excluding programs) pertaining to the design or manufacture of rubber-like fluorine compounds including vinyl ether monomers.

(6)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (vi) of the appended table of the Foreign Exchange Order is technology (excluding programs) pertaining to the manufacture of aromatic polyamide fiber.

(7)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (vii) of the appended table of the Foreign Exchange Order is program for the design of composite materials using organic matter, metals or carbon as a matrix.

(8)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 5 (viii) of the appended table of the Foreign Exchange Order is technology (excluding programs) pertaining to the use of radio wave absorbers or conductive polymers that fall under Article 14, item (ii) (limited to those pertaining to installation, maintenance or repair).

Article 18(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 6 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 5, item (ii), (b), 3. or (d), item (iii), item (v) or any of the following:

(a)among machine tools with 2 or more axes capable of controlling contours, those capable of lathe turning, and in which the precision of positioning of the rectilinear axes is 0.003 millimeters or less in terms of any one or more of the axes when measured by the measurement method specified by International Standard ISO 230-2:2006;

(b)machine tools capable of milling that fall under any of the following:

1.machine tools with 3 rectilinear axes capable of controlling contour, and with 1 axis capable of controlling contour, and in which the precision of positioning of the rectilinear axes is 0.003 millimeters or less in terms of any one or more of the axes when measured by the measurement method specified by International Standard ISO 230-2:2006;

2.machine tools falling under any of the Article 5, item (ii), (b), 2. i. through iii. in which the precision of positioning of the rectilinear axes is 0.003 millimeters or less when measured by the measurement method specified by International Standard ISO 230-2:2006;

(ii)beyond what is listed in the preceding item, the technology (excluding programs) necessary for the design or manufacture of the goods that fall under Article 5;

(iii)programs designed for the design or manufacture of items that fall under item (i), (a) or (b), Article 5, item (ii), (b), 3. or (d), item (iii) or item (v), or the technology (excluding programs) necessary for the design of those programs;

(iv)beyond what is listed in the preceding item, programs designed for the design or manufacture of goods that fall under Article 5, or the technology (excluding programs) necessary for the design of those programs.

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 6 (ii) of the appended table of the Foreign Exchange Order is those which fall under any of the following:

(i)programs designed for the use of those which fall under any of Article 5, item (i), (c), item (ii), item (iii), or item (v) through item (xi);

(ii)programs designed or modified to operate those which fall under Article 5, item (iv) which, in order to process workpieces into any shapes, convert optical design, sizes of workpieces, and material removal functions to numerical controlling commands;

(iii)technology (excluding programs) required for design of programs listed in the preceding two items.

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 6 (iii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs that enable a device to function as numerically-controlled coordinate measuring equipment with 5 or more axes capable of controlling contour or the technology (excluding programs) necessary for the design of those programs;

(ii)the technology (excluding programs) pertaining to the design of interactive computer graphics to prepare or modify the part programs in numerically-controlled coordinate measuring equipment;

(iii)the technology (excluding programs) pertaining to the design of the programs that convert design data given to numerically-controlled coordinate measuring equipment into commands for machine tools;

(iv)the technology (excluding programs) pertaining to the design of programs that integrate into the numerically-controlled coordinate measuring equipment an expert system that supports decision-making;

(v)the technology (excluding programs) for non-electronic substrates pertaining to the coating method listed in column 2 of the appended table 3 and the coatings listed in column 4 of the same table and executed in respect to substrates listed in column 3 in the same table.

(4)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 6 (iv) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) pertaining to the design of tools (including molds) for processing metals by super-plastic molding, diffusion bonding or direct pressure hydraulic press;

(ii)data for processing metals that falls under any of the following:

(a)data pertaining to processing by super-plastic molding of aluminum alloys, titanium alloys or super alloys, and to the surface treatment, deformation rate, temperature or pressure of processed materials;

(b)data pertaining to processing by diffusion bonding of super alloys or titanium alloys, and to the surface treatment, deformation rate, temperature or pressure of processed materials;

(c)data pertaining to processing of aluminum alloys or titanium alloys by direct pressure hydraulic press and to the pressure or cycle times thereof;

(d)data pertaining to reduction of the porosity inside cast product of titanium alloy, aluminum alloy or super alloy by applying the same pressure from all directions at a temperature exceeding 102 degrees centigrade and pertaining to the temperature, pressure or cycle time thereof.

(5)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 6 (v) of the appended table is technology (excluding programs) pertaining to the design or manufacture of hydraulic stretch molding devices (including the mold thereof) for manufacture of aircraft materials.

(6)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 6 (vi) of the appended table of the Foreign Exchange Order is technology (excluding programs) pertaining to auxiliaries for numerically-controlled coordinate measuring equipment that converts the design data given to the numerically-controlled equipment into the commands for the machine tools.

Article 19(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 7 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 6, item (xvi), (b);

(ii)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 6 (excluding those falling under item (xvi), (b) of the same Article), and do not fall under any of the following:

(a)the technology necessary for manufacturing items that fall under item (xvi)-2 of the same Article;

(b)among technologies that fall under any of item (i), (c) through (l) of the same Article, the technology necessary for the design or manufacture of integrated circuits that fall under the following 1. and 2.:

1.integrated circuits whose minimum line width which is 0.130 micrometers or more;

2.integrated circuits that possess a multilayered structure (limited to those in which the number of metal layers is three or less);

(iii)programs designed for the design or manufacture of circuits that fall under Article 6, item (xvi), (b);

(iv)programs designed for the design of integrated circuits that fall under Article 6, item (xvi)-2;

(v)programs designed for the design or manufacture of integrated circuits that fall under Article 6 (excluding those that fall under any of the preceding two items or item (i) or items (xviii) through (xxii) of the same Article).

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 7 (ii) of the appended table of the Foreign Exchange Order is programs designed for the use of items that fall under any of Article 6, item (xvii), (a) through (f) or (j).

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 7 (iii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)physical simulation programs for establishing the conditions of the lithography process, etching process or film forming process to transfer mask patterns to conductors, insulators or semiconductors;

(ii)the technology (excluding programs) pertaining to the design or manufacture of substrates of integrated circuits whose insulators are made of silicon dioxide and that have silicon-on-insulator structure;

(iii)the technology (excluding programs) necessary for the design or manufacture of, among the core of the microprocessors, microcomputers, or microcontrollers, wherein the bit count of the access width of logic-operations is 32 or more, those falling under any of the following (excluding programs and the technology necessary for the design or manufacture of the core of the microprocessors, microcomputers, or microcontrollers with a minimum line width of 0.13 micrometers or more and multi-layer structures with five or less metal layers):

(a)vector processor unit designed to simultaneously perform more than two calculations on floating-point vectors;

(b)those designed to perform more than four 64 bit or larger floating-point operation results per cycle;

(c)those designed to perform more than four 16 bit fixed-point multiply-accumulate results per cycle.

(4)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 7 (iv) of the appended table of the Foreign Exchange Order is technology (excluding programs) pertaining to the design or manufacture of electronic elements using superconductive materials.

(5)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 7 (v) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)physical simulation programs for establishing the conditions of the lithography processes, etching process or film forming process to transfer mask patterns to conductors, insulators and semiconductors;

(ii)the technology (excluding programs) pertaining to the design or manufacture of vacuum microelectronics devices;

(iii)the technology (excluding programs) pertaining to the design or manufacture of hetero-junction microchips (excluding high electron mobility transistors or hetero-junction bipolar transistors whose operating frequency is less than 31.8 gigahertz);

(iv)the technology (excluding programs) pertaining to the design or manufacture of substrates used as components of electronic devices that use thin films made of diamond or silicon carbide;

(v)the technology (excluding programs) pertaining to the design or manufacture of electron tubes whose operating frequency is 31.8 gigahertz or more.

Article 20(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 8 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items falling under Article 7, item (i), (b) or item (iii), (c) of the same Article;

(ii)beyond what is listed in the preceding item, technology (excluding programs) necessary for the design or manufacture of goods that fall under the items of Article 7;

(iii)programs designed for the design or manufacture of items falling under Article 7, item (i), (b) or item (iii), (c) of the same Article or technology (excluding programs) necessary for the design or manufacture of those programs;

(iv)the technology (excluding programs) necessary for the use of the programs in the preceding item;

(v)beyond what is listed in item (iii), programs designed for the design or manufacture of goods that fall under the items of Article 7, or technology (excluding programs) necessary for the design, manufacture, or use of those programs;

(vi)the technology (excluding programs) necessary for the use of items falling under Article 7;

(vii)deleted;

(viii)programs designed to support technology (excluding programs) that falls under any of items (i) through (vi).

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 8 (ii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items that fall under any of the following:

(a)digital computers whose Adjusted Peak Performance exceeds 0.6 Weighted TeraFLOPS and is 1.0 Weighted TeraFLOPS or less;

(b)digital computers whose Adjusted Peak Performance exceeds 1.0 Weighted TeraFLOPS and is 8.0 Weighted TeraFLOPS or less;

(ii)the technology (excluding programs) necessary for the design or manufacture of components designed to improve the functions digital computers, which components, by aggregating calculation elements achieve Adjusted Peak Performance that exceeds 0.6 Weighted TeraFLOPS and is 8.0 Weighted TeraFLOPS or less;

(iii)the technology (excluding programs) necessary for programs designed for the design or manufacture of items that fall under any of the following or the design or manufacture of those programs:

(a)digital computers whose Adjusted Peak Performance exceeds 0.6 Weighted TeraFLOPS and is 1.0 Weighted TeraFLOPS or less;

(b)digital computers whose Adjusted Peak Performance exceeds 1.0 Weighted TeraFLOPS and is 8.0 Weighted TeraFLOPS or less;

(iv)the technology (excluding programs) necessary for the use of the programs in the preceding item;

(v)programs designed for the design or manufacture of components designed to improve the functions of digital computers which components, by aggregating calculation elements, achieve Adjusted Peak Performance that exceeds 0.6 Weighted TeraFLOPS and is 8.0 Weighted TeraFLOPS or less or the technology (excluding programs) necessary for the design, manufacture or use of those programs;

(vi)programs designed or modified to manufacture, operate, or distribute intrusion programs, or communicate with such programs, or the technology (excluding programs) necessary for the design, manufacture, or use of such programs;

(vii)the technology (excluding programs) necessary for the design of intrusion programs;

(viii)programs designed to support technologies (excluding programs) that fall under item (i) through the preceding item.

Article 21(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 9 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 8, item (ii), (a), 2.;

(ii)the technology (excluding programs) necessary for the design or manufacture of items that fall under any of Article 8, item (i), item (ii), items (iv) through (v)-5, or items (ix) through (xiii) (excluding those falling under the preceding item);

(iii)the technology (excluding programs) necessary for the use of items that fall under any of Article 8, items (ix) through (xiii);

(iv)the technology (excluding programs) necessary for the use (excluding those pertaining to operations) of items that fall under any of Article 8, item (i), item (ii), items (iv) through (v)-5;

(v)programs designed for the design or manufacture of items that fall under Article 8, item (ii), (a), 2.;

(vi)programs designed for the design or manufacture of items that fall under (excluding those falling under the preceding item) any of Article 8, item (i), item (ii), items (iv) through (v)-5;

(vii)programs designed for the design or manufacture of items that fall under Article 8, items (ix) through (xii) or under item (ix) or (x) of paragraph (1) of this Article;

(viii)programs designed for the use of items that fall under any of Article 8, item (i), item (ii), or items (iv) through (v)-5;

(viii)-2programs designed for the use of items that fall under any of Article 8, items (ix) through (xii) or under item (ix) or item (x) of paragraph (1) of this Article;

(ix)programs having the functions equivalent to those of goods that fall under any of Article 8, item (ix), or items (x) through (xii), programs to realize such functions or programs that are capable of simulating the functions;

(x)programs used for verification of items that fall under the preceding item;

(xi)the technology (excluding programs) necessary for the design or manufacture of the programs in item (v);

(xi)-2the technology (excluding programs) necessary for the use of the program in item (v) (excluding those pertaining to operations);

(xii)the technology (excluding programs) necessary for the design or manufacture of the programs in item (vii), item (viii)-2, item (ix) or item (x);

(xii)-2the technology (excluding programs) necessary for the use of programs in item (vii), item (viii)-2, item (ix) or item (x);

(xiii)the technology (excluding programs) necessary for the design, manufacture or use (excluding those that pertains to operations) of the programs in item (vi) or item (viii);

(xiv)programs designed to support the technology in item (i) or item (xi);

(xv)programs designed to support the technology from item (ii) through item (iv) or item (xi)-2 through item (xiii);

(xvi)technology (excluding programs) to enable goods or programs to attain or exceed the functions of the goods that fall under any of Article 8, item (ix), or items (x) through (xii), only through the use of such technology;

(xvii)programs designed or modified to enable goods or programs to attain or exceed the functions of the goods that fall under any of Article 8, item (ix), or items (x) through (xii), only through the use of such program.

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 9 (ii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)deleted;

(ii)programs designed to provide the functions equivalent to those of goods that fall under any of Article 8, item (i), item (ii), item (iv) through item (vii) or item (viii)-2;

(iii)deleted;

(iii)-2programs for the design of transmission communication devices or electronic interchanging devices that fall under (a); (b), 1. or 5.; (c) or (d), 1., or the technology (excluding programs) necessary for the design or manufacture of those falling under any of the following:

(a)those that use a digital transmission scheme and are designed to be capable of using at total transmission rate that exceeds 120 gigabits per second;

(b)those that use laser oscillators and that fall under any of the following:

1.those that utilize laser beams whose wave length exceeds 1,750 nanometers;

2.those that have the function of amplifying laser beams and that use optical fibers employing praseodymium-doped fluorides;

3.those that use a coherent transmission method;

4.those that use light wavelength multiplex technology and wherein the spacing of optical carrier waves is less than 100 gigahertz;

5.those that use an analog transmission method whose bandwidth exceeds 2.5 gigahertz (excluding devices for TV broadcasting (including cable TV broadcasting));

(c)those having an optical switching function and an optical signal switching time of less than 1 millisecond;

(d)wireless transmitters or wireless receivers that fall under any of the following:

1.wireless transmitters or wireless receivers that use quadrature amplitude modulation technology that exceeds the value of 256;

2.wireless transmitters or wireless receivers that can be used at frequencies that exceed 31.8 gigahertz (excluding frequency bands allocated for wireless communication by the International Telecommunication Union (excluding the frequency bands allocated for radio determinations));

3.among wireless transmitters or wireless receivers that can be used within a frequency range of 1.5 megahertz or more and 87.5 megahertz or less and are incorporating adaptive techniques for the suppression of an interfering signal, those designed to suppress an interfering signal by decibels exceeding 15;

(e)deleted;

(f)those exclusively designed for use in mobile bodies, which fall under the following 1. and 2.:

1.those that can be used at an optical wavelength of 200 nanometers or more and 400 nanometers or less;

2.those used in local area networks;

(iv)deleted;

(v)the technology (excluding programs) necessary for the design or manufacture of transmission communication devices designed to be mounted on satellites;

(vi)technology (excluding programs) pertaining to the design or use of communication technology that uses lasers and receives or tracks signals automatically and is also capable of communicating outside the atmosphere or under water;

(vii)deleted;

(viii)deleted;

(ix)deleted;

(x)deleted;

(xi)the technology (excluding programs) pertaining to the design of the wireless base station receiver used for digital cellular wireless communication and signal reception functions of which is capable of modifying in order to enable multiband, multiple channels, multimode, multi-coding algorithms or multiprotocol operation by switching programs;

(xii)deleted;

(xiii)deleted;

(xiv)the technology (excluding programs) pertaining to the design of transmission communication devices and to the design of spread spectrum (including frequency hopping);

(xv)programs designed to support technology (excluding programs) that falls under any of item (iii)-2, item (v), item (vi), item (xi) or the preceding item.

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 9 (iii) of the appended table of the Foreign Exchange Order is the technology (excluding programs) necessary for the design or manufacture of microwave monolithic integrated circuit power amplifiers designed for telecommunications that fall under any of the following:

(i)among microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 2.7 gigahertz and 6.8 gigahertz or less for which the value of the instantaneous bandwidth divided by the center frequency exceeds 15%, those which fall under any of the following:

(a)those with an operating frequency exceeding 2.7 gigahertz and 2.9 gigahertz or less with a peak saturation output value exceeding 75 watts (48.75 dBm);

(b)those with an operating frequency exceeding 2.9 gigahertz and 3.2 gigahertz or less with a peak saturation output value exceeding 55 watts (47.4 dBm);

(c)those with an operating frequency exceeding 3.2 gigahertz and 3.7 gigahertz or less with a peak saturation output value exceeding 40 watts (46 dBm);

(d)those with an operating frequency exceeding 3.7 gigahertz and 6.8 gigahertz or less with a peak saturation output value exceeding 20 watts (43 dBm);

(ii)among microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 6.8 gigahertz and 16 gigahertz or less for which the value of the instantaneous bandwidth divided by the center frequency exceeds 10%, those which fall under any of the following:

(a)those with an operating frequency exceeding 6.8 gigahertz and 8.5 gigahertz or less with a peak saturation output value exceeding 10 watts (40 dBm);

(b)those with an operating frequency exceeding 8.5 gigahertz and 16 gigahertz or less with a peak saturation output value exceeding 5 watts (37 dBm);

(iii)among microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 16 gigahertz and 31.8 gigahertz or less with a peak saturation output value exceeding 3.0 watts (34.77 dBm), those for which the value obtained by dividing the instantaneous bandwidth by the center frequency exceeds 10%;

(iv)microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 31.8 gigahertz and 37 gigahertz or less with a peak saturation output value exceeding 0.1 nanowatts (-70 dBm);

(v)among microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 37 gigahertz and 43.5 gigahertz or less with a peak saturation output value exceeding 1.0 watt (30 dBm), those for which the value obtained by dividing the instantaneous bandwidth by the center frequency exceeds 10%;

(vi)microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 43.5 gigahertz and 75 gigahertz or less with a peak saturation output value exceeding 31.62 milliwatts (15 dBm), those for which the value obtained by dividing the instantaneous bandwidth by the center frequency exceeds 10%;

(vii)microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 75 gigahertz and 90 gigahertz or less with a peak saturation output value exceeding 10 milliwatts (10 dBm), those for which the value obtained by dividing the instantaneous bandwidth by the center frequency exceeds 5%;

(viii)microwave monolithic integrated circuit power amplifiers with an operating frequency exceeding 90 gigahertz with a peak saturation output value exceeding 0.1 nanowatts (-70 dBm).

(4)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 9 (iv) of the appended table of the Foreign Exchange Order is the technology (excluding programs) necessary for the design or manufacture of telecommunications equipment using superconductive materials that is designed to be capable of being used at temperatures below the critical temperature of the superconductive material used, and that falls under any of the following:

(i)those having current switching for digital circuits using superconductive gates with a value obtained by multiplying the delay time per gate by the power dissipation per gate being less than 100,000,000,000 millijoules;

(ii)those having a frequency separation function and resonant circuits with Q-values exceeding 10,000.

Article 22(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 10 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design of items that fall under Article 9;

(ii)the technology (excluding programs) necessary for the manufacture of items that fall under Article 9, item (i), (a), 2. or 6. or (b), 3., item (iii), (a), (b) or (e), item (iv), item (v), (a), item (viii), (a), 1., i. or 2., i. or 3., item (ix), (c) or (d), item (xi), (a), (b), (l) or (m), item (xi)-2, (a), or item (xiii), (d), (h) or (k);

(iii)the technology (excluding programs) necessary for manufacture of items that fall under Article 9 (excluding those falling under the preceding item);

(iv)programs designed for the design or manufacture of items that fall under Article 9, item (ix), (c) or (d) or item (xiii), (d), (h) or (k) or technology (excluding programs) necessary for the design of those programs;

(v)programs designed for the design or manufacture of items that fall under Article 9, item (ix) through item (x)-2 or item (xiii) (excluding those falling under the preceding item);

(vi)the technology (excluding programs) necessary for the design of the programs of the preceding item;

(vii)programs designed or modified for cameras incorporating focal plane arrays falling under Article 9, item (iii), (d), 1. ii. or (e), 2., and designed or modified to remove the frame rate restriction of the camera and allow the camera to have its maximum frame rate exceed 9 hertz.

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 10 (ii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs designed for the use of items that fall under Article 9, item (iv) or Article 13 or Article 14, item (viii);

(ii)the technology (excluding programs) necessary for the design of the programs in the preceding item;

(iii)programs that fall under any of the following:

(a)programs for magnetometer, underwater electric field sensor or magnetic field gradiometer calibrating equipment and designed to be mounted on vehicles, vessels, aircraft or satellites or other spacecraft for space development;

(b)programs designed to detect abnormalities in the magnetic or underwater electric field on vehicles, vessels, aircraft, satellites or other spacecraft for space development;

(c)programs designed to compensate for the impact of movement on gravimeters or gravity gradiometer;

(d)programs used for air traffic control that are capable of accepting target data from five or more primary radars;

(e)programs or source code designed to achieve real time processing of data pertaining to magnetic or electric fields by utilizing those falling under Article 9, item (xi)-2;

(iv)the technology (excluding programs) necessary for the design of the programs in the preceding item.

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 10 (iii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)technology (excluding programs) necessary for the manufacture, among optical coatings, the diameter or long axis length of which is 500 millimeters or more and the loss due to absorption and scatter of which is less than 0.005, those having a uniformity of the optical coating thickness of 99.5% or more;

(ii)technology (excluding programs) pertaining to lathe turning using single point diamond tools and for finishing such that the root-mean-square of surface precision for curved surface areas exceeding 0.5 square meters is less than 10 nanometers.

(4)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 10 (iv) of the appended table Foreign Exchange Order is technology (excluding programs) necessary for the design, manufacture or use of test equipment for extra high output laser oscillators.

(5)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 10 (vi) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs for manufacturing radomes that fall under following (a) and (b):

(a)radomes designed to protect phased array antennas that are capable of scanning electronically;

(b)radomes that produce antenna patterns with the output ratio of main beam peak value to average side lobes exceeding 40 decibels;

(ii)the technology (excluding programs) necessary for the design of the programs of the preceding item.

(6)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 10 (vii) of the appended table of the Foreign Exchange Order is technology necessary for the design, manufacture or use of devices to perform tests of the durability of substances against laser beams output by extra-high-output laser oscillators or the targets used for the test.

Article 23(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 11 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 10;

(ii)programs designed for the design or manufacture of items that fall under Article 10;

(iii)the technology (excluding programs) necessary for the design of the programs in the preceding item.

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 11 (ii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs for using (limited to those pertaining to operation or maintenance (inspection)) an attitude direction reference system (excluding those using the gimbal method), inertial navigation systems, and other inertial systems (limited to those with source code) or technology (excluding programs) necessary for the design of those programs;

(ii)technology (excluding programs) necessary for the use of items that fall under any of Article 10, items (i) through (iv) (limited to those pertaining to repairs or overhauls);

(iii)the technology (excluding programs) pertaining to the design of the programs that fall under any of Article 27, paragraphs (3) through (5);

(iv)programs designed to decode ranging codes (excluding those for civil use) of global satellite navigation systems.

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 11 (iv) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)among programs for the design of items that fall under any of the following (limited to those with source code), those which use the technology (excluding programs) pertaining to the design of any of the items which fall under any of item (ii), (a) through (e) or item (iii), (a) through (d):

(a)digital air traffic controllers for controlling the entire air flight route;

(b)equipment to integrate propulsion control and flight control;

(c)operation equipment using fly-by-wire method or fly-by-light method;

(d)active flight controllers having a fault tolerance function or a self-reconfiguring function;

(e)air data equipment that uses the static data of airframe surface as a reference;

(f)three-dimensional displays;

(ii)the technology (excluding programs) pertaining to the design or manufacture of items that fall under any of the following:

(a)air data equipment that uses static data on the airframe surface as a reference;

(b)three-dimensional display for aircraft;

(c)electric actuators designed for flight control;

(d)flight control optical sensor array designed for conducting active flight control;

(e)among data-based referenced navigation systems designed to be capable of being used in underwater navigation, those using a sonar or gravity database providing a positioning accuracy of 0.4 nautical miles or less;

(iii)the technology pertaining to the design of active flight controllers that falls under any of the following:

(a)the technology (excluding programs) pertaining to optical communication for detection of the operation status of aircraft airframes or flight controller system equipment, transmission of flight control data, or instruction to actuators on operation which is necessary for design of fly-by-light active flight controllers;

(b)real-time algorithm to analyze information obtained from sensors of components of active flight controllers for forecasting, and mitigating the degree of, performance deterioration and failures thereof;

(c)real-time algorithm to identify failures of equipment for mitigating the degree of performance deterioration and failures of active flight controllers, and reconfigure force and moment control;

(e)technology that integrates the data of digital flight control, navigation, and propulsion control into a digital flight traffic controller in order to control the entire flight route (excluding programs);

(e)CAD programs designed for an active flight controller that uses technology that falls under any of (a) through (d);

(f)technology (excluding programs) necessary for the design of the program in (e).

(iv)the technology (excluding programs) pertaining to devices for helicopters that falls under any of the following or a CAD programs designed for items that fall under (a) or (b):

(a)flight control devices for multi-spindle fly-by-wire systems or fly-by-light systems that integrate 2 or more functions among those which fall under the following:

1.collective control function;

2.cyclic control function;

3.yaw control function;

(b)devices that control counter torque or direction and by a means of a circulation control method;

(c)rotors that use blades of variable shape in order to control each aerofoil blade separately;

(v)the technology (excluding programs) necessary for the design of the programs of the preceding item.

Article 24(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 12 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology necessary for the design or manufacture of items that fall under Article 11, item (i), (b), item (iv), (b), item (vi), item (viii) or item (x), (f) or (g);

(ii)the technology necessary for the design or manufacture of items that fall under Article 11 (excluding those falling under the preceding item).

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 12 (ii) of the appended table of the Foreign Exchange Order is technology pertaining to programs designed for the use of the goods that fall under Article 11 or Article 14, item (ix) or item (x), or the use of goods (limited to those pertaining to repairs or overhauls) that fall under any of Article 11, item (i) through item (iii), or any of item (iv), (b) or (c), item (viii), item (ix), (e) through (i) or Article 10 or Article 14, item (ix) or item (x).

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 12 (iii) of the appended table of the Foreign Exchange Order is technology pertaining to the design or manufacture or use (limited to those pertaining to repairs or overhauls) of propellers designed for reducing underwater noise.

Article 25(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 13 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design of items that fall under any of Article 12, item (i), (b), and items (iv) through (xx);

(i)-2the technology (excluding programs) necessary for the manufacture of items that fall under any of Article 12, item (i), (b), items (iv) through (x), or items (xi) through (xx);

(ii)programs designed for the design or manufacture of items that fall under Article 12, item (xi), (b);

(iii)the technology (excluding programs) necessary for the design of the programs of the preceding item;

(iv)programs designed for the design or manufacture of items that fall under Article 12 (excluding those falling under item (ii));

(v)the technology (excluding programs) necessary for the design of the programs in the preceding item.

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 13 (ii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs using the technology (excluding programs) which falls under Article 25, paragraph (3), item (iii), and which are used in the equipment for full authority digital engine control of items that fall under Article 12;

(ii)the technology (excluding programs) necessary for the design of the programs in the preceding item;

(iii)programs that fall under any of the following:

(a)programs for two dimensional or three dimensional viscous flows verified by the data of wind tunnel tests or flight tests and that model the flow inside engines;

(b)programs for testing aerial vehicle gas turbine engines or components thereof, and designed to collect, process and analyze the data in real time and also execute feedback control during testing;

(c)programs designed to control unidirectional solidification or single crystal casting;

(d)deleted;

(e)programs designed to be used in the items falling under Article 12, item (x)-2 (limited to those pertaining to operation);

(f)programs designed to design the internal cooling passages of aero gas turbine blades, vanes or tip shrouds;

(g)programs falling under the following 1. and 2.:

1.programs designed to predict aero thermal, aeromechanical and combustion conditions in aero gas turbine engines;

2.programs with theoretical modeling predictions of the aero thermal, aeromechanical and combustion conditions, based on the actual aero gas turbine engine performance data;

(iv)the technology (excluding programs) necessary for the design of the programs in the preceding item.

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 13 (iii) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) pertaining to use of gas turbine engines or components thereof that fall under any of Article 12, item (i), (b), item (iv) through item (x) or item (xi) through item (xix) (limited to those pertaining to repairs or overhauls);

(ii)the technology (excluding programs) necessary for the design or manufacture of components of gas turbine engines that fall under any of the following or programs for the design thereof:

(a)combustors equipped with items that fall under any of the following:

1.heat shielding liners where the temperature at the combustor outlet exceeds 1,610 degrees centigrade;

2.non-metallic liners;

3.non-metallic shells;

4.liners equipped with cooling holes that fall under (k) where the temperature at the combustor outlet exceeds 1,610 degrees centigrade;

(b)components manufactured from metallic matrix composite materials, ceramic matrix, inter-metallic compounds or inter-metallic reinforcing materials that fall under Article 4, item (xii) or components manufactured from the composite materials that fall under item (xv) of the same Article using the resin that falls under item (xiii) of the same Article;

(c)non-cooling type blades, vanes, tip shrouds or other components that can be used in a gas path stagnation temperature (meaning the temperature at sea-level static take-off in a steady state mode; hereinafter the same applies in this item) at 1,050 degrees centigrade or more;

(d)cooling type blades, vanes, or tip shrouds designed to operate in a gas path temperature at 1,420 degrees centigrade or more (excluding those that fall under Article 27, paragraph (6), item (i));

(e)components that join a wing part and a disk part of turbine blade using a solid phase bonding method;

(f)components that use a diffusion bonding method that falls under Article 18, item (iv);

(g)rotation part components that are designed for damage tolerance and that use powdered metallurgical materials (limited to those that fall under Article 4, item (vii), (b));

(h)deleted;

(i)deleted;

(j)hollow fan blades without a support in the middle of a span thereof;

(k)the technology necessary for boring of cooling holes on components of gas turbine engines that use any technology (excluding programs) that falls under (d) of this item or Article 27, paragraph (6), item (i) which fall under any of the following:

1.among cooling holes with the minimum cross-section area of less than 0.45 square millimeters and with an aspect ratio exceeding 4.52, those for which the boring angle is 25 degrees or less;

2.among cooling holes with the minimum cross-section area of less than 0.12 square millimeters and with an aspect ratio exceeding 5.65, those for which the boring angle exceeds 25 degrees;

(iii)the technology (excluding programs) pertaining to the design or manufacture of components for a gas turbine engine that are equipment for full authority digital engine control of gas turbine engines, which falls under any of the following, or programs for the design thereof:

(a)the technology pertaining to the design of components for gas turbine engines, to furnish the components for gas turbine engines with the functions for regulating engine thrust or shaft power;

(b)the technology pertaining to the design or manufacture of components that control or diagnose engines which are used to regulate engine thrust or shaft power;

(c)the technology pertaining to the design of control law algorithms (including source codes) which are used to regulate engine thrust or shaft power;

(iv)the technology (excluding programs) pertaining to the design or manufacture of equipment to enable the adjustment of flow path shapes, which has been designed to maintain engine stability for gas generator turbines, fan turbines, power turbines or propelling nozzles:

(a)the technology pertaining to the design for the components maintaining engine stability to fulfill its function;

(b)the technology pertaining to the design or manufacture of components for equipment to enable adjustments of flow path shapes, which maintain engine stability;

(c)the technology pertaining to the design of control law algorithms (including source codes) for the equipment to enable adjustments of flow path shapes, which maintain the stability of engines.

(4)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 13 (iv) of the appended table of the Foreign Exchange Order falls under any of the following, or under programs for the design thereof:

(i)technology (excluding programs) necessary for the design or manufacture of, among wind tunnel models that use sensors that do not impede flow conditions, those capable of transmitting data from sensors to data collecting devices;

(ii)technology (excluding programs) necessary for the design or manufacture of propeller blades or prop fans that use composite materials and that are capable of absorbing loads that exceeds 2,000 kilowatts at speeds exceeding Mach 0.55;

(iii)technology (excluding programs) necessary for the design or manufacture of power transmission devices for aircraft that use helicopters or tilt rotors or tilt wings.

(5)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 13 (v) of the appended table of the Foreign Exchange Order falls under any of the following or the programs for the design thereof:

(i)the technology (excluding programs) pertaining to the design or manufacture of reciprocating diesel engines for vehicles that fall under all of the following (a) through (c):

(a)diesel engines with the engine volume of 1.2 cubic meters or less;

(b)diesel engines with a gross shaft power exceeding 750 kilowatts;

(c)diesel engines for which the gross brake power expressed in kilowatts divided by the engine volume expressed in cubic meters exceeds 700;

(ii)technology (excluding programs) necessary for the manufacture of the components of high-output diesel engines (this means diesel engines in which the rated rotational speed is 2,300 or more revolutions per minute (RPM) and in which the brake average effective pressure is 1.8 megapascals or more when the RPM is 2,300; hereinafter the same applies in this Article), which falls under any of the following:

(a)technology necessary for the manufacture of engines all components of which, from the following 1. through 3., are made of ceramics that fall under Article 4, item (xii) (excluding those all components of which, other than the components are made of materials other than the ceramics):

1.cylinder liners;

2.pistons;

3.cylinder heads;

(b)the technology necessary for the manufacture of turbochargers, the compressor of which falls under all of following 1. through 3.:

1.turbosuperchargers Compressors the pressure ratio per stage of which is 4 or more;

2.turbosuperchargers Compressors the flow volume per minute of which is 30 kilograms or more and 130 kilograms or less;

3.turbosuperchargers Compressors flow area of compressors of which or that of its turbine parts can be modified;

(c)technology necessary for the manufacture of, among fuel injection devices designed so as to use any of the fuels the dynamic viscosity of which at 37.8 degrees centigrade is 0.5 centistokes or more and 2.5 centistokes or less, those that fall under the following 1. and 2.:

1.fuel injection devices in which the injection amount exceeds 230 cubic millimeters per cylinder injection;

2.fuel injection devices that are controlled electronically so that adjuster characteristics can be automatically switched in order to obtain the same torque characteristics in response to fuel characteristics;

(iii)technology (excluding programs) necessary for the design or manufacture of high output diesel engines the wall surface temperature of which exceeds 450 degrees centigrade measured at the top dead center of the piston top ring and that use solid, gas phase or liquid lubricants on cylinder wall surfaces.

Article 26The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 14 of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 13;

(ii)programs designed for the design, manufacture or use of items that fall under Article 13 or technology (excluding programs) necessary for the design, manufacture or use of those programs;

(iii)programs especially designed to enable goods to perform the functions of the goods that fall under any of Article 13, paragraph (10), only through the use of such program.

Article 27(1)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 15 (i) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of items that fall under any of Article 14, item (i) through item (iii);

(ii)the technology (excluding programs) necessary for the design or manufacture of items that fall under Article 14, item (vi) or item (vii);

(iii)the technology necessary for the design or manufacture of items that fall under Article 14, item (v), item (v)-2, item (viii) or item (xi);

(iv)the technology necessary for the design or manufacture of items that fall under Article 14, item (ix) or item (x);

(v)the technology (excluding programs) necessary for the design of programs that fall under item (iii).

(2)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 15 (iii) of the appended table of the Foreign Exchange Order is programs that fall under any of the following or the technology necessary for the design of those programs:

(i)programs designed for carrying out acoustic beam molding for real time processing of sound data received by using towed hydrophone arrays;

(ii)source code for executing real time processing of sound data received by using towed hydrophone arrays;

(iii)programs designed for carrying out acoustic beam molding for real time processing of sound data received by using ocean bottom or harbor/port cable systems;

(iv)source code for executing real time processing of sound data received by using ocean bottom or harbor/ bay cable systems;

(v)programs (including source codes) falling under the following (a) or (b):

(a)those that carry out real time processing of sound data obtained from those falling under Article 9, item (i), (a), 6.;

(b)those that process data to automatically detect the position of the person active underwater.

(3)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 15 (iv) of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs designed so that these systems can fall under Article 10, item (iii) due to their using inertial navigation systems or other inertial systems;

(ii)programs that enable devices to fall under Article 10, item (iii) due to their using inertial navigation systems or other inertial systems and continuously integrating heading data and navigation data that falls under any of the following (limited to those with source code):

(a)speed data from radars that utilize Doppler effects;

(b)navigation data from GPS or Glonass;

(c)data from data-based referenced navigation systems.

(4)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 15 (v) of the appended table of the Foreign Exchange Order, is programs designed so that the devices can fall under Article 10, item (iv) due to its using in Gyro-astro compasses, or devices that derive position or orientation by means of automatically tracking celestial bodies or satellites.

(5)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 15 (v)-2 of the appended table of the Foreign Exchange Order falls under any of the following:

(i)programs designed to enable the equipment to fall under Article 10, item (vii) by using underwater sonar navigation systems;

(ii)programs that enable the equipment to fall under Article 10, item (vii) by continuously combining the heading data and the navigation data which falls under any of the following and using them in underwater sonar navigation systems (limited to those with source code):

(a)speed data from sonars that utilize Doppler effects;

(b)navigation data from GPS or Glonass;

(c)data from data-based referenced navigation systems.

(6)The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 15 (vi) of the appended table of the Foreign Exchange Order is technology that falls under any of the following:

(i)the technology (excluding programs) necessary for the design or manufacture of gas turbine engine components that fall under any of the following:

(a)gas turbine blades, vanes, or tip shrouds cast by unidirectional solidification or single crystal alloy methods, the stress breakage time of which is 400 hours or more when a load that generates a 200 megapascals stress is applied in the vertical direction to the single crystal at 1,000 degrees centigrade;

(b)components that use organic composite materials and are designed for use exceeding 315 degrees centigrade;

(ii)programs necessary for design of the technology that falls under the preceding item.

Article 28The technology specified by the Order of the Ministry of Economy, Trade and Industry in row 16 of the appended table of the Foreign Exchange Order is technology exclusively pertaining to the design, manufacture or use of goods that exclusively fall under Class 25 through Class 40, Class 54 through 59, Class 63, Class 68 through Class 93, or Class 95 of the appended table of Custom Tariff Act (Act No. 54 of 1910).

Supplementary Provisions

This Ministerial Order comes into effect as of November 14, 1991.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 12 of March 27, 1992]

This Ministerial Order comes into effect as of April 1, 1992.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 85 of December 9, 1992]

(1)This Ministerial Order comes into effect as of December 31, 1992.

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 30 of June 18, 1993]

This Ministerial Order comes into effect as of July 16, 1993; provided, however, that the revised provisions of Article 3 and Article 16, paragraph (2) come into effect as from July 1, 1993.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 85 of December 1, 1993]

(1)The provisions of Article 1 in this Ministerial Order come into effect as of the date of promulgation, and the provisions of Article 2 come into effect as of December 22, 1993.

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 3 of January 28, 1994]

This Ministerial Order comes into effect as of the date of promulgation.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 10 of March 14, 1994]

(1)This Ministerial Order comes into effect as of March 28, 1994; provided, however, that the revised provisions of Article 2, the revised provisions of Article 7 (in item (iii), (ii) of the same Article, "equipment that corresponds to any of the following" is revised to "equipment the composite theoretical performance of which exceeds 260 mega calculations per seconds by aggregating calculation elements", and except for the part that deletes 1. and 2.) and the revised provisions of Article 8 come into effect as of the date of promulgation.

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 49 of June 24, 1994]

(1)This Ministerial Order comes into effect as of July 6, 2004; provided, however, that the revised provisions of Article 7 (limited to the part deleting item (v) and item (vi) of the same Article) and the revised provisions of Article 20 (excluding the part deleting paragraph (1), item (v) through item (ix) of the same Article) come into effect as of the date of promulgation.

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 2 of February 27, 1995]

(1)This Ministerial Order comes into effect as of the date of promulgation.

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 43 of May 10, 1995]

(1)This Ministerial Order comes into effect as of May 22, 1995.

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 106 of December 20, 1995]

(1)This Ministerial Order comes into effect as of January 3, 1996; provided, however, that the revised provisions of Article 1, the revised provisions of Article 2-2 (limited to the parts in which "Fresh vaccine ingredients" in paragraph (1), item (i) and item (ii) of the same Article is revised to "vaccine" and "(excluding immune toxin)" is added under "toxin" in item (iii) of the same Article), and the revised provisions of Article 5, the revised provisions of Article 15 and the revised provisions of Article 18 come into effect as of the date of promulgation.

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 18 of March 28, 1996]

This Ministerial Order comes into effect as of October 1, 1996.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 60 of August 28, 1996][Extract]

(Effective date)

(1)This Ministerial Order comes into effect as of September 13, 1996.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 65 of April 3, 1997]

This Ministerial Order comes into effect as of April 29, 1997.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 9 of March 12, 1998]

This Ministerial Order comes into effect as of April 1, 1998.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 13 of March 25, 1998]

(Effective Date)

(1)This Ministerial Order comes into effect as of April 1, 1998.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 78 of August 26, 1998]

(Effective Date)

(1)This Ministerial Order comes into effect as of the date of promulgation.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 83 of November 5, 1998]

This Ministerial Order comes into effect as of November 12, 1998.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 64 of June 18, 1999]

(Effective Date)

(1)This Ministerial Order comes into effect as of the date of promulgation; provided, however, that the provisions listed in each of the following those come into effect as from the date to be determined for each item:

(i)the revised provisions of Article 1, the revised provisions of Article 4, item (ix), the revised provisions of Article 5, item (vii), the revised provisions to Article 6, item (xvii), (a) and (f), the revised provisions of Article 9, item (x), (b), the revised provisions of Article 14-2, item (ii), the revised provisions of Article 19, paragraph (3) and paragraph (5), the revised provisions of Article 21, paragraph (1), item (x)-2, item (xi)-2, item (xiii) and item (xv) and paragraph (2), item (iv), item (iv)-2 and item (xi) of the same Article, the revised provisions of the appended table 3:July 2, 1999;

(ii)the revised provisions of Article 2, paragraph (1) and the additional provisions from Article 14-2, item (li)-2 through item (li)-4:July 18, 1999.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 115 of June 23, 2000]

(Effective Date)

(1)This Ministerial Order comes into effect as of July 7, 2000; provided, however, that the following comes into effect as of the date of promulgation: the revised provisions of Article 1, item (viii), item (ix), item (xi), item (xiv), item (xviii), item (xxi), item (xxii), item (xxiv), (a) and (c), item (xxvii) and item (xxxiii); the revised provisions of item (xxxiv) of the same Article (limited to the part in which "those that are 75 millimeters or more" in (a), 1. and (b), 2. of the same item is revised to "those that exceed 75 millimeters"); the revised provisions of item (xxxv), item (xxxvi), item (xxxviii), item (xl), item (xliv) and also item (lvii) of the same Article, Article 3, item (vii), (e), item (xvi), (a) and (g), item (xx) and item (xxii); the revised provisions of Article 6, item (i) (excluding the part in which "parallel processors" in (c), 3. of the same item is revised to "devices designed for parallel processors"); and the revised provisions of item (ii), (b), item (iv) and item (viii) of the same Article, Article 7, Article 8, Article 9, item (i), (a), Article 12, Article 13, item (v), Article 14, item (v) and item (vi), (a) and (d), Article 14-2, item (lxxiv), Article 19, Article 20 and Article 21; and the revised provisions of Article 25 (limited to the part in which paragraph (3), item (ii), (j) of the same Article is deleted and (k) is changed to (j) and (l) is changed to (k)).

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 265 of October 31, 2000]

This Ministerial Order comes into effect as of January 6, 2001.

Supplementary Provisions[Order of the Ministry of International Trade and Industry No. 408 of December 27, 2000]

(Effective date)

(1)This Ministerial Order comes into effect as of the date of promulgation.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 163 of May 16, 2001]

(Effective date)

(1)This Ministerial Order comes into effect as of the date or promulgation; provided, however, that Article 1, item (x), (b), Article 2-2), Article 4, Article 5, item (ii), (b), item (viii) and item (x), Article 6, item (ii), item (v), item (xvii) and item (xviii); the revised provisions of Article 9, item (viii) (excluding the part in which "built-in devices" in (b), 6. of the same item is revised to "built-in video cameras"); the revised provisions of Article 10, Article 21, paragraph (2), item (iii)-2, (d) and item (xvi) of the comments of the appended table 3 come into effect as of May 30, 2001.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 247 of December 28, 2001]

(Effective date)

(1)This Ministerial Order comes into effect as of April 1, 2002.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 85 of June 14, 2002]

(Effective date)

(1)This Ministerial Order comes into effect as of July 15, 2002.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 108 of October 21, 2002]

(Effective date)

(1)This Ministerial Order comes into effect as of November 1, 2002; provided, however, that the revised provisions of Article 2 come into effect as of January 1, 2003.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to any acts committed prior to the enforcement of this Ministerial Order, provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 52 of April 1, 2003]

This Ministerial Order comes into effect as of the date of promulgation.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 159 of December 24, 2003]

(Effective date)

(1)This Ministerial Order comes into effect as of January 20, 2004.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 104 of November 10, 2004]

(Effective date)

(1)This Ministerial Order comes into effect as of January 1, 2005.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 116 of December 2, 2005]

(Effective date)

(1)This Ministerial Order comes into effect as of January 1, 2006.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 97 of November 17, 2006]

This Ministerial Order comes into effect as of January 1, 2007.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 21 of March 26, 2008]

(Effective Date)

(1)This Ministerial Order comes into effect as of May 15, 2008.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 55 of August 27, 2008]

This Ministerial Order comes into effect as of November 1, 2008.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 46 of August 28, 2009]

This Ministerial Order comes into effect as of October 1, 2009.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 6 of March 5, 2010]

(Effective Date)

Article 1This Ministerial Order comes into effect as of April 1, 2010.

(Transitional Measures)

Article 2With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Article 3(1)Forms prior to revision by this Ministerial Order (excluding forms of the Ministerial Order Specifying the Forms of the Identification Provided for in Article 68, paragraph (2) of the Foreign Exchange and Foreign Trade Act) are, for the time being, deemed to be the forms revised by this Ministerial Order.

(2)Documents based on the forms of the Ministerial Order Specifying the Forms of the Identification Provided for in Article 68, paragraph (2) of the Foreign Exchange and Foreign Trade Act prior to the revision by this Ministerial Order and which are actually in existence at the time of the enforcement of this Ministerial Order, are deemed to be those based on the forms of the Ministerial Order Specifying the Forms of the Identification Provided for in Article 68, paragraph (2) of the Foreign Exchange and Foreign Trade Act revised by this Ministerial Order.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 26 of May 18, 2011]

(Effective Date)

Article 1This Ministerial Order comes into effect as of July 1, 2011.

(Transitional Measures pertaining to Penal Provisions)

Article 2With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 56 of July 19, 2012]

(Effective Date)

(1)This Ministerial Order comes into effect as of August 1, 2012.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 51 of September 27, 2013]

(Effective Date)

(1)This Ministerial Order comes into effect as of October 15, 2013.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Supplementary Provisions[Order of the Ministry of Economy, Trade and Industry No. 41 of August 14, 2014]

(Effective Date)

(1)This Ministerial Order comes into effect as of September 15, 2014.

(Transitional Measures pertaining to Penal Provisions)

(2)With regard to the application of penal provisions to acts committed prior to the enforcement of this Ministerial Order, the provisions then in force remain applicable.

Appended Table No. 1

Deleted

Appended Table (Re: Articles 10 and 12)

Argentina, Australia, Austria, Belgium, Bulgaria, Canada, Croatia, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Republic of Korea, Latvia, Lithuania, Luxembourg, Malta, Mexico, The Netherlands, New Zealand, Norway, Poland, Portugal, Romania, Russia, Slovenia, the Republic of South Africa, Spain, Slovakia, Sweden, Switzerland, Turkey, Ukraine, United Kingdom, United States of America

Appended Table 3 (related to Articles 5 and 18)

	Coating Method	Base Material	Coating
1	Method of fixing the coating material generated by chemical reaction of raw material gas onto the base material surface.	Super alloy	Aluminum compounds
		Ceramics or low-thermal expansion glasses	Silicon compounds, carbides, dielectric film, diamonds and non-crystalline diamond-like carbon films
		Composite material using carbon and carbon fibers (referred to hereinafter as "carbon-carbon"), ceramic composites and metal matrix composites	Silicon compounds, carbides, refractory metals, and mixtures combining thereof; dielectric film, aluminum compounds, aluminum alloy compounds and boron nitride
		Tungsten carbide alloys and silicon carbide	Carbides, tungsten, mixtures of carbides and tungsten, and dielectric film
		Molybdenum and molybdenum alloys	Dielectric film
		Beryllium and beryllium alloys	Dielectric film, diamonds and non-crystalline diamond-like carbon films
		Sensor window material	Dielectric film, diamonds and non-crystalline diamond-like carbon films
2	Method of fixing coating material volatilized by electronic beam onto the base material surface	Super alloys	Silicon alloy compounds, aluminum alloy compounds, chromium-aluminum alloy compounds, improved zirconia, silicon compounds, aluminum compounds and mixtures combining thereof
		Ceramics or low-thermal expansion glasses	Dielectric film
		Alloy steel with corrosion resistance	Chromium-aluminum alloys, improved zirconia and mixtures of chromium-aluminum alloys and improved zirconia
		Carbon-carbon, ceramic composites and metal matrix composites	Silicon compounds, carbides, refractory metals, and mixtures combining thereof; dielectric film and boron nitride
		Tungsten carbide alloys and silicon carbide	Carbides, tungsten, mixtures of carbides and tungsten, and dielectric film
		Molybdenum and molybdenum alloys	Dielectric film
		Beryllium and beryllium alloys	Dielectric film, boron alloys and beryllium
		Sensor window material	Dielectric film
		Titanium alloys	Boron compounds and nitrides
3	Method of fixing coating material volatilized by electric resistance heating onto the base material surface (Method of ion plating)	Ceramics or low-thermal expansion glasses	Dielectric film and non-crystalline diamond-like carbon film
		Carbon-carbon, ceramic composites and metal matrix composites	Dielectric film
		Tungsten carbide alloys and silicon carbide	Dielectric film
		Molybdenum and molybdenum alloys	Dielectric film
		Beryllium and beryllium alloys	Dielectric film
		Sensor window material	Dielectric film and non-crystalline diamond-like carbon film
4	Method of fixing coating material volatilized by laser onto the base material surface	Ceramics or low-thermal expansion glasses	Silicon compounds, dielectric film and non-crystalline diamond-like carbon film
		Carbon-carbon, ceramic composites and metal matrix composites	Dielectric film
		Tungsten carbide alloys and silicon carbide	Dielectric film
		Molybdenum and molybdenum alloys	Dielectric film
		Beryllium and beryllium alloys	Dielectric film
		Sensor window material	Dielectric film and non-crystalline diamond-like carbon film
5	Method of fixing coating material volatilized by arc discharge onto the base material surface	Super alloys	Silicon alloy compounds, aluminum alloy compounds and chromium-aluminum alloys
5		Composite material with polymer or organic compound matrix	Boron compounds, carbides, nitrides and non-crystalline diamond-like carbon film
6	Method of fixing the coating material onto the base material surface by placing powdered coating material and the base material into a container and heating to 757 degrees centigrade or more	Carbon-carbon, ceramic composites or metal matrix composites	Silicon compounds, carbides and mixtures of silicon compounds and carbides
		Titanium alloys	Silicon compounds, aluminum compounds and aluminum alloy compounds
		Metals and metal alloys with fire resistance	Silicon compounds and oxides
7	Method using plasma spray coating	Super alloys	Chromium-aluminum alloys, improved zirconia, mixtures of chromium-aluminum alloys and improved zirconia, nickel-graphite alloys capable of being polished, substances containing nickel-chromium-aluminum capable of being polished, and aluminum-silicon polyester alloys and aluminum alloy compounds capable of being polished
		Aluminum alloys	Chromium-aluminum alloys, improved zirconia, silicon compounds and mixtures combining thereof
		Metals and metal alloys with fire resistance	Aluminum compound, silicon compounds and carbides
		Alloy steel with corrosion resistance	Chromium-aluminum alloys, improved zirconia and mixtures of chromium-aluminum alloys and improved zirconia
		Titanium alloys	Carbides, aluminum compounds, silicon compounds, aluminum alloy compounds, nickel-graphite alloys capable of being polished, substances containing nickel-chromium-aluminum capable of being polished, and aluminum-silicon polyester alloys capable of being polished
8	Method of fixing slurried coating material onto the surface of base material	Metals and metal alloys with fire resistance	Molten silicon compounds and molten aluminum compounds
8		Carbon-carbon, ceramic composites and metal matrix composites	Silicon compounds, carbides and mixtures of silicon compounds and carbides
9	Method of spattering	Super alloys	Silicon alloy compounds, aluminum alloy compounds, aluminum compounds containing precious metals, chromium-aluminum alloys, improved zirconia, platinum and mixtures combining thereof
		Ceramics or low-thermal expansion glasses	Silicon compounds, platinum, mixtures of silicon compounds and platinum, dielectric film and non-crystalline diamond-like carbon film
		Titanium alloys	Boron compounds, nitrides, oxides, silicon compounds, aluminum compounds, aluminum alloy compounds and carbides
		Carbon-carbon, ceramic composites and metal matrix composites	Silicon compounds, carbides, refractory metals and mixtures combining thereof; dielectric film and boron nitride
		Tungsten carbide alloys and silicon carbide	Carbides, tungsten and mixtures of carbides and tungsten; dielectric film and boron nitride
		Molybdenum and molybdenum alloys	Dielectric film
		Beryllium and beryllium alloys	Boron compounds, dielectric film and beryllium
		Sensor window material	Dielectric film and non-crystalline diamond-like carbon film
		Metals and metal alloys with fire resistance	Aluminum compounds, silicon compounds, oxides and carbides
10	Method of ion implantation	High temperature bearing steel	Chromium, tantalum and niobium additives
		Titanium alloys	Boron compounds and nitrides
		Beryllium and beryllium alloys	Boron compounds
		Tungsten carbide alloys	Carbides and nitrides

Notes

(i)Coating method includes coating repair and refurbishing as well as original coating.

(ii)Alloyed aluminide coating includes single or multiple-step coatings in which an element or elements are deposited to coating prior to application of the aluminide coating; provided, however, that the multiple use of a method of fixing the coating material onto the surface of base metal by placing powdered coating material and the base material into a container and heating to 757 degrees centigrade or more, to achieve alloyed aluminides, is not included in aluminum alloy compound coating.

(iii)Noble metal modified aluminide coating includes multiple-step coatings in which the noble metal or noble metals are laid down by some other coating process prior to application of the aluminide coating.

(iv)The term "mixture" means impregnated material, graded compositions, co-deposits and multilayer deposits which are obtained by the coating methods specified in this table.

(v)The term "Chromium-aluminum alloy coating" means a coating alloy including cobalt, iron, nickel or combinations thereof, as well as hafnium, yttrium, silicon, tantalum in any amount or other intentional additions over 0.01 % by weight in various proportions and combinations; provided, however, that coatings falling under any of the following (a) through (c) are excluded:

(a)alloy coatings consisting of cobalt, chromium, aluminum and yttrium which contain less than 22 % by weight of chromium, less than 7 % by weight of aluminum and less than 2 % by weight of yttrium;

(b)alloy coatings consisting of cobalt, chromium, aluminum and yttrium which contain 22 % or more and 24 % or less by weight of chromium, 10 % or more and 12 % or less by weight of aluminum and 0.5 % or more and 0.7 % or less by weight of yttrium; or

(c)alloy coatings consisting of nickel, chromium, aluminum and yttrium which contain 21 % or more and 23 % or less by weight of chromium, 10 % or more and 12 % or less by weight of aluminum and 0.9 % or more and 1.1 % or less by weight of yttrium.

(vi)The term "aluminum alloy substrate" means alloys having an ultimate tensile strength of 190 megapascals or more measured at 20 degrees centigrade.

(vii)The term "alloy steel with corrosion resistance" means AISI (American Iron and Steel Institute) 300 series or equivalent national standard steels.

(vii)-2Metals and metal alloys with fire resistance include niobium, molybdenum, tungsten and tantalum or alloys of these metals.

(viii)The term "sensor window materials" means alumina, silicon, germanium, zinc sulphide, zinc selenide, gallium arsenide, diamond, gallium phosphide, or sapphire, or those consisting of metal halides which are zirconium fluoride and hafnium fluoride, with more than a 40 mm diameter

(ix)The method of fixing the coating material onto the surface of the base metal by placing powdered coating material and the base material into a container and heating to 757 degrees centigrade or more does not include the single-step coating method of solid airfoils.

(x)The term "polymers" means polyimide, polyester, polysulphide, polycarbonates and polyurethanes.

(xi)The term "improved zirconia" means zirconia whose crystallographic phases and phase compositions have been stabilized, by the additions of calcium oxide, magnesium oxide, yttrium oxide, hafnium oxide, rare earth oxide and other metal oxides to zirconia; provided, however, that thermal barrier coatings made of zirconia, modified with calcium oxide or magnesium oxide, are excluded.

(xii)The term "titanium alloy substrate" means aerospace alloys having an ultimate tensile strength of 900 megapascals or more measured at 20 degrees centigrade.

(xiii)The term "low-thermal expansion glasses" means glasses which have a coefficient of a thermal expansion of 0.0000001 or less measured at 20 degrees centigrade.

(xiv)The term "dielectric film" means dielectric film with four layers or film made of metal composite material.

(xv)The term "tungsten carbide alloy substrate" does not include cutting and plastic forming tool materials consisting of alloys consisting of tungsten carbide and cobalt or nickel, alloys consisting of titanium carbide and cobalt or nickel, alloys consisting of chromium carbide and nickelchromium, and alloys consisting of chromium carbide and nickel.

(xvi)Coatings on non-crystalline diamond-like carbon films do not include coatings on magnetic disk drives, magnetic heads, equipment for the manufacture of disposables, valves for faucets, acoustic diaphragms for speakers, engine parts for automobiles, cutting tools, punching-pressing dies, office automation equipment, microphones or medical devices or molds, for casting or molding of plastics, manufactured from alloys containing less than 5% beryllium.

(xvii)Silicon carbide substrates do not include cutting and plastic forming tool materials.

(xviii)Ceramic substrates do not include ceramic materials containing 5 % or more by weight of a clay or cement content (including the compounds thereof).